Title:
INSTRUMENT PANEL AND METHOD FOR MANUFACTURING INSTRUMENT PANEL
Document Type and Number:
WIPO Patent Application WO/2020/031727
Kind Code:
A1
Abstract:
Provided are: an instrument panel capable of stably deploying a deployment part; and a method for manufacturing the instrument panel. An instrument panel (10) is provided with: a base part (12); and a deployment part (14) which is surrounded by the base part (12), faces an air bag (20), and includes a tear line (15), wherein a slit structure (34) including a plurality of slits (32) arranged so as to surround the tear line (15) is formed in the deployment part (14).
Inventors:
MORIIZUMI TAIKI (JP)
HANAOKA ATSUSHI (JP)
SAKAGUCHI MITSUAKI (JP)
HANAOKA ATSUSHI (JP)
SAKAGUCHI MITSUAKI (JP)
Application Number:
PCT/JP2019/029277
Publication Date:
February 13, 2020
Filing Date:
July 25, 2019
Export Citation:
Assignee:
HONDA MOTOR CO LTD (JP)
International Classes:
B60K37/00; B60R21/205
Domestic Patent References:
| WO2018061905A1 | 2018-04-05 |
Foreign References:
| JP2018020702A | 2018-02-08 | |||
| JP2006188134A | 2006-07-20 | |||
| JP2014113883A | 2014-06-26 | |||
| US20160159309A1 | 2016-06-09 |
Attorney, Agent or Firm:
CHIBA Yoshihiro et al. (JP)
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