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Title:
INSULATING MATERIAL MOLDED BODY FOR ARC SUPPRESSION, CIRCUIT BREAKER, METHOD FOR PRODUCING MIXED FILLER, AND METHOD FOR PRODUCING INSULATING MATERIAL MOLDED BODY FOR ARC SUPPRESSION
Document Type and Number:
WIPO Patent Application WO/2022/003769
Kind Code:
A1
Abstract:
The purpose of the present invention is to achieve an insulating material molded body (10) for arc suppression, said insulating material molded body being capable of suppressing decrease in the surface insulation performance when exposed to an arc in comparison to the prior art without being reduced in the amount of a thermal decomposition gas generated during the exposure to an arc in comparison to the prior art. An insulating material molded body (10) for arc suppression according to the present disclosure comprises: a matrix resin (11) which contains a resin composition that is mainly composed of a resin that contains an oxygen atom in the molecular structure; and a mixed filler (12) which is added to the matrix resin (11), while being obtained by having polysaccharide fine particles (122) adsorbed on an inorganic filler (121), said polysaccharide fine particles being microfibers or needle-like crystals of a polysaccharide.

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Inventors:
HOSOKOSHI FUMIHIKO (JP)
KAWANA TAKASHI (JP)
Application Number:
PCT/JP2020/025495
Publication Date:
January 06, 2022
Filing Date:
June 29, 2020
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01H73/18; C08K9/04; C08L63/00; C08L67/06; C08L77/00; C08L101/06
Foreign References:
JP2004171799A2004-06-17
JP2009181890A2009-08-13
JP2010092806A2010-04-22
JP2009185231A2009-08-20
JPH06325653A1994-11-25
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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