Title:
INSULATING FILM FOR BUS BAR AND BUS BAR
Document Type and Number:
WIPO Patent Application WO/2020/053747
Kind Code:
A1
Abstract:
The present invention provides: a bus bar insulating film that is adhered through brief heating and exerts excellent adhesive power with respect to metal; and a bus bar equipped with such a film. More specifically, the present invention pertains to: a bus bar insulating film that is to be bonded to the surface of a bus bar and that is characterized by having a base material layer and an adhesive layer, wherein the base material layer contains a resin as a formation material, the adhesive layer contains a phenolic resin (A), and, in a voltage tolerance test, the film is confirmed not to allow current to pass therethrough even at an average field intensity of 5 kV/mm; and a bus bar equipped with such an insulating film.
Inventors:
TAKEI KUNIHIRO (JP)
IIZUKA HIROKAZU (JP)
IIZUKA HIROKAZU (JP)
Application Number:
PCT/IB2019/057601
Publication Date:
March 19, 2020
Filing Date:
September 10, 2019
Export Citation:
Assignee:
FUJIMORI KOGYO CO (JP)
International Classes:
H01B17/56; B32B27/42; C09J7/35; C09J11/06; C09J161/06; H01B3/30; H01B7/00; H05K1/03; H02K3/38
Domestic Patent References:
| WO2017175397A1 | 2017-10-12 |
Foreign References:
| JP2011046196A | 2011-03-10 |
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