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Title:
INTEGRATED DICING DIE-BONDING FILM, DIE-BONDING FILM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/009570
Kind Code:
A1
Abstract:
Disclosed is an integrated dicing die-bonding film. Said integrated dicing die-bonding film comprises: dicing tape that has a substrate and an adhesive layer provided upon the substrate; and a die-bonding film that is disposed upon the adhesive layer of the dicing tape. The die-bonding film contains silver-containing particles that are surface-treated with a saturated fatty acid. The silver-containing particle content is 75 mass% or more based on the total amount of the die-bonding film.

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Inventors:
ITAGAKI KEI (JP)
TANIGUCHI KOHEI (JP)
HIRAMOTO YUYA (JP)
Application Number:
PCT/JP2021/021031
Publication Date:
January 13, 2022
Filing Date:
June 02, 2021
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J11/04; C09J7/25; C09J7/35; C09J163/00; C09J201/00; H01L21/301; H01L21/52
Foreign References:
JP2017141363A2017-08-17
JP2019189936A2019-10-31
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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