Title:
INSULATION MODULE
Document Type and Number:
WIPO Patent Application WO/2022/264980
Kind Code:
A1
Abstract:
An insulation module (10) comprises: a light-emitting element (20); a light-receiving element (30) that receives light from the light-emitting element (20); a first die pad (42CB) on which the light-emitting element (20) is mounted; a second die pad (52AB) that is provided in alignment with the first die pad (42CB) and on which the light-receiving element (30) is mounted; a transparent resin (60) that at least covers both the light-emitting element (20) and the light-receiving element (30); a reflection member (70) that covers at least the transparent resin (60) and is formed from a material that reflects light from the light-emitting element (20); and an encapsulation resin (80) that encapsulates the reflection member (70) as well as the transparent resin (60) and is formed from a material having a light-blocking effect. At least one of the reflection member (70) and the transparent resin (60) includes inorganic particles that absorb or reflect light from the light-emitting element (20).
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Inventors:
ARIMURA MASAHIKO (JP)
TOYAMA TOMOICHIRO (JP)
TOYAMA TOMOICHIRO (JP)
Application Number:
PCT/JP2022/023700
Publication Date:
December 22, 2022
Filing Date:
June 14, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L31/12; H01L23/28; H01L23/29; H01L23/31
Foreign References:
| JP2010258165A | 2010-11-11 | |||
| JP2015060869A | 2015-03-30 | |||
| JPH09283790A | 1997-10-31 | |||
| JPH10163518A | 1998-06-19 | |||
| JP2013065717A | 2013-04-11 | |||
| JP2019012713A | 2019-01-24 | |||
| JP2011181647A | 2011-09-15 | |||
| JP2001111098A | 2001-04-20 | |||
| JP2013179226A | 2013-09-09 | |||
| JPH0629455A | 1994-02-04 | |||
| JP2018148206A | 2018-09-20 | |||
| US20200203551A1 | 2020-06-25 |
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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