Title:
INK COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/004956
Kind Code:
A1
Abstract:
Provided is an ink composition with which it is possible to form a sintered body (conductor wiring, joint structure, etc.) capable of suppressing joint strength reduction due to a thermal shock. An ink composition according to the present invention comprises metal particles and a solvent, wherein the metal particles include metal nanoparticles having a particle size of 1-100 nm, metal submicrometer particles having a particle size of 101-1,000 nm, and metal micrometer particles having a particle size of 1,001-10,000 nm, the mass ratio (micrometer particles/submicrometer particles) of the metal micrometer particles to the metal submicrometer particles is less than 1.00, and the content ratio of the metal nanoparticles in the metal particles is not less than 8 mass%.
Inventors:
SHIMOYAMA AKIO (JP)
HISHIDA MASAHIRO (JP)
HISHIDA MASAHIRO (JP)
Application Number:
PCT/JP2023/023646
Publication Date:
January 04, 2024
Filing Date:
June 26, 2023
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
B22F1/052; B22F1/00; B22F1/054; B22F1/065; B22F1/068; B22F1/102; B22F1/17; B22F7/08; B22F9/00
Domestic Patent References:
| WO2019111795A1 | 2019-06-13 |
Foreign References:
| JP2015211092A | 2015-11-24 | |||
| JP2021127505A | 2021-09-02 | |||
| JP2010109334A | 2010-05-13 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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