Title:
INSULATING RESIN FILM, BONDED BODY USING INSULATING RESIN FILM, AND METHOD FOR MANUFACTURING BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2010/143507
Kind Code:
A1
Abstract:
Provided is an insulating resin film which bonds together a substrate and an electronic component. The insulating resin film has a first adhesive layer disposed on the substrate side, and a second adhesive layer disposed on the electronic component side. The first adhesive layer and the second adhesive layer contain an inorganic filling material, the peak temperature of DSC heat generation of the second adhesive layer is higher than that of DSC heat generation of the first adhesive layer, and the thickness of the first adhesive layer is 50-90% of the total thickness.
Inventors:
SATO DAISUKE (JP)
NISHIMURA JUNICHI (JP)
ODAKA RYOSUKE (JP)
NISHIMURA JUNICHI (JP)
ODAKA RYOSUKE (JP)
Application Number:
PCT/JP2010/058519
Publication Date:
December 16, 2010
Filing Date:
May 20, 2010
Export Citation:
Assignee:
SONY CHEM & INF DEVICE CORP (JP)
SATO DAISUKE (JP)
NISHIMURA JUNICHI (JP)
ODAKA RYOSUKE (JP)
SATO DAISUKE (JP)
NISHIMURA JUNICHI (JP)
ODAKA RYOSUKE (JP)
International Classes:
H01L21/60; C09J7/35; C09J9/00; C09J11/04; C09J163/00; H01B17/56; H05K3/28; H05K3/32
Domestic Patent References:
| WO2009013968A1 | 2009-01-29 |
Foreign References:
| JP2007131649A | 2007-05-31 | |||
| JP2004342663A | 2004-12-02 | |||
| JP2007182062A | 2007-07-19 |
Attorney, Agent or Firm:
HIROTA, Koichi et al. (JP)
Koichi Hirota (JP)
Koichi Hirota (JP)
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