Title:
INSULATION BODY FOR REFLOW DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/157823
Kind Code:
A1
Abstract:
The present invention relates to an insulating body for a reflow device, and more specifically, to an insulating body for a reflow device comprising: an insulating material for blocking the entrance/exit of heat; an outer skin enshrouding the insulation material; and an attachment/detachment means provided on the outer skin to enable attachment/detachment of the insulating material on the reflow device for implementing on a substrate and brazing a component. The insulating body has superior insulating, adiabatic, anti-shatter, and shape maintenance effects compared to a conventional insulating material.
Inventors:
TSURUGA KATSUMI (JP)
Application Number:
PCT/KR2011/008238
Publication Date:
November 22, 2012
Filing Date:
November 01, 2011
Export Citation:
Assignee:
JINWOO CO LTD (KR)
TSURUGA KATSUMI (JP)
TSURUGA KATSUMI (JP)
International Classes:
H05K3/34; B23K3/08
Foreign References:
| JP2002016353A | 2002-01-18 | |||
| KR870003682A | ||||
| KR20010011352A | 2001-02-15 |
Attorney, Agent or Firm:
STY PATENT LAW FIRM (KR)
특허법인 신태양 (KR)
특허법인 신태양 (KR)
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