Title:
INJECTION MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/075444
Kind Code:
A1
Abstract:
The present invention is intended to increase the working efficiency of injection molding while reducing the size of an injection molding device. The present invention has: a quadrangular frame 15; a turntable 5 provided on the frame 15; a first die 6, a second die 7, and a third die 8 positioned on the turntable 5; and a first movable plate 17, a second movable plate 18, and a third movable plate 19 to which are provided a fourth die 9, a fifth die 10, and a sixth die 11 which are opened and closed with the first die 6, the second die 7, and the third die 8. The present invention furthermore has first, second, and third injection devices for injecting a resin into the dies, and a first robot 31 for carrying a workpiece in and out with respect to the dies, the first movable plate 17, the second movable plate 18, and the third movable plate 19 being supported so as to be able to move up and down, and the first robot 31 being provided in at least one corner among four corners of the frame 15.
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Inventors:
OZAWA MASATO (JP)
OIKAWA HITOSHI (JP)
TSUCHIYA KATSUMI (JP)
FUJIU MASARU (JP)
SHIROTA NAOYUKI (JP)
UMEZAWA TAKAO (JP)
OIKAWA HITOSHI (JP)
TSUCHIYA KATSUMI (JP)
FUJIU MASARU (JP)
SHIROTA NAOYUKI (JP)
UMEZAWA TAKAO (JP)
Application Number:
PCT/JP2020/038698
Publication Date:
April 22, 2021
Filing Date:
October 14, 2020
Export Citation:
Assignee:
MITSUBA CORP (JP)
International Classes:
B29C45/06; B29C45/14; B29C45/26
Foreign References:
| JPH07285146A | 1995-10-31 | |||
| JPH11202452A | 1999-07-30 | |||
| CN208529566U | 2019-02-22 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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