Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
INORGANIC MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2022/113464
Kind Code:
A1
Abstract:
Provided is an inorganic molded body that is less likely to be thermally deformed at high temperature. The inorganic molded body includes alumina fiber with an alumina content of more than 60 mass%, alumina particles, and inorganic binder, wherein a refractory ceramic fiber is not substantially included, and thus an amount of thermal creep is reduced.

Inventors:
MORITA HIROKI (JP)
YONAIYAMA KEN (JP)
Application Number:
PCT/JP2021/032543
Publication Date:
June 02, 2022
Filing Date:
September 03, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NICHIAS CORP (JP)
International Classes:
F27D1/00; C04B35/80; D04H1/4209; D21H13/36; F16L59/00
Domestic Patent References:
WO2007052338A12007-05-10
Foreign References:
JP2010159190A2010-07-22
JPH09208318A1997-08-12
JP2018199879A2018-12-20
JPH03247556A1991-11-05
Other References:
ANONYMOUS: "Alumina fiber application products", NICHIAS GIJUTSU JIHO, no. 4 (387), 10 October 2019 (2019-10-10), pages 8 - 12, XP055934744, ISSN: 0288-7991
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
Download PDF:



 
Previous Patent: POSITION DETECTION DEVICE

Next Patent: MOLDED BODY