Title:
INSULATING RESIN MATERIAL, METAL-LAYER-ATTACHED INSULATING RESIN MATERIAL USING SAME, AND WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/159816
Kind Code:
A1
Abstract:
In order to obtain an insulating resin material that is a material having both superior low relative dielectric constant and low linear thermal expansion coefficient, which have conventionally been difficult to obtain, a metal-layer-attached insulating resin material using the same, and a wiring substrate, the present invention provides an insulating resin material containing: inorganic porous agglomerates 2 that are composed of a plurality of fine particles and that have holes 3; and fibrils 4 formed of polytetrafluoroethylene, wherein the fibrils 4 are oriented in many directions, and at least either the inorganic porous agglomerates 2 or the fibrils 4 are linked to one another and form a minute network structure having a porosity of 50% or more.
Inventors:
KASAGI TOMOYUKI (JP)
UEMURA KOU (JP)
IMAMURA SYUNJI (JP)
KITAGAWA YUYA (JP)
UEMURA KOU (JP)
IMAMURA SYUNJI (JP)
KITAGAWA YUYA (JP)
Application Number:
PCT/JP2017/010767
Publication Date:
September 21, 2017
Filing Date:
March 16, 2017
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01B3/00; H01B3/44; H05K1/03
Domestic Patent References:
| WO2009038177A1 | 2009-03-26 |
Foreign References:
| JP2001283640A | 2001-10-12 | |||
| JPH04500291A | 1992-01-16 | |||
| JP2004043984A | 2004-02-12 | |||
| JPH08507316A | 1996-08-06 | |||
| JP2010138021A | 2010-06-24 | |||
| JP2007138095A | 2007-06-07 | |||
| JP2005273100A | 2005-10-06 | |||
| JPH05301974A | 1993-11-16 | |||
| JPH06119810A | 1994-04-28 | |||
| JPH03212987A | 1991-09-18 |
Other References:
See also references of EP 3432316A4
Attorney, Agent or Firm:
SAITOH Yukihiko et al. (JP)
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