Title:
INSULATION LAYER FORMATION METHOD, MEMBER WITH INSULATION LAYER, RESISTANCE MEASUREMENT METHOD AND JUNCTION RECTIFIER
Document Type and Number:
WIPO Patent Application WO/2020/013304
Kind Code:
A1
Abstract:
The present invention involves: a first step in which a surface treatment is applied to a base material to form thereon a high-resistance layer having high electric resistivity; a second step in which metal plating parts are formed on the base material that has undergone the first step in such a manner as to allow a high-resistance layer to be formed thereon; and a third process in which a high-resistance layer is formed on the base material that has undergone the second step.
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Inventors:
MICHIWAKI HIROSHI (JP)
Application Number:
PCT/JP2019/027619
Publication Date:
January 16, 2020
Filing Date:
July 11, 2019
Export Citation:
Assignee:
NEXT INNOVATION INC (JP)
International Classes:
C23C28/00; C25D11/36; H01B5/14; H01B13/00
Domestic Patent References:
WO2005017235A1 | 2005-02-24 |
Foreign References:
JP2006233245A | 2006-09-07 | |||
JP2013211322A | 2013-10-10 | |||
JP2017116266A | 2017-06-29 | |||
JP2009102688A | 2009-05-14 | |||
JPS5466463A | 1979-05-29 | |||
JPS52154070A | 1977-12-21 | |||
JPH11189895A | 1999-07-13 | |||
JPH02239683A | 1990-09-21 |
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