Title:
INSERT MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/061397
Kind Code:
A1
Abstract:
An insert molding method comprises: a step of arranging an insert component (20) inside a mold (130); a step of positioning the insert component (20) at a prescribed position inside the mold (130) with positioning pins (111, 121), in a state in which the mold (130) is set to have a gap wider than the gap when in a molding position; a step of injecting resin (R) into the mold (130) in which the insert component (20) has been positioned; and, after injecting the resin (R) into the mold (130), a step of pulling out the positioning pins (111, 121) while compressing the resin (R) inside the mold (130) so that the gap in the mold (130) becomes the gap when in the molding position. The present invention thus provides an insert molding method in which an entire insert component is covered with resin so as not to be exposed, thereby making it possible to prevent breaking or peeling of the resin and improve weather resistance.
Inventors:
ICHIKAWA NOBUYASU (JP)
TSUCHIKAWA SHUUHEI (JP)
TSUCHIKAWA SHUUHEI (JP)
Application Number:
PCT/JP2017/025103
Publication Date:
April 05, 2018
Filing Date:
July 10, 2017
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
International Classes:
B29C45/14; B29C33/12; B29C45/56
Foreign References:
| JPH11254449A | 1999-09-21 | |||
| JP2015231703A | 2015-12-24 | |||
| JPH11207749A | 1999-08-03 | |||
| JPH05185466A | 1993-07-27 | |||
| JP2007076081A | 2007-03-29 | |||
| JP2006142729A | 2006-06-08 | |||
| JP2008132756A | 2008-06-12 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
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