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Patent Searching and Data


Title:
INSULATING AND THERMALLY CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2013/100123
Kind Code:
A1
Abstract:
[Problem] To provide a high heat dissipation sheet that enables electrical insulation properties while also making possible a simple construction method. [Solution] In the present invention, short fibers with electrical insulation properties and high heat dissipation properties are electrostatically flocked at high density onto a base material coated with adhesive, under conditions that allow for high density electrostatic flocking, the erect short fibers are adhered and affixed, binder resin is impregnated and is hardened, and subsequently one surface of the sheet is polished so that the insulating and highly-thermally-conductive fibers penetrate and are arrayed at high density in the direction of the sheet thickness. As a result, a heat dissipation sheet is formed in which the fibers protrude from one surface while the opposite surface is made smooth so that heat from a heat generating body can be quickly absorbed by the opposite surface and quickly dissipated into the air by the fiber protrusion surface.

Inventors:
NISHIMURA HIROKAZU (JP)
HASHIMOTO KANA (JP)
Application Number:
PCT/JP2012/084055
Publication Date:
July 04, 2013
Filing Date:
December 28, 2012
Export Citation:
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Assignee:
TOYO BOSEKI (JP)
International Classes:
H01L23/373; B29D7/01; H05K7/20
Foreign References:
JP4521937B22010-08-11
JP2009029908A2009-02-12
Other References:
LILANG LIU: "Optimal design of superfine polyamide fabric by electrostatic flocking technology", TEXTILE RESEARCH JOURNAL, vol. 81, no. 1, January 2011 (2011-01-01), pages 3 - 9, XP055073722
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Claims: