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Title:
INORGANIC PARTICLES, INORGANIC PARTICLE MANUFACTURING METHOD, COMPOSITION, AND ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/209784
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing inorganic particles with which superior fluidity is achieved in a composition obtained by combining said inorganic particles with a resin or a precursor thereof, superior thermal conductivity is achieved in a cured product obtained by curing said composition, and superior insulation reliability is achieved in said cured product. In addition, the present invention addresses the problem of providing an inorganic particle manufacturing method, a curable composition, and an electronic device manufacturing method. The inorganic particles according to the present invention each have a core part and a shell part and are spherical, wherein: the core part contains at least one substance selected from the group consisting of silicon dioxide, aluminum oxide, aluminum nitride, and copper; the shell part contains boron nitride; and the iron atom content of the shell part is equal to or less than 10 ppm by mass with respect to the total mass of the shell part.

Inventors:
TOMIZAWA HIDEKI (JP)
Application Number:
PCT/JP2022/011049
Publication Date:
October 06, 2022
Filing Date:
March 11, 2022
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C01B33/18; B22F1/00; B22F1/145; B22F1/16; C01B13/14; C01B21/072; C01F7/021; C08K3/00; C08K9/06; C08L101/00; C23C16/38; C01B21/064
Domestic Patent References:
WO2019189794A12019-10-03
Foreign References:
CN110694559A2020-01-17
CN112409757A2021-02-26
JP2016192474A2016-11-10
Other References:
WEISZMANTEL, E. PFEIFER, T. RICHTER, F.: "Electron microscopic analysis of cubic boron nitride films deposited on fused silica", THIN SOLID FILMS, vol. 408, no. 1-2, 3 April 2002 (2002-04-03), AMSTERDAM, NL , pages 1 - 5, XP004351334, ISSN: 0040-6090, DOI: 10.1016/S0040-6090(02)00092-5
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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