Title:
INSTALLATION SUBSTRATE, METHOD OF MOUNTING INSTALLATION SUBSTRATE, AND BULB SOCKET USING INSTALLATION SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2002/017693
Kind Code:
A1
Abstract:
An installation substrate, comprising a substrate (51), a holding member (53) installed on the upper surface of the substrate (51), and a part (304) held by the holding member (53), wherein the part (304) is disposed, at least partly, under the lower surface of the substrate (51) and electrically connected to the substrate (51) through the holding member (53) and, because not connected to the substrate with a lead, a discharge gap need not be installed on the upper part of the substrate, whereby taller parts can be used because the height of the substrate can be reduced.
Inventors:
MINAMI FUMIHIRO (JP)
YAMASAKI YUKARI (JP)
SEKIYA MUTSUO (JP)
YAMASAKI YUKARI (JP)
SEKIYA MUTSUO (JP)
Application Number:
PCT/JP2001/007098
Publication Date:
February 28, 2002
Filing Date:
August 17, 2001
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
MINAMI FUMIHIRO (JP)
YAMASAKI YUKARI (JP)
SEKIYA MUTSUO (JP)
MINAMI FUMIHIRO (JP)
YAMASAKI YUKARI (JP)
SEKIYA MUTSUO (JP)
International Classes:
H01R33/76; H01R33/945; H05K3/30; H01R33/975; (IPC1-7): H05K1/18; H05K3/34; H01R12/04; H05B41/02; F21S8/10
Foreign References:
| JPS62134224U | 1987-08-24 | |||
| JPS61100175U | 1986-06-26 | |||
| JPH07114805A | 1995-05-02 | |||
| JPH04271188A | 1992-09-28 |
Attorney, Agent or Firm:
Tazawa, Hiroaki (Kasumigaseki 3-chome. Chiyoda-ku, Tokyo, JP)
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