Title:
INSULATED CHIP AND SIGNAL TRANSMITTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/171391
Kind Code:
A1
Abstract:
This transformer chip includes an element insulating layer and a high-voltage coil and a low-voltage coil embedded in the element insulating layer. The high-voltage coil includes a first end face facing the low-voltage coil side in the z-direction, a second end face opposite the first end face, and a first side face. The element insulating layer includes a third insulating layer, a second insulating layer laminated on the third insulating layer and having a higher relative dielectric constant than the third insulating layer, and a first insulating layer laminated on the second insulating layer and having a lower relative dielectric constant than the second insulating layer. The high-voltage coil is provided within the first insulating layer with the first end face in contact with the second insulating layer.
Inventors:
TANAKA BUNGO (JP)
Application Number:
PCT/JP2023/006472
Publication Date:
September 14, 2023
Filing Date:
February 22, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L27/04; H01F17/00; H01F19/04; H01F27/32; H01L21/768; H01L21/822; H01L23/532; H01L25/04; H01L25/18
Domestic Patent References:
| WO2014112179A1 | 2014-07-24 | |||
| WO2016080034A1 | 2016-05-26 |
Foreign References:
| JP2021150579A | 2021-09-27 | |||
| US20110241160A1 | 2011-10-06 |
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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