Title:
INTEGRATED DICING/DIE BONDING FILM, DIE BONDING FILM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/006158
Kind Code:
A1
Abstract:
This integrated dicing/die bonding film is provided with: dicing tape having a substrate and an adhesive layer provided on the substrate; and a die bonding film having a first surface and a second surface on the opposite side from the first surface, said die bonding film being arranged on the adhesive layer of the dicing tape so that the adhesive layer and the first surface are in contact. The die bonding film contains 75 mass% or more of conductive particles relative to the total amount of the die bonding film. The surface roughness of the first surface is 1.0 μm or less and the surface roughness of the second surface is 1.0 μm or less in the die bonding film.
Inventors:
KOSEKI YUTA (JP)
NAKAMURA YUKI (JP)
YAMANAKA DAISUKE (JP)
NAKAMURA YUKI (JP)
YAMANAKA DAISUKE (JP)
Application Number:
PCT/JP2020/025891
Publication Date:
January 14, 2021
Filing Date:
July 01, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B32B27/00; B32B27/18; C09J7/20; C09J7/38; H01L21/301; H01L21/52
Foreign References:
| JP2010062205A | 2010-03-18 | |||
| JP2015103580A | 2015-06-04 | |||
| JP2017095642A | 2017-06-01 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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