INSULATING ADHESIVE COMPOSITION FOR METAL-BASED COPPER CLAD LAMINATE (MCCL), COATED METAL PLATE USING SAME, AND METHOD FOR MANUFACTURING SAME

Title:

INSULATING ADHESIVE COMPOSITION FOR METAL-BASED COPPER CLAD LAMINATE (MCCL), COATED METAL PLATE USING SAME, AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2013/100502

Kind Code:

A1

Abstract:

The present invention relates to an insulating adhesive composition for a metal printed circuit board, an adhesive-coated metal plate using same, and a method for manufacturing the coated metal plate. The adhesive composition according to the present invention forms an adhesive layer which is excellent in terms of adhesion to a copper foil, electrical insulating properties, and heat resistance. The composition contains a certain epoxy resin, a hardening agent, and alumina. Also, according to the present invention, in coating the metal plate with the solvent-type adhesive, a roll coating method is used to perform continuous coating on the metal plate, and therefore productivity is improved when compared to a generally used method in which a sheet-type adhesive film is used.

Inventors:

PARK CHAN SUP (KR)
CHO RAE-HONG (KR)
KIM DONG HYON (KR)
PARK KYUNG HO (KR)
HAN SANG-KWON (KR)
PARK CHONG SOO (KR)
LEE BAE GEUN (KR)
KIM JUNG BONG (KR)
HAN JAE MAN (KR)
SHIN TAE KYOO (KR)
BAE DAE CHUL (KR)

Application Number:

PCT/KR2012/011310

Publication Date:

July 04, 2013

Filing Date:

December 21, 2012

Export Citation:

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Assignee:

POSCO (KR)
POSCO COATEDCOLOR STEEL CO LTD (KR)
KUK DO CHEMICAL CO LTD (KR)

International Classes:

C09J7/00; C09J163/00; C09J11/04; C23C26/00

Foreign References:

KR100584847B1	2006-11-30
KR101076977B1	2011-10-26
KR20110040704A	2011-04-20
KR19980059108A	1998-10-07
KR20110111236A	2011-10-10

Other References: