Title:
INTEGRATED DEVICE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING INTEGRATED DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/041431
Kind Code:
A1
Abstract:
Provided in the present application are an integrated device, an electronic device, and a method for manufacturing an integrated device. The integrated device comprises a substrate, the substrate comprising a first substrate and a second substrate, which are connected to each other, wherein a pressure sensor is arranged on the first substrate, the pressure sensor comprises a first electrode, a first P-type heavily-doped layer and a first P-type lightly-doped layer, and the first P-type heavily-doped layer is connected to the first electrode; and a temperature sensor is arranged on the second substrate, and the temperature sensor comprises a P-type diode.
Inventors:
DING KAIWEN (CN)
ZHU ENCHENG (CN)
ZHOU WANGYANG (CN)
HU HONG (CN)
CHEN LEI (CN)
ZHANG QIANG (CN)
WANG DONGJIE (CN)
ZHU ENCHENG (CN)
ZHOU WANGYANG (CN)
HU HONG (CN)
CHEN LEI (CN)
ZHANG QIANG (CN)
WANG DONGJIE (CN)
Application Number:
PCT/CN2023/113330
Publication Date:
February 29, 2024
Filing Date:
August 16, 2023
Export Citation:
Assignee:
GOERTEK MICROELECTRONICS INC (CN)
International Classes:
H01L27/10; G01D21/02; H01L29/84; H01L29/872
Foreign References:
| CN115394776A | 2022-11-25 | |||
| CN115799176A | 2023-03-14 | |||
| CN207800604U | 2018-08-31 | |||
| CN104058361A | 2014-09-24 | |||
| CN102285633A | 2011-12-21 | |||
| CN207798140U | 2018-08-31 | |||
| KR20050117698A | 2005-12-15 |
Attorney, Agent or Firm:
CENFO INTELLECTUAL PROPERTY AGENCY (CN)
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