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Patent Searching and Data


Title:
INSPECTION METHOD, METHOD FOR MANUFACTURING COMPOSITION, AND METHOD FOR VERIFYING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/102375
Kind Code:
A1
Abstract:
The present invention provides an inspection method for readily measuring ultra-small foreign matter in a composition selected from the group consisting of an active-ray-sensitive or radiation-sensitive composition and a thermosetting composition. The present invention also provides a method for manufacturing a composition and a method for verifying a composition, in which the abovementioned inspection method is used. The inspection method is a method for inspecting a composition selected from the group consisting of an active-ray-sensitive or radiation-sensitive composition and a thermosetting composition. The inspection method includes: a step X1 for forming a film by applying the abovementioned composition to a substrate X; a step X2 for removing the film from the substrate X by using a removal solvent containing an organic solvent; and a step X3 for measuring the number of defects on the substrate X after the removal of the film by using a defect inspection device. When the abovementioned composition is an active-ray-sensitive or radiation-sensitive composition, the abovementioned step X2 is applied in a state where the film has not been subjected to exposure treatment by means of irradiation with active rays or radiation. When the abovementioned composition is a thermosetting composition, the abovementioned step X2 is applied in a state where the film has not been subjected to thermosetting treatment.

Inventors:
SUGIYAMA SHINICHI (JP)
NAKAMURA TAKASHI (JP)
Application Number:
PCT/JP2021/039129
Publication Date:
May 19, 2022
Filing Date:
October 22, 2021
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/26; G01N21/956; G03F7/38; H01L21/027
Foreign References:
JPS60177624A1985-09-11
JP2003031488A2003-01-31
JP2010118550A2010-05-27
Attorney, Agent or Firm:
YONEKURA Junzo et al. (JP)
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