Title:
INTEGRALLY MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2012/057318
Kind Code:
A1
Abstract:
Provided is an integrally molded article in which a molded resin article containing a phosphorus compound is used and an addition-reactive silicone adhesive agent is used to achieve strong bonding.
The integrally molded article comprises a molded article, an addition-reactive silicone composition and a member, wherein the molded article comprises a thermoplastic resin composition comprising a poly(butylene terephthalate) resin and a phosphorus compound and contains the phosphorus compound in an amount of 0.5 mass% or less, and wherein the thermoplastic resin molded article and the addition-reactive silicone composition are brought into contact with each other to form the integrally molded article. The phosphorus compound to be used is preferably a trivalent phosphorous compound.
Inventors:
DOI KUMIKO (JP)
SAKATA KOUICHI (JP)
SAKATA KOUICHI (JP)
Application Number:
PCT/JP2011/074937
Publication Date:
May 03, 2012
Filing Date:
October 28, 2011
Export Citation:
Assignee:
WINTECH POLYMER LTD (JP)
DOI KUMIKO (JP)
SAKATA KOUICHI (JP)
DOI KUMIKO (JP)
SAKATA KOUICHI (JP)
International Classes:
C08J5/12; B32B27/36; C08K5/49; C08L67/02
Foreign References:
| JP2005008736A | 2005-01-13 | |||
| JPH10338846A | 1998-12-22 | |||
| JPH09241493A | 1997-09-16 | |||
| JPH09165503A | 1997-06-24 |
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (JP)
Right wood Masayuki (JP)
Right wood Masayuki (JP)
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Claims:
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