In packaging a multi-axis sensor assembly, high vector fidelity and low cross-axis sensitivity between the three major axes (x-axis, y-axis, and z-axis) is generally required. Orthogonally mounting three single-axis sensors typically results in low vector fidelity and high cross-axis sensitivity. There are also numerus manufacturing steps.

The present invention is directed at creating a multi-axis sensor package that has high vector fidelity, low cross-axis sensitivity, and a minimum number of manufacturing steps.

Summary of the Invention According to one aspect of the invention, an apparatus is provided that includes a housing, a plurality of end caps, a sensor module, a plurality of sealing members, and a plurality of coupling members.

According to another aspect of the invention, an apparatus is provided that includes a housing, a sensor, a lid assembly, and a controller assembly.

According to another aspect of the invention, an apparatus is provided that includes a plurality of sensor packages, each sensor package having an axis of sensitivity positioned in a different spatial direction.

According to another aspect of the invention, a method of coupling a controller to a housing is provided that includes dispensing an adhesive on the housing, placing the controller on the housing, curing the adhesive, wire-bonding the controller to the housing, encapsulating the controller and wire-bonds, and curing the encapsulant.

According to another aspect of the invention, a method of assembling a sensor package including of a housing, a sensor, a controller, and a lid assembly is provided that includes coupling the sensor to the housing, coupling the lid assembly to the housing, and coupling the controller to the housing.

According to another aspect of the invention, a method of assembling a multi-axis sensor assembly is provided that includes a plurality of sensor packages, each sensor package having an axis of sensitivity positioned in a different spatial direction.

According to another aspect of the invention, a sensor package is provided that includes a substrate including a slot and a sensor positioned within the slot.

According to another aspect of the invention, a method of assembling a sensor package is provided that includes a substrate and a sensor, including coupling the sensor to the substrate.

Brief Description of the Drawings Fig. 1 is a schematic view illustrating an embodiment of a system for sensor measurement.

Fig. 2 is a schematic view of an embodiment of the sensor apparatus of the system of Fig. 1.

Fig. 3 is a cross-sectional view of an embodiment of the sensor apparatus of Fig. 2.

Fig. 4 is a schematic view of an embodiment of the sensor module of Fig.

3.

Fig. 5A is a schematic view of an embodiment of the sensor package of Fig.

4.

Fig. 5B is a cross-sectional view of an embodiment of the sensor package of Fig. 5A.

Fig. 5C is a top view of an embodiment of the housing of the sensor package of Fig. 5A without the sensor or lid assembly.

Fig. 5D is a side view of an embodiment of the housing of the sensor package of Fig. 5A.

Fig. 5E is a bottom view of an embodiment of the housing of the sensor package of Fig. 5A.

Fig. 5F is a bottom view of an embodiment of the sensor of the sensor package of Fig. 5A.

Fig. 5G is a top view of an embodiment of the resilient couplings of the sensor package of Fig. 5A.

Fig. 5H is a detailed view of an embodiment of the resilient couplings of the sensor package of Fig. 5A.

Fig. 51 is a top view of an embodiment of the sliding supports of the sensor package of Fig. 5A.

Fig. 5J is a side view of an embodiment of the lid assembly of the sensor package of Fig. 5A.

Fig. 5K is a bottom view of an embodiment of the lid assembly of the sensor package of Fig. 5A.

Fig. 5L is top view of an embodiment of the solder preform of the sensor package of Fig. 5A.

Fig. 5M is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 5A.

Fig. 5N is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 5A.

Fig. 50 is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 5A.

Fig. 5P is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 5A.

Fig. 5Q is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 5A.

Fig. 5R is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 5A.

Fig. 5S is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 5A.

Fig. 5T is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 5A.

Fig. 5U is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 5A.

Fig. 5V is a top view of an alternate embodiment of the resilient couplings of the sensor package of Fig. 5A.

Fig. 5W is a top view of an alternate embodiment of the sliding supports of the sensor package of Fig. 5A.

Fig. 5X is a top view of an alternate embodiment of the sliding supports of the sensor package of Fig. 5A.

Fig. 5Y is a top view of an alternate embodiment of the sliding supports of the sensor package of Fig. 5A.

Fig. 6A is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 6B is a cross-sectional view of an embodiment of the sensor package of Fig. 6A.

Fig. 6C is a top view of the housing of an embodiment of the sensor package of Fig. 6A. without the sensor or lid assembly.

Fig. 6D is a side view of an embodiment of the housing of the sensor package of Fig. 6A.

Fig. 6E is a bottom view of an embodiment of the housing of the sensor package of Fig. 6A.

Fig. 6F is a bottom view of an embodiment of the sensor of the sensor package of Fig. 6A.

Fig. 6G is a top view of an embodiment of the resilient coupling of the sensor package of Fig. 6A.

Fig. 6H is a detailed view of an embodiment of the resilient coupling of the sensor package of Fig. 6A.

Fig. 61 is a top view of an embodiment of the sliding supports of the sensor package of Fig. 6A.

Fig. 6J is a side view of an embodiment of the lid assembly of the sensor package of Fig. 6A.

Fig. 6K is a bottom view of an embodiment of the lid assembly of the sensor package of Fig. 6A.

Fig. 6L is top view of an embodiment of the solder preform of the sensor package of Fig. 6A.

Fig. 7A is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 7B is a cross-sectional view of an embodiment of the sensor package of Fig. 7A.

Fig. 7C is a top view of the housing of an embodiment of the sensor package of Fig. 7A. without the sensor or lid assembly.

Fig. 7D is a side view of the housing of an embodiment of the sensor package of Fig. 7A.

Fig. 7E is a bottom view of an embodiment of the housing of the sensor package of Fig. 7A.

Fig. 7F is a bottom view of an embodiment of the sensor of the sensor package of Fig. 7A.

Fig. 7G is a top view of an embodiment of the resilient coupling of the sensor package of Fig. 7A.

Fig. 7H is a detailed view of an embodiment of the resilient coupling of the sensor package of Fig. 7A.

Fig. 71 is a top view of an embodiment of the sliding supports of the sensor package of Fig. 7A.

Fig. 7J is a side view of an embodiment of the lid assembly of the sensor package of Fig. 7A.

Fig. 7K is a bottom view of an embodiment of the lid assembly of the sensor package of Fig. 7A.

Fig. 7L is top view of an embodiment of the solder preform of the sensor package of Fig. 7A.

Fig. 8A is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 8B is a cross-sectional view of an embodiment of the sensor package of Fig. 8A.

Fig. 8C is a top view of the housing of an embodiment of the sensor package of Fig. 8A. without the sensor or lid assembly.

Fig. 8D is a side view of an embodiment of the housing of the sensor package of Fig. 8A.

Fig. 8E is a bottom view of an embodiment of the housing of the sensor package of Fig. 8A.

Fig. 8F is a bottom view of an embodiment of the sensor of the sensor package of Fig. 8A.

Fig. 8G is a top view of an embodiment of the resilient coupling of the sensor package of Fig. 8A.

Fig. 8H is a detailed view of an embodiment of the resilient coupling of the sensor package of Fig. 8A.

Fig. 81 is a top view of an embodiment of the sliding supports of the sensor package of Fig. 8A.

Fig. 8J is a side view of an embodiment of the lid assembly of the sensor package of Fig. 8A.

Fig. 8K is a bottom view of an embodiment of the lid assembly of the sensor package of Fig. 8A.

Fig. 8L is top view of an embodiment of the solder preform of the sensor package of Fig. 8A.

Fig. 9A is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 9B is a cross-sectional view of an embodiment of the sensor package of Fig. 9A.

Fig. 9C is a top view of the housing of an embodiment of the sensor package of Fig. 9A. without the sensor or lid assembly.

Fig. 9D is a side view of the housing of an embodiment of the sensor package of Fig. 9A.

Fig. 9E is a bottom view of an embodiment of the housing of the sensor package of Fig. 9A.

Fig. 9F is a bottom view of an embodiment of the sensor of the sensor package of Fig. 9A.

Fig. 9G is a top view of an embodiment of the first resilient coupling of the sensor package of Fig. 9A.

Fig. 9H is a detailed view of an embodiment of the first resilient coupling of the sensor package of Fig. 9A.

Fig. 91 is a top view of an embodiment of the second resilient coupling of the sensor package of Fig. 9A.

Fig. 9J is a detailed view of an embodiment of the second resilient coupling of the sensor package of Fig. 9A.

Fig. 9K is a top view of an embodiment of the sliding supports of the sensor package of Fig. 9A.

Fig. 9L is a side view of an embodiment of the lid assembly of the sensor package of Fig. 9A.

Fig. 9M is a bottom view of an embodiment of the lid assembly of the sensor package of Fig. 9A.

Fig. 9N is top view of an embodiment of the solder preform of the sensor package of Fig. 9A.

Fig. 90 is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 9A.

Fig. 9P is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 9A.

Fig. 9Q is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 9A.

Fig. 9R is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 9A.

Fig. 9S is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 9A.

Fig. 9T is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 9A.

Fig. 9U is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 9A.

Fig. 9V is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 9A.

Fig. 9W is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 9A.

Fig. 9X is a top view of an alternate embodiment of the resilient couplings of the sensor package of Fig. 9A.

Fig. 9Y is a top view of an alternate embodiment of the sliding supports of the sensor package of Fig. 9A.

Fig. 9Z is a top view of an alternate embodiment of the sliding supports of the sensor package of Fig. 9A.

Fig. 9AA is a top view of an alternate embodiment of the sliding supports of the sensor package of Fig. 9A.

Fig. 10A is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 10B is a cross-sectional view of an embodiment of the sensor package of Fig. 10A.

Fig. 10C is a top view of an embodiment of the housing of the sensor package of Fig. 10A. without the sensor or lid assembly.

Fig. 10D is a side view of an embodiment of the housing of the sensor package of Fig. 10A.

Fig. 10E is a bottom view of an embodiment of the housing of the sensor package of Fig. 10A.

Fig. 10F is a bottom view of an embodiment of the sensor of the sensor package of Fig. 10A.

Fig. 10G is a top view of an embodiment of the first resilient coupling of the sensor package of Fig. 10A.

Fig. 10H is a detailed view of an embodiment of the first resilient coupling of the sensor package of Fig. 10A.

Fig. 10I is a top view of an embodiment of the second resilient coupling of the sensor package of Fig. 10A.

Fig. 10J is a detailed view of an embodiment of the second resilient coupling of the sensor package of Fig. 10A.

Fig. 10K is a top view of an embodiment of the sliding supports of the sensor package of Fig. 10A.

Fig. 10L is a side view of an embodiment of the lid assembly of the sensor package of Fig. 10A.

Fig. 10M is a bottom view of an embodiment of the lid assembly of the sensor package of Fig. 10A.

Fig. 1ON is top view of an embodiment of the solder preform of the sensor package of Fig. 10A.

Fig. 11A is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 11B is a cross-sectional view of an embodiment of the sensor package of Fig. 11A.

Fig. 11C is a top view of an embodiment of the housing of the sensor package of Fig. 11A. without the sensor or lid assembly.

Fig. 11D is a side view of an embodiment of the housing of the sensor package of Fig. 11A.

Fig. 11E is a bottom view of an embodiment of the housing of the sensor package of Fig. 11A.

Fig. 11F is a bottom view of an embodiment of the sensor of the sensor package of Fig. 11A.

Fig. 11G is a top view of an embodiment of the first resilient coupling of the sensor package of Fig. 11A.

Fig. 11H is a detailed view of an embodiment of the first resilient coupling of the sensor package of Fig. 11A.

Fig. 11I is a top view of an embodiment of the second resilient coupling of the sensor package of Fig. 11A.

Fig. 11J is a detailed view of an embodiment of the second resilient coupling of the sensor package of Fig. 11A.

Fig. 11K is a top view of an embodiment of the sliding supports of the sensor package of Fig. 11A.

Fig. 11L is a side view of an embodiment of the lid assembly of the sensor package of Fig. 11A.

Fig. 11M is a bottom view of an embodiment of the lid assembly of the sensor package of Fig. 11A.

Fig. 11N is top view of an embodiment of the solder preform of the sensor package of Fig. 11A.

Fig. 12A is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 12B is a cross-sectional view of an embodiment of the sensor package of Fig. 12A.

Fig. 12C is a top view of an embodiment of the housing of the sensor package of Fig. 12A. without the sensor or lid assembly.

Fig. 12D is a side view of an embodiment of the housing of the sensor package of Fig. 12A.

Fig. 12E is a bottom view of an embodiment of the housing of the sensor package of Fig. 12A.

Fig. 12F is a bottom view of an embodiment of the sensor of the sensor package of Fig. 12A.

Fig. 12G is a top view of an embodiment of the first resilient coupling of the sensor package of Fig. 12A.

Fig. 12H is a detailed view of an embodiment of the first resilient coupling of the sensor package of Fig. 12A.

Fig. 12I is a top view of an embodiment of the second resilient coupling of the sensor package of Fig. 12A.

Fig. 12J is a detailed view of an embodiment of the second resilient coupling of the sensor package of Fig. 12A.

Fig. 12K is a top view of an embodiment of the sliding supports of the sensor package of Fig. 12A.

Fig. 12L is a side view of an embodiment of the lid assembly of the sensor package of Fig. 12A.

Fig. 12M is a bottom view of an embodiment of the lid assembly of the sensor package of Fig. 12A.

Fig. 12N is top view of an embodiment of the solder preform of the sensor package of Fig. 12A.

Fig. 13A is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 13B is a cross-sectional view of an embodiment of the sensor package of Fig. 13A.

Fig. 13C is a top view of an embodiment of the housing of the sensor package of Fig. 13A. without the sensor or lid assembly.

Fig. 13D is a side view of an embodiment of the housing of the sensor package of Fig. 13A.

Fig. 13E is a bottom view of an embodiment of the housing of the sensor package of Fig. 13A.

Fig. 13F is a bottom view of an embodiment of the sensor of the sensor package of Fig. 13A.

Fig. 13G is a top view of an embodiment of the resilient coupling of the sensor package of Fig. 13A.

Fig. 13H is a detailed view of an embodiment of the resilient coupling of the sensor package of Fig. 13A.

Fig. 13I is a top view of an embodiment of the sliding supports of the sensor package of Fig. 13A.

Fig. 13J is a side view of an embodiment of the lid assembly of the sensor package of Fig. 13A.

Fig. 13K is a bottom view of an embodiment of the lid assembly of the sensor package of Fig. 13A.

Fig. 13L is top view of an embodiment of the solder preform of the sensor package of Fig. 13A.

Fig. 13M is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 13A.

Fig. 13N is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 13A.

Fig. 130 is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 13A.

Fig. 13P is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 13A.

Fig. 13Q is a top view of an alternate embodiment of the bond pad of the sensor package of Fig. 13A.

Fig. 13V is a top view of an alternate embodiment of the resilient couplings of the sensor package of Fig. 13A.

Fig. 13W is a top view of an alternate embodiment of the sliding supports of the sensor package of Fig. 13A.

Fig. 13X is a top view of an alternate embodiment of the sliding supports of the sensor package of Fig. 13A.

Fig. 13Y is a top view of an alternate embodiment of the sliding supports of the sensor package of Fig. 13A.

Fig. 14A is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 14B is a cross-sectional view of an embodiment of the sensor package of Fig. 14A.

Fig. 14C is a top view of an embodiment of the housing of the sensor package of Fig. 14A. without the sensor or lid.

Fig. 14D is a side view of an embodiment of the housing of the sensor package of Fig. 14A.

Fig. 14E is a bottom view of an embodiment of the housing of the sensor package of Fig. 14A.

Fig. 14F is a bottom view of an embodiment of the sensor of the sensor package of Fig. 14A.

Fig. 14G is a top view of an embodiment of the resilient coupling of the sensor package of Fig. 14A.

Fig. 14H is a detailed view of an embodiment of the resilient coupling of the sensor package of Fig. 14A.

Fig. 14I is a top view of an embodiment of the sliding supports of the sensor package of Fig. 14A.

Fig. 14J is a side view of an embodiment of the lid assembly of the sensor package of Fig. 14A.

Fig. 14K is a bottom view of an embodiment of the lid assembly of the sensor package of Fig. 14A.

Fig. 14L is top view of an embodiment of the solder preform of the sensor package of Fig. 14A.

Fig. 15A is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 15B is a cross-sectional view of an embodiment of the sensor package of Fig. 15A.

Fig. 15C is a top view of an embodiment of the housing of the sensor package of Fig. 15A. without the sensor or lid.

Fig. 15D is a side view of an embodiment of the housing of the sensor package of Fig. 15A.

Fig. 15E is a bottom view of an embodiment of the housing of the sensor package of Fig. 15A.

Fig. 15F is a bottom view of an embodiment of the sensor of the sensor package of Fig. 15A.

Fig. 15G is a top view of an embodiment of the resilient coupling of the sensor package of Fig. 15A.

Fig. 15H is a detailed view of an embodiment of the resilient coupling of the sensor package of Fig. 15A.

Fig. 15I is a top view of an embodiment of the sliding supports of the sensor package of Fig. 15A.

Fig. 15J is a side view of an embodiment of the lid assembly of the sensor package of Fig. 15A.

Fig. 15K is a bottom view of an embodiment of the lid assembly of the sensor package of Fig. 15A.

Fig. 15L is top view of an embodiment of the solder preform of the sensor package of Fig. 15A.

Fig. 16A is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 16B is a cross-sectional view of an embodiment of the sensor package of Fig. 16A.

Fig. 16C is a top view of an embodiment of the housing of the sensor package of Fig. 16A. without the sensor or lid.

Fig. 16D is a side view of an embodiment of the housing of the sensor package of Fig. 16A.

Fig. 16E is a bottom view of an embodiment of the housing of the sensor package of Fig. 16A.

Fig. 16F is a bottom view of an embodiment of the sensor of the sensor package of Fig. 16A.

Fig. 16G is a top view of an embodiment of the resilient coupling of the sensor package of Fig. 16A.

Fig. 16H is a detailed view of an embodiment of the resilient coupling of the sensor package of Fig. 16A.

Fig. 16I is a top view of an embodiment of the sliding supports of the sensor package of Fig. 16A.

Fig. 16J is a side view of an embodiment of the lid assembly of the sensor package of Fig. 16A.

Fig. 16K is a bottom view of an embodiment of the lid assembly of the sensor package of Fig. 16A.

Fig. 16L is top view of an embodiment of the solder preform of the sensor package of Fig. 16A.

Fig. 17A is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 17B is a cross-sectional view of an embodiment of the sensor package of Fig. 17A.

Fig. 17C is a top view of an embodiment of the housing of the sensor package of Fig. 17A. without the sensor or lid assembly.

Fig. 17D is a side view of an embodiment of the housing of the sensor package of Fig. 17A.

Fig. 17E is a bottom view of an embodiment of the housing of the sensor package of Fig. 17A.

Fig. 17F is a schematic view of an embodiment of the spring assembly of the sensor package of Fig. 17A.

Fig. 17G is a schematic view of an embodiment of the shorting clip of the sensor package of Fig. 17A.

Fig. 17H is a side view of an embodiment of the lid assembly of the sensor package of Fig. 17A.

Fig. 17I is a bottom view of an embodiment of the lid assembly of the sensor package of Fig. 17A.

Fig. 17J is top view of an embodiment of the solder preform of the sensor package of Fig. 17A.

Fig. 18A is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 18B is a cross-sectional view of an embodiment of the sensor package of Fig. 18A.

Fig. 18C is a top view of an embodiment of the housing of the sensor package of Fig. 18A. without the sensor or lid assembly.

Fig. 18D is a side view of an embodiment of the housing of the sensor package of Fig. 18A.

Fig. 18E is a bottom view of an embodiment of the housing of the sensor package of Fig. 18A.

Fig. 18F is a schematic view of an embodiment of the spring assembly of the sensor package of Fig. 18A.

Fig. 18G is a schematic view of an embodiment of the shorting clip of the sensor package of Fig. 18A.

Fig. 18H is a side view of an embodiment of the lid assembly of the sensor package of Fig. 18A.

Fig. 18I is a bottom view of an embodiment of the lid assembly of the sensor package of Fig. 18A.

Fig. 18J is top view of an embodiment of the solder preform of the sensor package of Fig. 18A.

Fig. 19 is a schematic view of an alternate embodiment of the sensor module of Fig. 3.

Fig. 20 is a schematic view of an alternate embodiment of the sensor module of Fig. 3.

Fig. 21A is a cross-sectional view of an alternate embodiment of the sensor package of Fig. 4 before coupling.

Fig. 21B is a top view of an embodiment of the sensor package of Fig. 21A.

Fig. 21C is a cross-sectional view of an embodiment of the sensor package of Fig. 21A after coupling.

Fig. 21D is a cross-sectional view of an alternate embodiment of the sensor package of Fig. 21A.

Fig. 22A is a top view of an alternate embodiment of the apparatus of Fig.

5B.

Fig. 22B is a cross-sectional view of the apparatus of Fig. 22A.

Fig. 22C is a top view of an alternate embodiment of the apparatus of Fig.

5B.

Fig. 22D is a cross-sectional view of the apparatus of Fig. 22C.

Fig. 23A is a top view of an alternate embodiment of the sensor module of Fig. 3.

Fig. 23B is a cross-sectional view of an alternate embodiment of the sensor module of Fig. 23A.

Fig. 24 is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 25A is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 25B is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 26A is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 26B is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 27A is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Fig. 27B is a schematic view of an alternate embodiment of the sensor package of Fig. 4.

Detailed Description of the Illustrative Embodiments Referring initially to Fig. 1, an embodiment of a system 100 for recording seismic information preferably includes a controller 102 and a sensor apparatus 104.

The controller 102 monitors and controls the system 100. The controller 102 preferably receives data from the sensor apparatus 104. The controller 102 preferably monitors the sensor apparatus 104. The controller 102 is coupled to the sensor apparatus 104 by electrical connections. The controller 102 may be any number of conventional commercially available controllers, for example, of the type integrated circuit chips. In a preferred embodiment, the controller 102 is an application specific integrated chip in order to optimally provide readout and control of the sensor.

In a preferred embodiment, the sensor apparatus 104 ranges from about 0.75 inches to 1 inch in diameter in order to optimally provide minimum cross- sectional area. In a preferred embodiment, the sensor apparatus 104 is waterproof and pressure-proof in order to optimally provide environmental protection.

Referring to Figs. 2 and 3, an embodiment of the sensor apparatus 104 preferably includes a housing 205, a first end cap 210, and a second end cap 215.

The housing 205 is coupled to the first end cap 210, the second end cap 215 and a sensor module 305. The housing 205 is preferably coupled to the first end cap 210 by a first coupling member 310 and a second coupling member 315. The first coupling member 310 may, for example, be a mechanical fastener. In a preferred embodiment the first coupling member 310 is a mechanical fastener capable of being torqued to a predetermined position in order to optimally provide mechanical coupling. The second coupling member 315 may, for example, be a mechanical fastener. In a preferred embodiment the second coupling member 315 is a mechanical fastener capable of being torqued to a predetermined position in order to optimally provide mechanical coupling.

The housing 205 is preferably coupled to the second end cap 215 by a third coupling member 320 and a fourth coupling member 325. The third coupling member 320 may, for example, be a mechanical fastener. In a preferred embodiment the third coupling member 320 is a mechanical fastener capable of being torqued to a predetermined position in order to optimally provide mechanical coupling. The fourth coupling member 325 may, for example, be a mechanical fastener. In a preferred embodiment the fourth coupling member 325 is a mechanical fastener capable of being torqued to a predetermined position in order to optimally provide mechanical coupling.

One or more first sealing members 330 preferably seal the interface between the housing 205 and the first end cap 210. The first sealing members 330 may, for example, be elastomer rings. In a preferred embodiment, the first sealing members 330 are elastomer rings capable of being compressed to a predetermined position in order to optimally provide sealing. The number of first sealing members 330 preferably depend on the sealing requirements of the

interface between the housing 205 and the first end cap 210. In a preferred embodiment, there is a first sealing member 330a, a second first sealing member 330b, a third first sealing member 330c, and a fourth first sealing member 330d.

One or more second sealing members 335 preferably seal the interface between the housing 205 and the second end cap 215. The second sealing members 335 may, for example, be elastomer rings. In a preferred embodiment, the second sealing members 335 are elastomer rings capable of being compressed to a predetermined position in order to optimally provide sealing. The number of second sealing members 335 required preferably depend on the sealing requirements of the interface between the housing 205 and the second end cap 215. In a preferred embodiment, there is a first second sealing member 335a, a second sealing member 335b, a third second sealing member 335c, and a fourth second sealing member 335d.

The housing 205 preferably includes a cavity 340 and a planar surface 345.

The housing 205 may, for example, be metal tubing. In a preferred embodiment, the housing 205 is a metal tube fabricated from high strength materials in order to optimally provide a robust pressure vessel.

The sensor module 305 is preferably supported by the planar surface 345 within the cavity 340 of the housing 205 and preferably coupled to the first end cap 210 by a PC-board connection 355.

In several alternate embodiments, the sensor module 305 may be used in a variety of sensor apparatuses 104, for example, geophone packages, inclinometers, inertial guidance systems, and vibration monitoring.

Referring to Fig. 4, the sensor module 305 preferably includes one or more sensor packages 405 and a substrate 410. The sensor packages 405 are preferably coupled to the substrate 410. In a preferred embodiment, the sensor module 305 includes a first sensor package 405a, a second sensor package 405b, and a third sensor package 405c. The first sensor package 405a preferably includes an axis of sensitivity 415. The axis of sensitivity 415 is preferably approximately parallel to the x-axis. The first sensor package 405a is preferably coupled to the substrate 410 to maintain the axis of sensitivity 415 parallel to the x-axis. The second sensor package 405b preferably includes an axis of sensitivity

420. The axis of sensitivity 420 is preferably approximately parallel to the y-axis.

The second sensor package 405b is preferably coupled to the substrate 410 to maintain the axis of sensitivity 420 parallel to the y-axis. The third sensor package 405c preferably includes an axis of sensitivity 425. The axis of sensitivity 425 is preferably approximately parallel to the z-axis. The third sensor package 405c is preferably coupled to the substrate 410 to maintain the axis of sensitivity 425 parallel to the z-axis.

The sensor packages 405 may, for example, be coupled to the substrate 410 using one of the following methods: solder-paste surface mount, solder-ball, or leads. In a preferred embodiment, the sensor packages 405 are coupled to the substrate 410 by solder paste surface mount in order to optimally provide low profile components. The substrate 410 may, for example, be ceramic or organic PC-boards. In a preferred embodiment, the substrate 410 is ceramic PC-board in order to optimally provide high temperature capability.

Referring to Figs. 5A through 5L, an embodiment of the sensor package 405 preferably includes a housing 502, a sensor 504, a lid assembly 506, and a controller assembly 508. The lid assembly 506 is preferably coupled to the top of the housing 502. The controller assembly 508 is preferably coupled to the bottom of the housing 502. The sensor 504 is preferably coupled within the housing 502.

The housing 502 is preferably coupled to the sensor 504, the lid assembly 506, the controller assembly 508, one or more electrical connections 510, one or more resilient couplings 512, and one or more sliding supports 514. The housing 502 preferably includes a cavity 516, one or more planar surfaces 518, one or more exterior surfaces 520, and a bottom exterior surface 522. The cavity 516 preferably includes a first wall 524, a second wall 526, a third wall 528 and a fourth wall 530. The first wall 524 and the third wall 528 are preferably approximately parallel to each other and the second wall 526 and the fourth wall 530 are preferably approximately parallel to each other. The second wall 526 and the fourth wall 530 are also preferably perpendicular to the first wall 524 and the third wall 528. The cavity 516 preferably includes a bottom surface 532. The bottom surface 532 may, for example, be ceramic. In a preferred embodiment,

the bottom surface 532 is gold plated in order to optimally provide solderability.

The housing 502 may, for example, be any number of conventional commercially available housings of the type ceramic, plastic, or metal. In a preferred embodiment, the housing 502 is ceramic in order to optimally provide vacuum sealing capability.

The housing 502 preferably includes a first planar surface 518a, a second planar surface 518b, a third planar surface 518c, and a fourth planar surface 518d. The first planar surface 518a preferably includes one or more planar bond pads 534. The planar bond pads 534 are preferably approximately rectangularly shaped. The planar bond pads 534 may, for example, be used for solder paste, solder balls or leads attachment. In a preferred embodiment, the planar bond pads 534 are used to solder the sensor packages 405 to the substrate 410. The number of planar bond pads 534 preferably depend on having sufficient planar bond pads 534 to connect the controller assembly 508 to the housing 502. The second planar surface 518b may, for example, be plated with a metal. In a preferred embodiment, the second planar surface 518b is plated with gold in order to optimally provide solderability. The third planar surface 518c may, for example, be plated with a metal. In a preferred embodiment, the third planar surface 518c is plated with gold in order to optimally provide wire bonding. The fourth planar surface 518d may, for example, be plated with a metal. In a preferred embodiment, the fourth planar surface 518d is plated with gold in order to optimally provide wire bonding.

The housing 502 preferably includes a plurality of first exterior surfaces 520a and a plurality of second exterior surfaces 520b. In a preferred embodiment, there are four first exterior surfaces 520a and four second exterior surfaces 520b forming an approximate octagon. The second exterior surfaces 520b preferably couple the first exterior surfaces 520a to each other. The first exterior surfaces 520a preferably include one or more exterior bond pads 536.

The exterior bond pads 536 are preferably approximately rectangularly shaped.

The exterior bond pads 536 may, for example, be used for solder paste, solder ball or leads attachment. In a preferred embodiment, the exterior bond pads 536 are used to solder the sensor package 405 to the substrate 410. In an alternate

embodiment, the exterior bond pads 536 are on a single first exterior surface 520a.

The bottom exterior surface 522 of the housing 502 preferably includes a contact pad 538, one or more bond pads 540, and one or more connecting pads 542. The contact pad 538 may, for example, be plated with a metal. In a preferred embodiment, the contact pad 538 is gold-plated in order to optimally provide a reliable electrical connection. The planar bond pads 534 on the first planar surface 518a are preferably electrically coupled to the bond pads 540 on the bottom exterior surface 522 by electrical paths molded into the housing 502.

The resilient couplings 512, the third planar surface 518c and the fourth planar surface 518d are preferably coupled to the bond pads 540 on the bottom exterior surface 522 by electrical paths molded into the housing 502. The bond pads 540 may, for example, be plated with a metal. In a preferred embodiment, the bond pads 540 are gold-plated in order to optimally provide wire bonding. The number of bond pads 540 preferably depend on having sufficient bond pads 540 to connect the controller assembly 508 to the housing 502. The connecting pads 542 preferably connect the contact pad 538 to the bond pads 540. The connecting pads 542 may, for example, be metal plated. In a preferred embodiment, the connecting pads 542 are gold-plated in order to optimally provide a conductive pathway between the contact pad 538 and the bond pads 540. In a preferred embodiment, there is a first connecting pad 542a and a second connecting pad 542b. The exterior bond pads 536 are preferably electrically connected to the bond pads 540 by electrical paths molded into the housing 502.

The sensor 504 is preferably resiliently attached to the housing 502 by the resilient couplings 512, slidingly supported by the sliding supports 514, and electrically coupled to the housing 502 by the electrical connections 510. The sensor 504 preferably has an approximately rectangular cross-sectional shape.

The sensor 504 preferably has a passive region 566 at one end and an active region 588 at an opposite end. In a preferred embodiment, the sensor 504 includes a first member 544, a second member 546, and a third member 548.

The first member 544 is preferably on top of the second member 546 and the

second member 546 is preferably on top of the third member 548. In a preferred embodiment, the first member 544, the second member 546, and the third member 548 are a micro machined sensor substantially as disclosed in copending U. S. Patent Application Serial No., Attorney Docket No. 14737.737, filed on, the contents of which are incorporated herein by reference.

The first member 544 preferably includes one or more parallel planar surfaces. In a preferred embodiment, the first member includes a top parallel planar surface 550. The second member 546 preferably includes one or more parallel planar surfaces. In a preferred embodiment, the second member 546 includes a middle parallel planar surface 552. The third member 548 preferably includes one or more parallel planar surfaces. In a preferred embodiment, the third member 548 includes a bottom parallel planar surface 554.

The bottom parallel planar surface 554 of the sensor 504 preferably includes a first side 556, a second side 558, a third side 560, and a fourth side 562. The first side 556 and the third side 560 are preferably approximately parallel to each other and the second side 558 and the fourth side 562 are preferably approximately parallel to each other and preferably approximately perpendicular to the first side 556 and the third side 560.

In a preferred embodiment, the bottom parallel planar surface 554 of the sensor 504 includes one or more bond pads 564. In a preferred embodiment, the bond pads 564 are located in the passive region 566 of the bottom parallel planar surface 554 of the sensor 504. The bond pads 564 may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the first side 556 of the bottom parallel planar surface 554 of the sensor 504 and may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the second side 558 of the bottom parallel planar surface 554 of the sensor 504. In a preferred embodiment, the bond pads 564 are located a perpendicular distance ranging from about 7 to 12 mils from the first side 556 of the bottom parallel planar surface 554 of the sensor 504 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 7 to 12 mils

from the second side 558 of the bottom parallel planar surface 554 of the sensor 504 in order to optimally minimize thermal stresses.

The bond pads 564 may, for example, be used for solder, conductive epoxy, non-conductive epoxy or glass frit bonding. In a preferred embodiment, the bond pads 564 are used for solder bonding in order to optimally provide good manufacturability. In a preferred embodiment, the bond pads 564 contact area is maximized in order to optimize the shock tolerance of the sensor 504. In a preferred embodiment, the bond pads 564 have minimal discontinuities in order to optimize the distribution of thermal stresses in the sensor 504. In several alternate embodiments, there are a plurality of bond pads 564 in order to optimize the relief of thermal stresses in the sensor 504. In a preferred embodiment, there is a single bond pad 564a. The bond pad 564a has an approximately rectangular cross-sectional shape. The length L564a of the bond pad 564a may range, for example, from about 200 to 240 mils. In a preferred embodiment, the length L564a of the bond pad 564a ranges from about 200 to 220 mils in order to optimally minimize thermal stresses. The width Wbs of the bond pad 564a may range, for example, from about 15 to 25 mils. In a preferred embodiment, the width Wgg of the bond pad 564a ranges from about 18 to 22 mils in order to optimally minimize thermal stresses. The height Hgg of the bond pad 564a may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height Hgg of the bond pad 564a ranges from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

The resilient couplings 512 preferably resiliently attach the bond pads 564 to the housing 502. The resilient couplings 512 may electrically attach the sensor 504 to the housing 502. The resilient couplings 512 are preferably coupled to the bottom surface 532 of the cavity 516 of the housing 502. In a preferred embodiment, the resilient couplings 512 are solder preforms. In a preferred embodiment, the resilient couplings 512 have minimal discontinuities in order to optimize the distribution of thermal stresses in the sensor 504. In several alternate embodiments, there are a plurality of resilient couplings 512 in order to optimize the relief of thermal stresses in the sensor 504. In a preferred embodiment, the resilient couplings 512 have an approximate cross-sectional

rectangular shape. The resilient couplings 512 may, for example, be any number of conventional commercially available solder preforms of the type eutectic or non-eutectic. In a preferred embodiment, the resilient couplings 512 are a eutectic type in order to optimally provide good yield strength with a reasonable melt temperature. In a preferred embodiment, there is a single resilient coupling 512a.

The length L5l2a of the resilient coupling 512a may range, for example, from about 200 to 250 mils. In a preferred embodiment, the length L,, 12. of the resilient coupling 512a ranges from about 225 to 235 mils in order to optimally minimize thermal stresses. The width W512a of the resilient coupling 512a may range, for example, from about 20 to 35 mils. In a preferred embodiment, the width W5l2a of the resilient coupling 512a ranges from about 25 to 30 mils in order to optimally minimize thermal stresses. The height H5l2 of the resilient coupling 512a may range, for example, from about 2 to 4 mils. In a preferred embodiment, the height H5l2 of the resilient coupling 512a ranges from about 2.5 to 3 mils in order to optimally minimize thermal stresses.

The resilient couplings 512 may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the first wall 524 of the cavity 516 of the housing 502 and may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the second wall 526 of the cavity 516 of the housing 502. In a preferred embodiment, the resilient couplings 512 are located a perpendicular distance ranging from about 7 to 12 mils from the first wall 524 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses and located a distance ranging from about 7 to 12 mils from the second wall 526 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses.

In a preferred embodiment, the resilient couplings 512 further include one or more first bumpers 568 and one or more second bumpers 570 for slidingly supporting the sensor 504. In a preferred embodiment, the first bumpers 568 are located on one side of the bond pads 564 and the second bumpers 570 are located on another side of the bond pads 564. In a preferred embodiment, the first bumpers 568 and the second bumpers 570 are proximate to the bond pads

564. The width W568 of the first bumpers 568 may range, for example, from about 2 to 6 mils. In a preferred embodiment, the width W568 of the first bumpers 568 range from about 3 to 5 mils in order to optimally minimize stresses. The width W570 of the second bumpers 570 may range, for example, from about 2 to 6 mils. In a preferred embodiment, the width W670 of the second bumpers 570 range from about 3 to 5 mils in order to optimally minimize stresses. In a preferred embodiment, the resilient couplings 512 are coupled to the bond pads 564 using conventional solder equipment and processes. In a preferred embodiment, the resilient couplings 512 are coupled to the bottom surface 532 of the cavity 516 of the housing 502 using conventional solder equipment and processes.

The sliding supports 514 slidingly support the sensor 504. The sliding supports 514 are preferably coupled to the bottom surface 532 of the cavity 516 of the housing 502. The sliding supports 514 may, for example, be tungsten or ceramic. In a preferred embodiment, the sliding supports 514 are tungsten in order to optimally provide a standard packaging process. In a preferred embodiment, the sliding supports 514 have an approximately square cross sectional shape. The cross sectional area of the sliding supports 514 may range, for example, from about 400 to 1600 square mils, individually. In a preferred embodiment, the cross sectional area of the sliding supports 514 ranges from about 625 to 1225 square mils, individually, in order to optimally minimize thermal stresses. The height H514 of the sliding supports 514 may range, for example, from about 0.5 to 3 mils. In a preferred embodiment, the height H514 of the sliding supports 514 ranges from about 1 to 1.5 mils in order to optimally minimize thermal stresses. The number of sliding supports 514 preferably depends on having sufficient sliding supports 514 to slidingly support the sensor 504.

In a preferred embodiment, there is a first sliding support 514a, a second sliding support 514b, a third sliding support 514c, and a fourth sliding support 514d. The first sliding support 514a is preferably located adjacent to one side of the resilient couplings 512. The second sliding support 514b is preferably located adjacent to the first sliding support 514a. The third sliding support 514c is

preferably located adjacent to one side of the resilient couplings 512 and approximately perpendicular to the first sliding support 514a. The fourth sliding support 514d is preferably located adjacent to the third sliding support 514c.

The first sliding support 514a may be located a perpendicular distance ranging, for example, from about 45 to 75 mils from the first wall 524 of the cavity 516 of the housing 502 and may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the second wall 526 of the cavity 516 of the housing 502. In a preferred embodiment, the first sliding support 514a is located a perpendicular distance ranging from about 52 to 62 mils from the first wall 524 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses and located a perpendicular distance from about 90 to 105 mils from the second wall 526 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses.

The second sliding support 514b may be located a perpendicular distance ranging, for example, from about 45 to 75 mils from the first wall 524 of the cavity 516 of the housing 502 and may be located a perpendicular distance ranging, for example, from about 15 to 30 mils from the second wall 526 of the cavity 516 of the housing 502. In a preferred embodiment, the second sliding support 514b is located a perpendicular distance ranging from about 52 to 62 mils from the first wall 524 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 20 to 25 mils from the second wall 526 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses.

The third sliding support 514c may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the first wall 524 of the cavity 516 of the housing 502 and may be located a perpendicular distance ranging, for example, from about 15 to 30 mils from the second wall 526 of the cavity 516 of the housing 502. In a preferred embodiment, the third sliding support 514c is located a perpendicular distance ranging from about 90 to 105 mils from the first wall 524 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses and located a perpendicular distance

ranging from about 20 to 25 mils from the second wall 526 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses.

The fourth sliding support 514d may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the first wall 524 of the cavity 516 of the housing 502 and may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the second wall 526 of the cavity 516 of the housing 502. In a preferred embodiment, the fourth sliding support 514d is located a perpendicular distance ranging from about 90 to 105 mils from the first wall 524 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 90 to 105 mils from the second wall 526 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses. In a preferred embodiment, the sliding supports 514 are coupled to the bottom surface 532 of the cavity 516 of the housing 502 using conventional means of integrating the sliding supports 514 into the housing 502.

The electrical connections 510 preferably electrically couple the sensor 504 to the housing 502. In a preferred embodiment, the electrical connections 510 are wire bonds. The electrical connections 510 may, for example, be any number of conventional commercially available wire bonds of the type aluminum or gold.

In a preferred embodiment, the electrical connections 510 are gold in order to optimally provide compatibility with the metal of the sensor 504. In a preferred embodiment, there is a first electrical connection 510a and a second electrical connection 510b. The first electrical connection 510a preferably electrically couples the third planar surface 518c of the housing 502 to the top parallel planar surface 550 of the sensor 504. The second electrical connection 510b preferably electrically couples the fourth planar surface 518d of the housing 502 to the middle parallel planar surface 552 of the sensor 504. In a preferred embodiment, the electrical connections 510 are coupled to the housing 502 using conventional wire bonding equipment and processes. In a preferred embodiment, the electrical connections 510 are coupled to the sensor 504 using conventional wire bonding equipment and processes.

The lid assembly 506 is preferably coupled to the housing 502. The lid assembly 506 preferably includes a lid 572 and a getter 574. The lid 572 may, for example, be Kovar or ceramic. In a preferred embodiment, the lid 572 is alloy 42 in order to optimally provide vacuum sealing. The lid 572 may, for example, be plated with an assortment of metals. In a preferred embodiment, the lid 572 is plated with an industry standard composite layer of gold/nickel/gold/nickel in order to provide good solderability. In a preferred embodiment, the length L572 of the lid 572 is at least 0.010 inches less than the length of the second planar surface 518b in order to optimally provide good alignment tolerance. In a preferred embodiment, the width W572 of the lid 572 is at least 0.010 inches less than the width of the second planar surface 518b in order to optimally provide good alignment tolerance. In a preferred embodiment, the height H572 of the lid 572 ranges from about 0.01 inches to 0.02 in order to optimally provide planarity with the housing 502.

The getter 574 may, for example, be any commercially available getter. In a preferred embodiment, the length L574 of the getter 574 is about 0.125 inches less than the length L572 of the lid 572 in order to optimally provide good vacuum ambient and alignment tolerance. In a preferred embodiment, the width W574 of the getter 574 is about 0.125 inches less than the width W572 of the lid 572 in order to optimally provide good vacuum ambient and alignment tolerance. The height H574 of the getter 574 may range, for example, from about 0.005 inches to 0.020 inches. In a preferred embodiment, the height Hg of the getter 574 ranges from about 0.005 inches to 0.015 inches in order to optimally provide good vacuum ambient.

The lid 572 preferably includes a bottom surface 576. The getter 574 is preferably coupled to the bottom surface 576 of the lid 572 using conventional welding equipment and processes. The bottom surface 576 of the lid 572 is preferably coupled to the housing 502 via a solder preform 578. The solder preform 578 is preferably coupled to the second planar surface 518b of the housing 502 using conventional solder equipment and processes. The solder preform 578 may, for example, be eutectic or non-eutectic. In a preferred embodiment, the solder preform 578 is eutectic in order to optimally provide

good yield strength with a reasonable melt temperature. The solder preform 578 is preferably an approximately rectangular ring that conforms to the shape of the second planar surface 518b. In a preferred embodiment, the outer length L578 of the solder preform 578 is at least 0.010 inches less than the outer length of the second planar surface 518b in order to optimally provide good alignment tolerance. In a preferred embodiment, the exterior width W578 of the solder preform 578 is at least 0.010 inches less than the outer width of the second planar surface 518b in order to optimally provide good alignment tolerance. In a preferred embodiment, the height HggOfthe solder preform preform ranges ranges about 0.0025 inches to 0.0035 in order to optimally provide a good vacuum seal.

In a preferred embodiment, the interior length L578a of the solder preform 578 is at least as long as the interior length of the second planar surface 518b in order to optimally provide good alignment tolerance and a good solder seal. In a preferred embodiment, the interior width W578a of the solder preform 578 is at least as wide as the interior width of the second planar surface 518b in order to optimally provide good alignment tolerance and a good solder seal. The lid 572 is preferably coupled to the solder preform 578 using conventional vacuum sealing equipment and processes. The housing 502, the sensor 504, and the lid 506 are preferably vacuum-sealed to remove excess gas from the cavity 516.

The controller assembly 508 preferably includes an adhesive 580, a controller 582, one or more wire bonds 584, and an encapsulant 586. The controller assembly 508 is preferably coupled to the bottom exterior surface 522 of the housing 502. The adhesive 580 is preferably coupled to the contact pad 538. The adhesive 580 may, for example, be solder, epoxies or silicone-based. In a preferred embodiment, the adhesive 580 is silicone-based in order to optimally provide stress relief.

The controller 582 is preferably coupled to the adhesive 580. The controller 582 may, for example, be an integrated circuit chip. In a preferred embodiment, the controller 582 is an application specific integrated chip in order to optimally provide close-loop control of the sensor 504. The adhesive 580 is preferably cured using conventional curing methods for the adhesive 580 used.

The wire bonds 584 are preferably coupled to the controller 582 and the bond pads 540. The wire bonds 584 may, for example, be aluminum or gold. In a preferred embodiment, the wire bonds 584 are gold in order to optimally provide compatibility with the housing 502 metal. The wire bonds 584 preferably couple the bond pads 540 to the controller 582. The wire bonds 584 are preferably coupled to the bond pads 540 using conventional wire bonding equipment and processes. The wire bonds 584 are coupled to the controller 582 using conventional wire bonding equipment and processes.

The controller 582 and the wire bonds 584 are preferably encapsulated with the encapsulant 586. In a preferred embodiment, the depth of the encapsulant ranges from about 0.05 inches to 0.06 inches in order to optimally provide a hermetic seal. The encapsulant 586 may, for example, be glob top polymer. In a preferred embodiment, the encapsulant 586 is glob top polymer in order to optimally provide a hermetic seal. The encapsulant 586 is preferably cured using conventional curing methods for the encapsulant 586 used.

In an alternate embodiment, the housing 502 further includes circuit components. The circuit components may be integrated into the housing 502, for example, on any of the planar surfaces 518, any of the first exterior surfaces 520a, the bottom exterior surface 522, or the bottom surface 532. In a preferred embodiment, the circuit components are integrated into the bottom exterior surface 522 in order to optimally reduce the size of the sensor module 405. The circuit components may be, for example, filtering capacitors, resistors, or active components. In a preferred embodiment, the circuit components are filtering capacitors in order to optimally provide a reduced system 100 size.

In an alternate embodiment, the lid assembly 506 is optional.

In an alternate embodiment, the controller assembly 508 is optional.

In an alternate embodiment, the sliding supports 514 are optional.

In an alternate embodiment, the getter 574 is optional.

In an alternate embodiment, the exterior bond pads 536 are optional Referring to Fig. 5M, in an alternate embodiment, there is a first bond pad 564b and a second bond pad 564c. The bond pads 564b and 564c may be substantially equal in size, horizontally proximate to each other, and have an

approximately rectangular cross-sectional shape. The bond pads 564b and 564c may have an approximate total cross-sectional area ranging from about 4000 to 8750 square mils. In a preferred embodiment, the bond pads 564b and 564c have an approximate total cross-sectional area ranging from about 5625 to 7050 square mils in order to optimally minimize thermal stresses. The height Hgg of the bond pads 564b and 564c may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height H564 of the bond pads 564b and 564c range from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 5N, in an alternate embodiment, there is a bond pad 564d. The bond pad 564d may have an approximately oval cross-sectional shape.

The bond pad 564d may have an approximate cross-sectional area ranging from about 4000 to 8750 square mils. In a preferred embodiment, the bond pad 564d has an approximate cross-sectional area ranging from about 5625 to 7050 square mils in order to optimally minimize thermal stresses. The height H664 of the bond pad 564d may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height H564 of the bond pad 564d ranges from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 50, in an alternate embodiment, there is a bond pad 564e and a bond pad 564f. The bond pads 564e and 564f may be substantially equal in size, vertically proximate to each other, and have an approximately oval cross- sectional shape. The bond pads 564e and 564f may have an approximate total cross-sectional area ranging from about 4000 to 8750 square mils. In a preferred embodiment, the bond pads 564e and 564f have an approximate total cross- sectional area ranging from about 5625 to 7050 square mils in order to optimally minimize thermal stresses. The height H564 of the bond pads 564e and 564f may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height H564 of the bond pads 564e and 564f range from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 5P, in an alternate embodiment, there is a bond pad 564g. The bond pad 564g may have an approximately tri-oval cross-sectional shape. The bond pad 564g may have an approximate cross-sectional area ranging

from about 4000 to 8750 square mils. In a preferred embodiment, the bond pad 564g has an approximate cross-sectional area ranging from about 5625 to 7050 square mils in order to optimally minimize thermal stresses. The height Hgg of the bond pad 564g may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height H564 of the bond pad 564g ranges from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 5Q, in an alternate embodiment, there is a single bond pad 564h. The bond pad 564h may have an approximately oct-oval cross- sectional shape. The bond pad 564h may have an approximate cross-sectional area ranging from about 4000 to 8750 square mils. In a preferred embodiment, the bond pad 564h has an approximate cross-sectional area ranging from about 5625 to 7050 square mils in order to optimally minimize stresses. The height H564 of the bond pad 564h may range, for example, from about 0.1 to 1 micron.

In a preferred embodiment, the height H564 of the bond pad 564h ranges from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 5R, in an alternate embodiment, there is bond pad 564i and a bond pad 564j. The bond pads 564i and 564j may be substantially equal in size, vertically proximate to each other, and have an approximately rectangular cross-sectional shape. The bond pads 564i and 564j may have an approximate total cross-sectional area ranging from about 4000 to 8750 square mils. In a preferred embodiment, the bond pads 564i and 564j have an approximate total cross-sectional area ranging from about 5625 to 7050 square mils in order to optimally minimize stresses. The height H564 of the bond pads 564i and 564j may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height H564 of the bond pads 564i and 564j range from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 5S, in an alternate embodiment, there is a bond pad 564k, a bond pad 5641, and a bond pad 564m. The bond pads 564k, 5641, and 564m may be substantially equal in size, vertically proximate to each other, and have an approximately rectangular cross-sectional shape. The bond pads 564k, 5641, and 564m may have an approximate total cross-sectional area ranging from about 4000 to 8750 square mils. In a preferred embodiment, the bond pads 564k,

5641, and 564m have an approximate total cross-sectional area ranging from about 5625 to 7050 square mils in order to optimally minimize thermal stresses.

The height H664 of the bond pads 564k, 5641, and 564m may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height H564 of the bond pads 564k, 5641, and 564m range from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 5T, in an alternate embodiment, there is a single bond pad 564n. The bond pad 564n may have an approximately wavy sided rectangular cross-sectional shape. The bond pad 564n may have an approximate cross-sectional area ranging from about 4000 to 8750 square mils. In a preferred embodiment, the bond pad 564n has an approximate cross-sectional area ranging from about 5625 to 7050 square mils in order to optimally minimize thermal stresses. The height H564 of the bond pad 564n may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height H564 of the bond pad 564n ranges from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 5U, in an alternate embodiment, there is a bond pad 564o and a bond pad 564p. The bond pads 564o and 564p may be horizontally proximate to each other and have an approximately rectangular cross-sectional shape. The bond pad 564o is approximately smaller in size than the bond pad 564p. The bond pads 564o and 564p may have an approximate total cross- sectional area ranging from about 4000 to 8750 square mils. In a preferred embodiment, the bond pads 564o and 564p have an approximate total cross- sectional area ranging from about 5625 to 7050 square mils in order to optimally minimize thermal stresses. The height H564 of the bond pads 564o and 564p may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height H564 of the bond pads 564o and 564p ranges from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 5V, in an alternate embodiment, there is a resilient coupling 512b and a resilient coupling 512c that may be substantially equal and are vertically proximate to each other. The resilient couplings 512b and 512c may have an approximate total cross-sectional area ranging from about 9025 to

13225 square mils. In a preferred embodiment, the resilient couplings 512b and 512c have an approximate total cross-sectional area ranging from about 10000 to 12100 square mils in order to optimally minimize thermal stresses. The height H. 12 of the resilient couplings 512b and 512c may range, for example, from about 2 to 4 mils. In a preferred embodiment, the height H.. 12 of the resilient couplings 512b and 512c ranges from about 2.5 to 3 mils in order to optimally minimize thermal stresses.

Referring to Figs. 5W through 5Y, in several alternate embodiments, the sliding supports 514 include one or more sliding supports 514e, 514f, or 514g. In an alternate embodiment, the sliding supports 514e may have an approximately rectangular cross-sectional shape. The sliding supports 514e may have an approximate cross-sectional area ranging from 400 to 1600 square mils, individually. In a preferred embodiment, the sliding supports 514e have an approximate cross-sectional area ranging from 625 to 1225 square mils, individually, in order to optimally minimize thermal stresses. The height H, 514 of the sliding supports 514e may range, for example, from about 0.5 to 3 mils. In a preferred embodiment, the height H5l4 of the sliding supports 514e ranges from about 1 to 1.5 mils in order to optimally minimize thermal stresses.

In an alternate embodiment, the sliding supports 514f may have an approximately triangular cross-sectional shape. The sliding supports 514f may have an approximate cross-sectional area ranging from 400 to 1600 square mils, individually. In a preferred embodiment, the sliding supports 514f have an approximate cross-sectional area ranging from 625 to 1225 square mils, individually, in order to optimally minimize thermal stresses. The height H5,4 of the sliding supports 514f may range, for example, from about 0.5 to 3 mils. In a preferred embodiment, the height H5l4 of the sliding supports 514f ranges from about 1 to 1.5 mils in order to optimally minimize thermal stresses.

In an alternate embodiment, the sliding supports 514g may have an approximately circular cross-sectional shape. The sliding supports 514g may have an approximate cross-sectional area ranging from 400 to 1600 square mils, individually. In a preferred embodiment, the sliding supports 514g have an approximate cross-sectional area ranging from 625 to 1225 square mils,

individually, in order to optimally minimize thermal stresses. The height H5l4 of the sliding supports 514g may range, for example, from about 0.5 to 3 mils. In a preferred embodiment, the height H5l4 of the sliding supports 514g ranges from about 1 to 1.5 mils in order to optimally minimize thermal stresses.

Referring to Figs. 6A through 6L, an alternate embodiment of the sensor package 405 preferably includes a housing 602, the sensor 504, the lid assembly 506, and the controller assembly 508. The lid assembly 506 is preferably coupled to the top of the housing 602. The controller assembly 508 is preferably coupled to the top of the housing 602. The sensor 504 is preferably coupled within the housing 602.

The housing 602 is preferably coupled to the sensor 504, the lid assembly 506, the controller assembly 508, the electrical connections 510, the resilient couplings 512, and the sliding supports 514. The housing 602 preferably includes a cavity 604, one or more planar surfaces 606, one or more exterior surfaces 608, and a bottom exterior surface 610. The cavity 604 preferably includes a first wall 612, a second wall 614, a third wall 616, and a fourth wall 618. The first wall 612 and the third wall 616 are preferably approximately parallel to each other and the second wall 614 and the fourth wall 618 are preferably approximately parallel to each other. The second wall 614 and the fourth wall 618 are also preferably perpendicular to the first wall 612 and the third wall 616. The cavity 604 preferably includes a bottom surface 620. The bottom surface 620 may, for example, be ceramic. In a preferred embodiment, the bottom surface 620 is gold plated in order to optimally provide solderability. The housing 602 may, for example, be any number of conventional commercially available housings of the type ceramic, plastic or metal. In a preferred embodiment, the housing 602 is ceramic in order to optimally provide vacuum sealing capability.

The housing 602 preferably includes a first planar surface 606a, a second planar surface 606b, a third planar surface 606c, and a fourth planar surface 606d. The first planar surface 606a preferably includes one or more planar bond pads 622. The planar bond pads 622 are preferably approximately rectangularly shaped. The planar bond pads 622 are preferably used to wire bond the controller 508 to the housing 602. The second planar surface 606b may, for

example, be plated with a metal. In a preferred embodiment, the second planar surface 606b is plated with gold in order to optimally provide solderability. The third planar surface 606c may, for example, be plated with a metal. In a preferred embodiment, the third planar surface 606c is plated with gold in order to optimally provide wire bonding. The fourth planar surface 606d may, for example, be plated with a metal. In a preferred embodiment, the fourth planar surface 606d is plated with gold in order to optimally provide wire bonding. The resilient couplings 512, the third planar surface 606c and the fourth planar surface 606d are preferably coupled to the one of the planar bond pads 622 on the first planar surface 606a by electrical paths molded into the housing 602.

The housing 602 preferably includes a plurality of first exterior surfaces 608a and a plurality of second exterior surfaces 608b. In a preferred embodiment, there are four first exterior surfaces 608a and four second exterior surfaces 608b forming an approximate octagon. The second exterior surfaces 608b preferably couple the first exterior surfaces 608a to each other. The first exterior surfaces 608a preferably include one or more exterior bond pads 624.

The exterior bond pads 624 are preferably approximately rectangularly shaped.

The exterior bond pads 624 are preferably electrically coupled to the planar bond pads 622 by electrical paths molded into the housing 602. The exterior bond pads 624 may, for example, be used for solder paste, solder ball or leads attachment. In a preferred embodiment, the exterior bond pads 624 are used to solder the sensor package 405 to the substrate 410. In an alternate embodiment, the exterior bond pads 624 are on a single first exterior surface 608a.

The bottom exterior surface 610 of the housing 602 preferably includes one or more bond pads 626. The bond pads 626 are preferably approximately circular in shape. The bond pads 626 may, for example, used for solder paste, solder balls or leads attachments. In a preferred embodiment, the bond pads 626 are gold plated in order to optimally provide solderability. The number of bond pads 626 preferably depend on having sufficient bond pads 626 to connect the sensor module 405 to the substrate 410. The planar bond pads 622 are preferably electrically coupled to the bond pads 626 by electrical paths molded into the housing 602.

The sensor 504 is preferably resiliently attached to the housing 602 by the resilient couplings 512, slidingly supported by the sliding supports 514, and electrically coupled to the housing 602 by the electrical connections 510. The bond pads 564 are preferably located in the passive region 566 of the sensor 502.

In a preferred embodiment, there is a single approximately rectangular bond pad 564a in the passive region 566.

The resilient couplings 512 preferably resiliently attach the bond pads 564 to the housing 602. The resilient couplings 512 may electrically couple the sensor 504 to the housing 602. The resilient couplings 512 are preferably coupled to the bottom surface 620 of the cavity 604 of the housing 602. The resilient couplings 512 may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the first wall 612 of the cavity 604 of the housing 602 and may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the second wall 614 of the cavity 604 of the housing 602. In a preferred embodiment, the resilient couplings 512 are located a perpendicular distance ranging from about 7 to 12 mils from the first wall 612 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses and located a distance ranging from about 7 to 12 mils from the second wall 614 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses. In a preferred embodiment, the resilient couplings 512 are coupled to the bond pads 564 using conventional solder equipment and processes. In a preferred embodiment, the resilient couplings 512 are coupled to the bottom surface 620 of the cavity 604 of the housing 602 using conventional solder equipment and processes. In a preferred embodiment, there is a single approximately rectangular resilient coupling 512a.

The sliding supports 514 preferably slidingly support the sensor 502. The sliding supports 514 are preferably coupled to the bottom surface 620 of the cavity 604 of the housing. In a preferred embodiment, the sliding supports 514 have an approximately square cross-sectional shape. The number of sliding supports 514 preferably depends on having sufficient sliding supports 514 to slidingly support the sensor 504. In a preferred embodiment, there is the first sliding support 514a, the second sliding support 514b, the third sliding support

514c, and the fourth sliding support 514d. The first sliding support 514a is preferably located adjacent to one side of the resilient couplings 512. The second sliding support 514b is preferably located adjacent to the first sliding support 514a. The third sliding support 514c is preferably located adjacent to one side of the resilient couplings 512 and approximately perpendicular to the first sliding support 514a. The fourth sliding support 514d is preferably located adjacent to the third sliding support 514c.

The first sliding support 514a may be located a perpendicular distance ranging, for example, from about 45 to 75 mils from the first wall 612 of the cavity 604 of the housing 602 and may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the second wall 614 of the cavity 604 of the housing 602. In a preferred embodiment, the first sliding support 514a is located a perpendicular distance ranging from about 52 to 62 mils from the first wall 612 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses and located a perpendicular distance from about 90 to 105 mils from the second wall 614 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses.

The second sliding support 514b may be located a perpendicular distance ranging, for example, from about 45 to 75 mils from the first wall 612 of the cavity 604 of the housing 602 and may be located a perpendicular distance ranging, for example, from about 15 to 30 mils from the second wall 614 of the cavity 604 of the housing 602. In a preferred embodiment, the second sliding support 514b is located a perpendicular distance ranging from about 52 to 62 mils from the first wall 612 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 20 to 25 mils from the second wall 614 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses.

The third sliding support 514c may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the first wall 612 of the cavity 604 of the housing 602 and may be located a perpendicular distance ranging, for example, from about 15 to 30 mils from the second wall 614 of the cavity 604 of the housing 602. In a preferred embodiment, the third sliding

support 514c is located a perpendicular distance ranging from about 90 to 105 mils from the first wall 612 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 20 to 25 mils from the second wall 614 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses.

The fourth sliding support 514d may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the first wall 612 of the cavity 604 of the housing 602 and may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the second wall 614 of the cavity 604 of the housing 602. In a preferred embodiment, the fourth sliding support 514d is located a perpendicular distance ranging from about 90 to 105 mils from the first wall 612 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 90 to 105 mils from the second wall 614 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses. In a preferred embodiment, the sliding supports 514 are coupled to the bottom surface 620 of the cavity 604 of the housing 602 using conventional means of integrating the sliding supports 614 into the housing 602.

The electrical connections 510 preferably electrically couple the sensor 504 to the housing 602. In a preferred embodiment, there is the first electrical connection 510a and the second electrical connection 510b. The first electrical connection 510a preferably electrically couples the third planar surface 606c of the housing 602 to the top parallel planar surface 550 of the sensor 504. The second electrical connection 510b preferably electrically couples the fourth planar surface 606d of the housing 602 to the middle parallel planar surface 552 of the sensor 504. In a preferred embodiment, the electrical connections 510 are coupled to the housing 602 using conventional wire bonding equipment and processes. In a preferred embodiment, the electrical connections 510 are coupled to the sensor 504 using conventional wire bonding equipment and processes.

The lid assembly 506 is preferably coupled to the housing 602. The bottom surface 576 of the lid 572 is preferably coupled to the housing 602 via the solder preform 578. In a preferred embodiment, the length L572 of the lid 572 is

at least 0.010 inches less than the length of the second planar surface 606b in order to optimally provide good alignment tolerance. In a preferred embodiment, the width W572 of the lid 572 is at least 0.010 inches less than the width of the second planar surface 606b in order to optimally provide good alignment tolerance.

The solder preform 578 is coupled to the second planar surface 606b of the housing 602 using conventional solder equipment and processes. The solder preform 578 is preferably a rectangular ring that conforms to the shape of the second planar surface 606b. In a preferred embodiment, the outer length L578 of the solder preform 578 is at least 0.010 inches less than the outer length of the second planar surface 606b in order to optimally provide good alignment tolerance. In a preferred embodiment, the exterior width W578 of the solder preform 578 is at least 0.010 inches less than the outer width of the second planar surface 606b in order to optimally provide good alignment tolerance. In a preferred embodiment, the interior length L578a of the solder preform 578 is at least as long as the interior length of the second planar surface 606b in order to optimally provide good alignment tolerance and a good solder seal. In a preferred embodiment, the interior width W578a of the solder preform 578 is at least as wide as the interior width of the second planar surface 606b in order to optimally provide good alignment tolerance and a good solder seal. The lid 572 is preferably coupled to the solder preform 578 using conventional vacuum sealing equipment and processes. The housing 602, the sensor 504, and the lid assembly 506 are preferably vacuum-sealed to remove excess gas from the cavity 604.

The lid 572 further includes a top surface 628. The controller assembly 508 is preferably coupled to the top surface 628 of the lid 572. The adhesive 580 is preferably coupled to the top surface 628 of the lid 572. The controller 582 is preferably coupled to the adhesive 580. The adhesive 580 is preferably cured using conventional curing methods for the adhesive 580 used. The wire bonds 584 are preferably coupled to the controller 582 and the planar bond pads 622.

The wire bonds 584 are coupled to the planar bond pads 622 using conventional wire bonding equipment and processes.

In an alternate embodiment, the housing 602 further includes circuit components. The circuit components may be integrated into the housing 602, for example, on any of the planar surfaces 606 or any of the first exterior surfaces 608a. In a preferred embodiment, the circuit components are integrated into the first planar surface 606a in order to optimally reduce the size of the sensor module 405. The circuit components may be, for example, filtering capacitors, resistors, or active components. In a preferred embodiment, the circuit components are filtering capacitors in order to optimally provide a reduced system 100 size.

In an alternate embodiment, the lid assembly 506 is optional.

In an alternate embodiment, the controller assembly 508 is optional.

In an alternate embodiment, the sliding supports 514 are optional.

In an alternate embodiment, the getter 574 is optional.

In an alternate embodiment, the exterior bond pads 624 are optional.

In several alternate embodiments, the bond pads 564 may be one of the following: the bond pads 564b and 564c, the bond pad 564d, the bond pads 564e and 564f, the bond pad 564g, the bond pad 564h, the bond pads 564i and 564j, the bond pads 564k, 5641 and 564m, the bond pad 564n or the bond pads 564o and 564p as referenced to in Figs. 5M through 5U.

In an alternate embodiment, the resilient couplings 512 may be the resilient couplings 512b and 512c as referenced to in Fig. 5V.

In an alternate embodiment, the sliding supports 514 may be the sliding supports 514b, 514c or 514d as referenced to in Figs. 5W through 5Y.

Referring to Figs. 7A through 7L, an alternate embodiment of the sensor package 405 preferably includes the housing 502, the sensor 504, a lid assembly 702, and the controller assembly 508. The lid assembly 702 is preferably coupled to the top of the housing 502. The controller assembly 508 is preferably coupled to the bottom of the housing 502. The sensor 504 is preferably coupled within the housing 502.

The housing 502 is preferably coupled to the sensor 504, the lid assembly 702, the controller assembly 508, the electrical connections 510, the resilient couplings 512, and the sliding supports 514.

The sensor 504 is preferably resiliently attached to the housing 502 by the resilient couplings 512, slidingly supported by the sliding supports 514, and electrically coupled to the housing 502 by the electrical connections 510. In a preferred embodiment, there is a single approximately rectangular bond pad 564 located in the passive region 566.

The resilient couplings 512 preferably resiliently attach the bond pads 564 to the housing 502. The resilient couplings 512 may electrically couple the sensor 504 to the housing 502. The resilient couplings 512 are preferably coupled to the bottom surface 532 of the cavity 516 of the housing 502. In a preferred embodiment, there is a single approximately rectangular resilient coupling 512a.

The sliding supports 514 preferably slidingly support the sensor 504. The sliding supports 514 are preferably coupled to the bottom surface 532 of the cavity 516 of the housing 502. In a preferred embodiment, the sliding supports 514 have an approximately square cross-sectional shape. The number of sliding supports 514 preferably depends on having sufficient sliding supports 514 to slidingly support the sensor 504. In a preferred embodiment, there is the first sliding support 514a, the second sliding support 514b, the third sliding support 514c, and the fourth sliding support 514d. The first sliding support 514a is preferably located adjacent to one side of the resilient couplings 512. The second sliding support 514b is preferably located adjacent to the first sliding support 514a. The third sliding support 514c is preferably located adjacent to one side of the resilient couplings 512 and approximately perpendicular to the first sliding support 514a. The fourth sliding support 514d is preferably located adjacent to the third sliding support 514c.

The electrical connections 510 preferably electrically couple the sensor 504 to the housing 502. In a preferred embodiment, there is the first electrical connection 510a and the second electrical connection 510b. The first electrical connection 510a preferably electrically couples the third planar surface 518c of the housing 502 to the top parallel planar surface 550 of the sensor 504. The second electrical connection 510b preferably electrically couples the fourth

planar surface 518d of the housing 502 to the middle parallel planar surface 552 of the sensor 504.

The lid assembly 702 is preferably coupled to the housing 502. The lid assembly 702 preferably includes a lid 704, a getter 706 and a spring 708. The lid 704 further preferably includes a bottom surface 710 and a top surface 712. The lid 704 may, for example, be Kovar or ceramic. In a preferred embodiment, the lid 704 is alloy 42 in order to optimally provide vacuum sealing. In a preferred embodiment, the lid 704 is plated with an industry standard composite layer of gold/nickel/gold/nickel in order to provide good solderability. In a preferred embodiment, the length L704 of the lid 704 is at least 0.010 inches less than the length of the second planar surface 518b in order to optimally provide good alignment tolerance. In a preferred embodiment, the width W704 of the lid 704 is at least 0.010 inches less than the width of the second planar surface 518b in order to optimally provide good alignment tolerance. In a preferred embodiment, the height H704 of the lid 704 ranges from about 0.01 inches to 0.02 in order to optimally provide planarity with the housing 502.

The getter 706 may, for example, be any commercially available getter. In a preferred embodiment, the length L706 of the getter 706 is 0.125 inches less than the length L704 of the lid 704 in order to optimally provide good vacuum ambient and alignment tolerance. In a preferred embodiment, the width W706 of the getter 706 is 0.125 inches less than the width W704 of the lid 704 in order to optimally provide good vacuum ambient and alignment tolerance. The height H706 of the getter 706 may range, for example, from about 0.005 inches to 0.020 inches. In a preferred embodiment, the height H706 of the getter 706 ranges from about 0.005 inches to 0.015 inches in order to optimally provide good vacuum ambient.

The spring 708 may, for example, be fabricated from 0.003" stainless steel or beryllium copper strips. In a preferred embodiment the spring 708 is stainless steel in order to optimally provide good mechanical strength and stable properties. The spring 708 is preferably H-shaped. The spring preferably includes a center bar 714 and four arms 716. The spring 708 is preferably welded to the bottom surface 710 of the lid 704. The four arms 716 preferably curl

downwardly away from the bottom surface 710 of the lid 704. The four arms 716 preferably couple the bottom surface 710 of the lid 704 to the top parallel planar surface 550 of the sensor 504. The spring 708 preferably secures the sensor 504 to the resilient couplings 512. The getter 706 is preferably coupled to the bottom surface 710 of the lid 704 using conventional welding equipment and processes.

The spring 708 preferably electrically couples the sensor 504 to the housing 502.

The bottom surface 710 of the lid 704 is preferably coupled to the housing 502 via the solder preform 578. The solder preform 578 is preferably coupled to the second planar surface 518b of the housing 502 using conventional solder equipment and processes. The lid 704 is preferably coupled to the solder preform 578 using conventional vacuum sealing equipment and processes. The housing 502, the sensor 504, and the lid assembly 702 are preferably vacuum-sealed to remove excess gas from the cavity 516.

The controller assembly 508 is preferably coupled to the bottom exterior surface 522 of the housing 502. The adhesive 580 is preferably coupled to the contact pad 538. The controller 582 is preferably coupled to the adhesive 580.

The wire bonds 584 are preferably coupled to the controller 582 and the bond pads 540. The controller 582 and the wire bonds 584 are preferably encapsulated with the encapsulant 586.

In an alternate embodiment, the housing 502 further includes circuit components. The circuit components may be integrated into the housing 502, for example, on any of the planar surfaces 518 or any of the first exterior surfaces 520a. In a preferred embodiment, the circuit components are integrated into the bottom exterior surface 522 in order to optimally reduce the size of the sensor module 405. The circuit components may be, for example, filtering capacitors, resistors, or active components. In a preferred embodiment, the circuit components are filtering capacitors in order to optimally provide a reduced system 100 size.

In an alternate embodiment, the lid assembly 702 is optional.

In an alternate embodiment, the controller assembly 508 is optional.

In an alternate embodiment, the sliding supports 514 are optional.

In an alternate embodiment, the getter 706 is optional.

In an alternate embodiment, the exterior bond pads 536 are optional.

In several alternate embodiments, the bond pads 564 may be one of the following: the bond pads 564b and 564c, the bond pad 564d, the bond pads 564e and 564f, the bond pad 564g, the bond pad 564h, the bond pads 564i and 564j, the bond pads 564k, 5641 and 564m, the bond pad 564n or the bond pads 564o and 564p as referenced to in Figs. 5M through 5U.

In an alternate embodiment, the resilient couplings 512 may be the resilient couplings 512b and 512c as referenced to in Fig. 5V.

In an alternate embodiment, the sliding supports 514 may be the sliding supports 514b, 514c or 514d as referenced to in Figs. 5W through 5Y.

Referring to Figs. 8A through 8L, an alternate embodiment of the sensor package 405 preferably includes the housing 602, the sensor 504, the lid assembly 702, and the controller assembly 508. The lid assembly 702 is preferably coupled to the top of the housing 602. The controller assembly 508 is preferably coupled to the top of the housing 602. The sensor 504 is preferably coupled within the housing 602.

The housing 602 is preferably coupled to the sensor 504, the lid assembly 702, the controller assembly 508, the electrical connections 510, the resilient couplings 512, and the sliding supports 514.

The sensor 504 is preferably resiliently attached to the housing 602 by the resilient couplings 512, slidingly supported by the sliding supports 514, and electrically coupled to the housing 602 by the electrical connections 510. In a preferred embodiment, there is a single approximately rectangular bond pad 564 located in the passive region 566.

The resilient couplings 512 preferably resiliently attach the bond pads 564 to the housing 602. The resilient couplings 512 may electrically couple the sensor 504 to the housing 602. The resilient couplings 512 are preferably coupled to the bottom surface 620 of the cavity 604 of the housing 602. In a preferred embodiment, there is a single approximately rectangular resilient coupling 512.

The sliding supports 514 slidingly support the sensor 504. The sliding supports 514 are preferably coupled to the bottom surface 620 of the cavity 604

of the housing 602. In a preferred embodiment, the sliding supports 514 have an approximately square cross-sectional shape. The number of sliding supports 514 preferably depends on having sufficient sliding supports 514 to slidingly support the sensor 504. In a preferred embodiment, there is the first sliding support 514a, the second sliding support 514b, the fourth sliding support 514c, and the fourth sliding support 514d. The first sliding support 514a is preferably located adjacent to one side of the resilient couplings 512. The second sliding support 514b is preferably located adjacent to the first sliding support 514a. The third sliding support 514c is preferably located adjacent to one side of the resilient couplings 512 and approximately perpendicular to the first sliding support 514a.

The fourth sliding support 514d is preferably located adjacent to the third sliding support 514c.

The electrical connections 510 preferably electrically couple the sensor 504 to the housing 602. In a preferred embodiment, there is the first electrical connection 510a and the second electrical connection 510b. The first electrical connection 510a preferably electrically couples the third planar surface 606c of the housing 602 to the top parallel planar surface 550 of the sensor 504. The second electrical connection 510b preferably electrically couples the fourth planar surface 606d of the housing 602 to the middle parallel planar surface 552 of the sensor 504.

The lid assembly 702 is preferably coupled to the housing 602. The four arms 716 preferably couple the bottom surface of the lid 710 to the top parallel planar surface 550 of the sensor 504. The spring 708 preferably secures the sensor 504 to the resilient couplings 512. The bottom surface 710 of the lid 704 is preferably coupled to the housing 602 via the solder preform 578. The solder preform 578 is preferably coupled to the second planar surface 606b of the housing 602 using conventional solder equipment and processes. The lid 704 is preferably coupled to the solder preform 578 using conventional vacuum sealing equipment and processes. The housing 602, the sensor 504, and the lid assembly 702 are preferably vacuum-sealed to remove excess gas from the cavity 604.

The controller assembly 508 is preferably coupled to the top surface 712 of the lid 704. The adhesive 580 is preferably coupled to the top surface 712 of

the lid 704. The controller 582 is preferably coupled to the adhesive 580. The wire bonds 584 are preferably coupled to the controller 582 and the planar bond pads 622. The controller 582 and the wire bonds 584 are preferably encapsulated with the encapsulant 586.

In an alternate embodiment, the housing 602 further includes circuit components. The circuit components may be integrated into the housing 602, for example, on any of the planar surfaces 606 or any of the first exterior surfaces 608a. In a preferred embodiment, the circuit components are integrated into the first planar surface 606a in order to optimally reduce the size of the sensor module 405. The circuit components may be, for example, filtering capacitors, resistors, or active components. In a preferred embodiment, the circuit components are filtering capacitors in order to optimally provide a reduced system 100 size.

In an alternate embodiment, the lid assembly 702 is optional.

In an alternate embodiment, the controller assembly 508 is optional.

In an alternate embodiment, the sliding supports 514 are optional.

In an alternate embodiment, the getter 706 is optional.

In an alternate embodiment, the exterior bond pads 624 are optional.

In several alternate embodiments, the bond pads 564 may be one of the following: the bond pads 564b and 564c, the bond pad 564d, the bond pads 564e and 564f, the bond pad 564g, the bond pad 564h, the bond pads 564i and 564j, the bond pads 564k, 5641 and 564m, the bond pad 564n or the bond pads 564o and 564p as referenced to in Figs. 5M through 5U.

In an alternate embodiment, the resilient couplings 512 may be the resilient couplings 512b and 512c as referenced to in Fig. 5V.

In an alternate embodiment, the sliding supports 514 may be the sliding supports 514b, 514c or 514d as referenced to in Figs. 5W through 5Y.

Referring to Figs. 9A through 9N, an alternate embodiment of the sensor package 405 preferably includes the housing 502, a sensor 902, the lid assembly 506, and the controller assembly 508. The lid assembly 506 is preferably coupled to the top of the housing 502. The controller assembly 508 is preferably coupled

to the bottom of the housing 502. The sensor 902 is preferably coupled within the housing 502.

The housing 502 is preferably coupled to the sensor 902, the lid assembly 506, the controller assembly 508, the electrical connections 510, one or more resilient couplings 904, and one or more sliding supports 940.

The sensor 902 is preferably resiliently attached to the housing 502 by the resilient couplings 904, electrically coupled to the housing by the electrical connections 510, and slidingly supported by the sliding supports 940. The sensor 902 preferably has an approximately rectangular cross-sectional shape. The sensor 902 preferably includes a first passive region 928 on one end and a second passive region 930 on the opposite end. The sensor 902 preferably further includes an active region 942 located between the first passive region 928 and the second passive region 930. In a preferred embodiment, the sensor 902 includes a first member 906, a second member 908, and a third member 910. The first member 906 is preferably on top of the second member 908 and the second member 908 is preferably on top of the third member 910. In a preferred embodiment, the first member 906, the second member 908, and the third member 910 are a micro machined sensor substantially as disclosed in copending U. S. Patent Application Serial No., Attorney Docket No. 14737.737, filed on, the contents of which are incorporated herein by reference.

The first member 906 preferably includes one or more parallel planar surfaces. In a preferred embodiment, the first member 906 includes a top parallel planar surface 912. The second member 908 preferably includes one or more parallel planar surfaces. In a preferred embodiment, the second member 908 includes a middle parallel planar surface 914. The third member 910 preferably includes one or more parallel planar surfaces. In a preferred embodiment, the third member 910 includes a bottom parallel planar surface 916.

The bottom parallel planar surface 916 of the sensor 902 preferably includes a first side 918, a second side 920, a third side 922, and a fourth side 924. The first side 918 and the third side 922 are preferably approximately

parallel to each other and the second side 920 and the fourth side 924 are preferably approximately parallel to each other and preferably approximately perpendicular to the first side 918 and the third side 922.

In a preferred embodiment, the bottom parallel planar surface 916 of the sensor 902 includes one or more bond pads 926. In a preferred embodiment, there is one or more first bond pads 926a and one or more second bond pads 926b. In a preferred embodiment, the first bond pads 926a are located in the first passive region 928 of the bottom parallel planar surface 916 of the sensor 902. The first bond pads 926a may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the first side 918 of the bottom parallel planar surface 916 of the sensor 902 and may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the second side 920 of the bottom parallel planar surface 916 of the sensor 902. In a preferred embodiment, the first bond pads 926a are located a perpendicular distance ranging from about 7 to 12 mils from the first side 918 of the bottom parallel planar surface 916 of the sensor 902 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 7 to 12 mils from the second side 920 of the bottom parallel planar surface 916 of the sensor 902 in order to optimally minimize thermal stresses.

In a preferred embodiment, the second bond pads 926b are located in the second passive region 930 of the bottom parallel planar surface 916 of the sensor 902. The second bond pads 926b may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the third side 922 of the bottom parallel planar surface 916 of the sensor 902 and may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the second side 920 of the bottom parallel planar surface 916 of the sensor 902. In a preferred embodiment, the second bond pads 926b are located a perpendicular distance ranging from about 7 to 12 mils from the third side 922 of the bottom parallel planar surface 916 of the sensor 902 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 7 to 12 mils from the second side 920 of the bottom parallel planar surface 916 of the sensor 902 in order to optimally minimize thermal stresses.

The first bond pads 926a may, for example, be used for solder, conductive epoxy, non-conductive epoxy, or glass frit bonding. In a preferred embodiment, the first bond pads 926a are used for solder bonding in order to optimally provide good manufacturability. The second bond pads 926b may, for example, be used for solder, conductive epoxy, non-conductive epoxy, or glass frit bonding. In a preferred embodiment, the second bond pads 926b are used for solder bonding in order to optimally provide good manufacturability.

In a preferred embodiment, the bond pads 926 contact area is maximized in order to optimize the shock tolerance of the sensor 902. In a preferred embodiment, the bond pads 926 have minimal discontinuities in order to optimize the distribution of thermal stresses in the sensor 902. In several alternate embodiments, there is a plurality of bond pads 926 in order to optimize the relief of thermal stresses in the sensor 902.

The length Lg26a of the first bond pads 926a may range, for example, from about 180 to 240 mils. In a preferred embodiment, the length Lg26a of the first bond pads 926a range from about 200 to 220 mils in order to optimally minimize thermal stresses. The width Wg26a of the first bond pads 926a may range, for example, from about 15 to 25 mils. In a preferred embodiment, the width Wg26a of the first bond pads 926a range from about 18 to 22 mils in order to optimally minimize thermal stresses. The height Hg26a of the first bond pads 926a may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height Hg26a of the first bond pads 926a range from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses. In a preferred embodiment, there is a single approximately rectangular bond pad 926a.

The length Lg26b of the second bond pads 926b may range, for example, from about 180 to 240 mils. In a preferred embodiment, the length Lg26b of the second bond pads 926b range from about 200 to 240 mils in order to optimally minimize thermal stresses. The width Wg26b of the second bond pads 926b may range, for example, from about 15 to 25 mils. In a preferred embodiment, the width Wg26b of the second bond pads 926b range from aboutl8 to 22 mils in order to optimally minimize thermal stresses. The height Hg26b of the second bond pads 926b may range, for example, from about 0.1 to 1 micron. In a preferred

embodiment, the height Hg26b of the second bond pads 926b range from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses. In a preferred embodiment, there is a single approximately rectangular second bond pad 926b.

The resilient couplings 904 preferably resiliently attach the bond pads 926 to the housing 502. The resilient couplings 904 may electrically couple the sensor 902 to the housing 502. In a preferred embodiment, the resilient couplings 904 are solder preforms. In a preferred embodiment, the resilient couplings 904 have minimal discontinuities in order to optimize the distribution of thermal stresses in the sensor 902. In several alternate embodiments, there is a plurality of resilient couplings 904 in order to optimize the relief of thermal stresses in the sensor 902. In a more preferred embodiment, the resilient couplings 904 preferably have an approximately rectangular cross-sectional shape. The resilient couplings 904 may, for example, be any number of conventional commercially available solder preforms of the type eutectic or non- eutectic. In a preferred embodiment, the resilient couplings 904 are eutectic in order to optimally provide good yield strength with a reasonable melt temperature. In a preferred embodiment, there is one or more first resilient couplings 904a and one or more second resilient couplings 904b.

The length L9o4a of the first resilient couplings 904a may range, for example, from about 200 to 250 mils. In a preferred embodiment, the length Lg04a of the first resilient couplings 904a range from about 225 to 235 mils in order to optimally minimize thermal stresses. The width W9o4a of the first resilient couplings 904a may range, for example, from about 20 to 35 mils. In a preferred embodiment, the width W9o4a of the first resilient couplings 904a range from about 25 to 30 mils in order to optimally minimize thermal stresses. The height Hg04a of the first resilient couplings 904a may range, for example, from about 2 to 4 mils. In a preferred embodiment, the height H9o4a of the first resilient couplings 904a range from about 2.5 to 3 mils in order to optimally minimize thermal stresses.

The length L9o4b of the second resilient couplings 904b may range, for example, from about 200 to 250 mils. In a preferred embodiment, the length

Lg04b of the second resilient couplings 904b range from about 225 to 235 mils in order to optimally minimize thermal stresses. The width W9o4b of the second resilient couplings 904b may range, for example, from about 20 to 35 mils. In a preferred embodiment, the width W9o4b of the second resilient couplings 904b range from about 25 to 30 mils in order to optimally minimize thermal stresses.

The height H9o4b of the second resilient couplings 904b may range, for example, from about 2 to 4 mils. In a preferred embodiment, the height H9o4b of the second resilient couplings 904b range from about 2.5 to 3 mils in order to optimally minimize thermal stresses.

The first resilient couplings 904a may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the first wall 524 of the cavity 516 of the housing 502 and may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the second wall 526 of the cavity 516 of the housing 502. In a preferred embodiment, the first resilient couplings 904a are located a perpendicular distance ranging from about 7 to 12 mils from the first wall 524 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses and located a distance ranging from about 7 to 12 mils from the second wall 526 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses.

The second resilient couplings 904b may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the third wall 528 of the cavity 516 of the housing 502 and may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the second wall 526 of the cavity 516 of the housing 502. In a preferred embodiment, the second resilient couplings 904b are located a perpendicular distance ranging from about 7 to 12 mils from the third wall 528 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses and located a distance ranging from about 7 to 12 mils from the second wall 526 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses.

In a preferred embodiment, the first resilient couplings 904a further include one or more first bumpers 932 and one or more second bumpers 934 for slidingly supporting the sensor 902.

In a preferred embodiment, the first bumpers 932 of the first resilient couplings 904a are located on one side of the first bond pads 926a and the second bumpers 934 of the first resilient couplings 904a are located on another side of the first bond pads 926a. In a preferred embodiment, the first bumpers 932 of the first resilient couplings 904a and the second bumpers 934 of the first resilient couplings 904a are proximate to the first bond pads 926a. The width W932 of the first bumpers 932 of the first resilient couplings 904a may range, for example, from about 2 to 6 mils. In a preferred embodiment, the width W932 of the first bumpers 932 of the first resilient couplings 904a range from about 3 to 5 mils in order to optimally minimize thermal stresses. The width W934 of the second bumpers 934 of the first resilient couplings 904a may range, for example, from about 2 to 6 mils. In a preferred embodiment, the width W934 of the second bumpers 934 of the first resilient couplings 904a range from about 3 to 5 mils in order to optimally minimize thermal stresses.

In a preferred embodiment, the second resilient couplings 904b further include one or more first bumpers 936 and one or more second bumpers 938 for slidingly supporting the sensor 902. In a preferred embodiment, the first bumpers 936 of the second resilient couplings 904b are located on one side of the second bond pads 926b and the second bumpers 938 of the second resilient couplings 904b are located on another side of the second bond pads 926b. In a preferred embodiment, the first bumpers 936 of the second resilient couplings 904b and the second bumpers 938 of the second resilient couplings 904b are proximate to the second bond pads 926b. The width W936 of the first bumpers 936 of the second resilient couplings 904b may range, for example, from about 2 to 6 mils. In a preferred embodiment, the width W936 of the first bumpers 936 of the second resilient couplings 904b range from about 3 to 5 mils in order to optimally minimize thermal stresses. The width W938 of the second bumpers 938 of the second resilient couplings 904b may range for example, from about 2 to 6 mils. In a preferred embodiment, the width W938 of the second bumpers 938 of the second resilient couplings 904b range from about 3 to 5 mils in order to optimally minimize thermal stresses. In a preferred embodiment, the resilient couplings 904 are coupled to the bond pads 926 using conventional solder

equipment and processes. In a preferred embodiment, the resilient couplings 904 are coupled to the bottom surface 532 of the cavity 516 of the housing 502 using conventional solder equipment and processes. In a preferred embodiment, there is a single approximately rectangular first resilient coupling 904a. In a preferred embodiment, there is a single approximately rectangular second resilient coupling 904b.

The sliding supports 940 preferably slidingly support the sensor 902. The sliding supports 940 are preferably coupled to the bottom surface 536 of the cavity 516 of the housing 502. In a preferred embodiment, the sliding supports 940 preferably have an approximately square cross sectional shape. The number of sliding supports 940 preferably depends on having sufficient sliding supports 940 to slidingly support the sensor 902. The sliding supports 940 may, for example, be tungsten or ceramic. In a preferred embodiment, the sliding supports 940 are tungsten in order to optimally provide a standard packaging process. The cross-sectional area of the sliding supports 940 may range, for example, from about 400 to 1600 square mils, individually. In a preferred embodiment, the cross sectional area of the sliding supports 940 ranges from about 625 to 1225 square mils, individually, in order to optimally minimize thermal stresses. The height H940 of the sliding supports 940 may range, for example, from about 0.5 to 3 mils. In a preferred embodiment, the height Hg40 of the sliding supports 940 ranges from about 1 to 1.5 mils in order to optimally minimize thermal stresses.

In a preferred embodiment, there is a first sliding support 940a, a second sliding support 940b, a third sliding support 940c, and a fourth sliding support 940d. The first sliding support 940a is preferably located adjacent to one side of the first resilient couplings 926a. The second sliding support 940b is preferably located adjacent to the first sliding support 940a. The third sliding support 940c is preferably located adjacent to one side of the resilient couplings 926a and approximately perpendicular to the first sliding support 940a. The fourth sliding support 940d is preferably located adjacent to the third sliding support 940c.

The first sliding support 940a may be located a perpendicular distance ranging, for example, from about 45 to 75 mils from the first wall 524 of the

cavity 516 of the housing 502 and may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the second wall 526 of the cavity 516 of the housing 502. In a preferred embodiment, the first sliding support 940a is located a perpendicular distance ranging from about 52 to 62 mils from the first wall 524 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses and located a perpendicular distance from about 90 to 105 mils from the second wall 526 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses.

The second sliding support 940b may be located a perpendicular distance ranging, for example, from about 45 to 75 mils from the first wall 524 of the cavity 516 of the housing 502 and may be located a perpendicular distance ranging, for example, from about 15 to 30 mils from the second wall 526 of the cavity 516 of the housing 502. In a preferred embodiment, the second sliding support 940b is located a perpendicular distance ranging from about 52 to 62 mils from the first wall 524 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 20 to 25 mils from the second wall 526 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses.

The third sliding support 940c may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the first wall 524 of the cavity 516 of the housing 502 and may be located a perpendicular distance ranging, for example, from about 15 to 30 mils from the second wall 526 of the cavity 516 of the housing 502. In a preferred embodiment, the third sliding support 940c is located a perpendicular distance ranging from about90 to 105 mils from the first wall 524 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses and located a perpendicular distance from about 20 to 25 mils from the second wall 526 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses.

The fourth sliding support 940d may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the first wall 524 of the cavity 516 of the housing 502 and may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the second wall 526 of the

cavity 516 of the housing 502. In a preferred embodiment, the fourth sliding support 940d is located a perpendicular distance ranging from about 90 to 105 mils from the first wall 524 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses and located a perpendicular distance from about 90 to 105 mils from the second wall 526 of the cavity 516 of the housing 502 in order to optimally minimize thermal stresses. In a preferred embodiment, the sliding supports 940 are coupled to the bottom surface 532 of the cavity 516 of the housing 502 using conventional means of integrating the sliding supports 940 into the housing 502.

The electrical connections 510 preferably electrically couple the sensor 902 to the housing 502. In a preferred embodiment, there is the first electrical connection 510a and the second electrical connection 510b. The first electrical connection 510a preferably electrically couples the third planar surface 518c of the housing to the top parallel planar surface 912 of the sensor 902. The second electrical connection 510b preferably electrically couples the fourth planar surface 518d of the housing 502 to the middle parallel planar surface 914 of the sensor 902. In a preferred embodiment, the electrical connections 510 are coupled to the housing 502 using conventional wire bonding equipment and processes. In a preferred embodiment, the electrical connections 510 are coupled to the sensor 902 using conventional wire bonding equipment and processes.

The lid assembly 506 is preferably coupled to the housing 502. The bottom surface 576 of the lid 572 is preferably coupled to the housing 502 via the solder preform 578. The solder preform 578 is preferably coupled to the second planar surface 518b of the housing 502 using conventional solder equipment and processes. The solder preform 578 is preferably a rectangular ring that conforms to the shape of the second planar surface 518b. The lid 572 is preferably coupled to the solder preform 578 using conventional vacuum sealing equipment and processes. The housing 502, the sensor 902, and the lid 506 are preferably vacuum-sealed to remove excess gas from the cavity 516.

The controller assembly 508 is preferably coupled to the bottom exterior surface 522 of the housing 502. The adhesive 580 is preferably coupled to the contact pad 538. The controller 582 is preferably coupled to the adhesive 580.

The wire bonds 584 are preferably coupled to the controller 582 and the bond pads 540. The wire bonds 584 are coupled to the bond pads 540 using conventional wire bonding equipment and processes. The wire bonds 584 are coupled to the controller 582 using conventional wire bonding equipment and processes. The controller 582 and the wire bonds 584 are preferably encapsulated with the encapsulant 586.

In an alternate embodiment, the second passive region 930 is optional.

The second bond pads 926b are located in the active region 942.

In an alternate embodiment, the housing 502 further includes circuit components. The circuit components may be integrated into the housing 502, for example, on any of the planar surfaces 518 or any of the first exterior surfaces 520a. In a preferred embodiment, the circuit components are integrated into the bottom exterior surface 522 in order to optimally reduce the size of the sensor module 405. The circuit components may be, for example, filtering capacitors, resistors, or active components. In a preferred embodiment, the circuit components are filtering capacitors in order to optimally provide reduced system 100 size.

In an alternate embodiment, the lid assembly 506 is optional.

In an alternate embodiment, the controller assembly 508 is optional.

In an alternate embodiment, the sliding supports 940 are optional.

In an alternate embodiment, the getter 574 is optional.

In an alternate embodiment, the bond pads 926 are not the same shape.

In an alternate embodiment, the exterior bond pads 536 are optional.

Referring to Fig. 90, in an alternate embodiment, the bond pads 926 include a bond pad 926c and a bond pad 926d. The bond pads 926c and 926d may be substantially equal in size, horizontally proximate to each other, and have an approximately rectangular cross-sectional shape. The bond pads 926c and 926d may have an approximate total cross-sectional area ranging from about 4000 to 8750 square mils. In a preferred embodiment, the bond pads 926c and 926d have an approximate total cross-sectional area ranging from about 5625 to 7050 square mils in order to optimally minimize thermal stresses. The height Hg26 of the bond pads 926c and 926d may range, for example, from about 0.1 to 1

micron. In a preferred embodiment, the height Hg26 of the bond pads 926c and 926d range from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 9P, in an alternate embodiment, the bond pads 926 include a bond pad 926e. The bond pad 926e may have an approximately oval cross-sectional shape. The bond pad 926e may have an approximate cross- sectional area ranging from about 4000 to 8750 square mils. In a preferred embodiment, the bond pad 12 has an approximate cross-sectional area ranging from about 5625 to 7050 square mils in order to optimally minimize thermal stresses. The height Hg26 of the bond pad 926e may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height Hg26 of the bond pad 926e ranges from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 9Q, in an alternate embodiment, the bond pads 926 include a bond pad 926f and a bond pad 926g. The bond pads 926f and 926g may be substantially equal in size, vertically proximate to each other, and have an approximately oval cross-sectional shape. The bond pads 926f and 926g may have an approximate total cross-sectional area ranging from about 4000 to 8750 square mils. In a preferred embodiment, the bond pads 926f and 926g have an approximate total cross-sectional area ranging from about 5625 to 7050 square mils in order to optimally minimize thermal stresses. The height Hg26 of the bond pads 926f and 926g may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height Hg26 of the bond pads 926f and 926g range from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 9R, in an alternate embodiment, the bond pads 926 include a bond pad 926h. The bond pad 926h may have an approximately tri-oval cross-sectional shape. The bond pad 926h may have an approximate cross- sectional area ranging from about 4000 to 8750 square mils. In a preferred embodiment, the bond pad 926h have an approximate cross-sectional area ranging from about 5625 to 7050 square mils in order to optimally minimize thermal stresses. The height Hg26 of the bond pad 926h may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height Hg26 of the

bond pad 926h ranges from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 9S, in an alternate embodiment, the bond pads 926 include a bond pad 926i. The bond pad 926i may have an approximately oct-oval cross-sectional shape. The bond pad 926i may have an approximate cross- sectional area ranging from about 4000 to 8750 square mils. In a preferred embodiment, the bond pad 926i have an approximate cross-sectional area ranging from about 5625 to 7050 square mils in order to optimally minimize thermal stresses. The height H926 of the bond pad 926i may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height Hg26 of the bond pad 926i ranges from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 9T, in an alternate embodiment, the bond pads 926 include a bond pad 926j and a bond pad 926k. The bond pads 926 j and 926k may be substantially equal in size, vertically proximate to each other, and have an approximately rectangular cross-sectional shape. The bond pads 926j and 926k may have an approximate total cross-sectional area ranging from about 4000 to 8750 square mils. In a preferred embodiment, the bond pads 926j and 926k have an approximate total cross-sectional area ranging from 5625 to 7050 square mils in order to optimally minimize thermal stresses. The height Hg26 of the bond pads 926j and 926k may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height Hg26 of the bond pads 926j and 926k range from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 9U, in an alternate embodiment, the bond pads 926 include a bond pad 9261, a bond pad 926m, and a bond pad 926n. The bond pads 9261,926m, and 926n may be substantially equal in size, vertically proximate to each other, and have an approximately rectangular cross-sectional shape. The bond pads 9261,926m, and 926n may have an approximate total cross-sectional area ranging from about 4000 to 8750 square mils. In a preferred embodiment, the bond pads 9261,926m, and 926n have an approximate total cross-sectional area ranging from about 5625 to 7050 square mils in order to optimally minimize thermal stresses. The height Hg26 of the bond pads 9261,926m and

926n may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height Hg26 of the bond pads 9261,926m and 926n ranges from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 9V in an alternate embodiment, the bond pads 926 include a bond pad 926o. The bond pad 926o may have an approximately wavy sided rectangular cross-sectional shape. The bond pad 926o may have an approximate cross-sectional area ranging from about 4000 to 8750 square mils.

In a preferred embodiment, the bond pad 926o have an approximate cross- sectional area ranging from about 5625 to 7050 square mils in order to optimally provide minimize thermal stresses. The height Hg26 of the bond pad 926o may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height Hg26 of the bond pad 926o ranges from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 9W, in an alternate embodiment, the bond pads 926 include a bond pad 926p and a bond pad 926q. The bond pads 926p and 926q may be horizontally proximate to each other and have an approximately rectangular cross-sectional shape. The bond pad 926p is approximately smaller in size than the second bond pad 926q. The bond pads 926p and 926q may have an approximate total cross-sectional area ranging from about 4000 to 8750 square mils. In a preferred embodiment, the bond pads 926p and 926q have an approximate total cross-sectional area ranging from about 5625 to 7050 square mils in order to optimally minimize thermal stresses. The height Hg26 of the bond pads 926p and 926q may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height H926 of the bond pads 926p and 926q range from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 9X, in an alternate embodiment, the resilient couplings 904 include a resilient coupling 904c and a resilient coupling 904d that are substantially equal and are vertically proximate to each other. The resilient couplings 904c and 904d may have an approximate total cross-sectional area ranging from about 9025 to 13225 square mils. In a preferred embodiment, the resilient couplings 904c and 904d have an approximate total cross-sectional area ranging from about 10000 to 12100 in order to optimally minimize thermal

stresses. The height Hg of the resilient couplings 904c and 904d may range, for example, from about 2 to 4 mils. In a preferred embodiment, the height Hg04 of the resilient couplings 904c and 904d range from about 2.5 to 3 mils in order to optimally minimize thermal stresses.

Referring to Fig. 9Y through 9AA, in several alternate embodiments, the sliding supports 940 include one or more sliding supports 940e, 940f, or 940g. In an alternate embodiment, the sliding support 940e may have an approximately rectangular cross-sectional shape. The sliding supports 940e may have an approximate cross-sectional area ranging from 400 to 1600 square mils, individually. In a preferred embodiment, the sliding supports 940e have an approximate cross-sectional area ranging from 625 to 1225 square mils, individually, in order to optimally minimize thermal stresses. The height Hg40 of the sliding supports 940e may range, for example, from about 0.5 to 3 mils. In a preferred embodiment, the height H94o of the sliding supports 940e ranges from about 1 to 1.5 mils in order to optimally minimize thermal stresses.

In an alternate embodiment, the sliding supports 940f may have an approximately triangular cross-sectional shape. The sliding supports 940f may have an approximate cross-sectional area ranging from 400 to 1600 square mils, individually. In a preferred embodiment, the sliding supports 940f have an approximate cross-sectional area ranging from 625 to 1225 square mils, individually, in order to optimally minimize thermal stresses. The height Hg40 of the sliding supports 940f may range, for example, from about 0.5 to 3 mils. In a preferred embodiment, the height Ho40 ouf the sliding supports 940f ranges from about 1 to 1.5 mils in order to optimally minimize thermal stresses.

In an alternate embodiment, the sliding supports 940g may have an approximately circular cross-sectional shape. The sliding supports 940g may have an approximate cross-sectional area ranging from 400 to 1600 square mils, individually. In a preferred embodiment, the sliding supports 940g have an approximate cross-sectional area ranging from 625 to 1225 square mils, individually, in order to optimally minimize thermal stresses. The height Hg40 of the sliding supports 940g may range, for example, from about 0.5 to 3 mils. In a

preferred embodiment, the height Hg of the sliding supports 940g ranges from about 1 to 1.5 mils in order to optimally minimize thermal stresses.

Referring to Figs. 10A through 10N, an alternate embodiment of the sensor package 405 preferably includes the housing 602, the sensor 902, the lid assembly 506, and the controller assembly 508. The lid assembly 506 is preferably coupled to the top of the housing 602. The controller assembly 508 is preferably coupled to the top of the housing 602. The sensor 902 is preferably coupled within the housing 602.

The housing 602 is preferably coupled to the sensor 904, the lid assembly 506, the controller assembly 508, the electrical connections 510, the resilient couplings 904, and the sliding supports 940.

The sensor 902 is preferably resiliently attached to the housing 602 by the resilient couplings 904, electrically coupled to the housing 602 by the electrical connections 510, and slidingly supported by the sliding supports 940. In a preferred embodiment, there is the single approximately rectangular first bond pad 926a located in the first passive region 928 of the sensor 902 and the single approximately rectangular second bond pad 926b located in the second passive region 930 of the sensor 902.

The resilient couplings 904 preferably resiliently attach the bond pads 926 to the housing 602. The resilient couplings 904 may electrically couple the sensor 902 to the housing 602. The first resilient couplings 904a may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the first wall 612 of the cavity 604 of the housing 602 and may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the second wall 614 of the cavity 604 of the housing 602. In a preferred embodiment, the first resilient couplings 904a are located a perpendicular distance ranging from about 7 to 12 mils from the first wall 612 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses and located a distance ranging from about 7 to 12 mils from the second wall 614 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses. The second resilient couplings 904b may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the third wall 616 of the cavity 604 of

the housing 602 and may be located a perpendicular distance ranging, for example, from about 5 to 25 mils from the second wall 614 of the cavity 604 of the housing 602. In a preferred embodiment, the second resilient couplings 904b are located a perpendicular distance ranging from about 7 to 12 mils from the third wall 616 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses and located a distance ranging from about 7 to 12 mils from the second wall 614 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses. In a preferred embodiment, the resilient couplings 904 are coupled to the bond pads 926 using conventional solder equipment and processes. In a preferred embodiment, the resilient couplings 904 are coupled to the bottom surface 620 of the cavity 604 of the housing 602 using conventional solder equipment and processes. In a preferred embodiment, there is the single approximately rectangular first resilient coupling 904a and the single approximately rectangular second resilient coupling 904b.

The sliding supports 940 are preferably coupled to the bottom surface 620 of the cavity 604 of the housing. In a preferred embodiment, the sliding supports 940 have an approximately square cross sectional shape. The number of sliding supports 940 preferably depends on having sufficient sliding supports 940 to slidingly support the sensor 902. In a preferred embodiment, there is the first sliding support 940a, the second sliding support 940b, the third sliding support 940c, and the fourth sliding support 940d. The first sliding support 940a is preferably located adjacent to one side of the first resilient couplings 904a. The second sliding support 940b is preferably located adjacent to the first sliding support 940a. The third sliding support 940c is preferably located adjacent to one side of the first resilient couplings 904a and approximately perpendicular to the first sliding support 940a. The fourth sliding support 940d is preferably located adjacent to the third sliding support 940c.

The first sliding support 940a may be located a perpendicular distance ranging, for example, from about 45 to 75 mils from the first wall 612 of the cavity 604 of the housing 602 and may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the second wall 614 of the cavity 604 of the housing 602. In a preferred embodiment, the first sliding

support 940a is located a perpendicular distance ranging from about 52 to 62 mils from the first wall 612 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses and located a perpendicular distance from about 90 to 105 mils from the second wall 614 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses.

The second sliding support 940b may be located a perpendicular distance ranging, for example, from about 45 to 75 mils from the first wall 612 of the cavity 604 of the housing 602 and may be located a perpendicular distance ranging, for example, from about 15 to 30 mils from the second wall 614 of the cavity 604 of the housing 602. In a preferred embodiment, the second sliding support 940b is located a perpendicular distance ranging from about 52 to 62 mils from the first wall 612 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 20 to 25 mils from the second wall 614 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses.

The third sliding support 940c may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the first wall 612 of the cavity 604 of the housing 602 and may be located a perpendicular distance ranging, for example, from about 15 to 30 mils from the second wall 614 of the cavity 604 of the housing 602. In a preferred embodiment, the third sliding support 940c is located a perpendicular distance ranging from about 90 to 105 mils from the first wall 612 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 20 to 25 mils from the second wall 614 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses.

The fourth sliding support 940d may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the first wall 612 of the cavity 604 of the housing 602 and may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the second wall 614 of the cavity 604 of the housing 602. In a preferred embodiment, the fourth sliding support 940d is located a perpendicular distance ranging from about 90 to 105 mils from the first wall 612 of the cavity 604 of the housing 602 in order to

optimally minimize thermal stresses and located a perpendicular distance ranging from about 90 to 105 mils from the second wall 614 of the cavity 604 of the housing 602 in order to optimally minimize thermal stresses. In a preferred embodiment, the sliding supports 940 are coupled to the bottom surface 620 of the cavity 604 of the housing 602 using conventional means of integrating the sliding supports 940 into the housing 602.

The electrical connections 510 preferably electrically couple the sensor 902 to the housing 602. In a preferred embodiment, there is the first electrical connection 510a and the second electrical connection 510b. The first electrical connection 510a preferably electrically couples the third planar surface 606c of the housing to the top parallel planar surface 912 of the sensor 902. The second electrical connection 510b preferably electrically couples the fourth planar surface 606d of the housing 602 to the middle parallel planar surface 914 of the sensor 902. In a preferred embodiment, the electrical connections 510 are coupled to the housing 602 using conventional wire bonding equipment and processes. In a preferred embodiment, the electrical connections 510 are coupled to the sensor 902 using conventional wire bonding equipment and processes.

The lid assembly 506 is preferably coupled to the housing 602. The bottom surface 576 of the lid 572 is preferably coupled to the housing 602 via the solder preform 578. The solder preform 578 is preferably coupled to the second planar surface 606b of the housing 602 using conventional solder equipment and processes. The solder preform 578 is preferably a rectangular ring that conforms to the shape of the second planar surface 606b. The lid 572 is preferably coupled to the solder preform 578 using conventional vacuum sealing equipment and processes. The housing 602, the sensor 902, and the lid 506 are preferably vacuum-sealed to remove excess gas from the cavity 604.

The lid 572 further includes the top surface 628. The controller assembly 508 is preferably coupled to the top surface 628 of the lid 572. The adhesive 580 is preferably coupled to the top surface 628 of the lid 572. The controller 582 is preferably coupled to the adhesive 580. The adhesive 580 is preferably cured using conventional curing methods for the adhesive 580 used. The wire bonds 584 are preferably coupled to the controller 582 and the planar bond pads 622.

The wire bonds 584 are coupled to the planar bond pads 622 using conventional wire bonding equipment and processes.

In an alternate embodiment, the second passive region 930 is optional.

The second bond pads 926b are preferably located in the active region 942.

In an alternate embodiment, the housing 602 further includes circuit components. The circuit components may be integrated into the housing 602, for example, on any of the planar surfaces 606 or any of the first exterior surfaces 608a. In a preferred embodiment, the circuit components are integrated into the first planar surface 606a in order to optimally reduce the size of the sensor module. The circuit components may be, for example, filtering capacitors, resistors, or active components. In a preferred embodiment, the circuit components are filtering capacitors in order to optimally reduce system 100 size.

In an alternate embodiment, the lid assembly 506 is optional.

In an alternate embodiment, the controller assembly 508 is optional.

In an alternate embodiment, the sliding supports 940 are optional.

In an alternate embodiment, the getter 574 is optional.

In an alternate embodiment, the bond pads 926 are not the same shape.

In an alternate embodiment, the exterior bond pads 624 are optional.

In several alternate embodiments, the bond pads 926 may be one of the following: the bond pads 926c and 926d, the bond pad 926e, the bond pads 926f and 926g, the bond pad 926h, the bond pad 926i, the bond pads 926j and 926k, the bond pads 9261,926m and 926n, the bond pad 926o or the bond pads 926p and 926q as referenced to in Figs. 90 through 9W.

In an alternate embodiment, the resilient couplings 904 may be the resilient couplings 904c and 904d as referenced to in Fig. 9X.

In several alternate embodiments, the sliding supports 940 may be the sliding supports 940e, 940f, or 940g as referenced to in Figs. 9Y through 9AA.

Referring to Figs. 11A through 11N, an alternate embodiment of the sensor package 405 preferably includes the housing 502, the sensor 902, the lid assembly 702, and the controller assembly 508. The lid assembly 702 is preferably coupled to the top of the housing 502. The controller assembly 508 is

preferably coupled to the bottom of the housing 502. The sensor 902 is preferably coupled within the housing 502.

The housing 502 is preferably coupled to the sensor 902, the lid assembly 702, the controller assembly 508, the electrical connections 510, the resilient couplings 904, and the sliding supports 940.

The sensor 902 is preferably resiliently attached to the housing 502 by the resilient couplings 904, electrically coupled to the housing 502 by the electrical connections 510, and slidingly supported by the sliding supports 940. In a preferred embodiment, there is the single approximately rectangular first bond pad 926a located in the first passive region 928 of the sensor 902 and the single approximately rectangular second bond pad 926b located in the second passive region 930 of the sensor 902.

The resilient couplings 904 preferably resiliently attach the bond pads 926 to the housing 502. The resilient couplings 904 may electrically couple the sensor 902 to the housing 502. The resilient couplings 904 are preferably coupled to the bottom surface 532 of the cavity 516 of the housing 502. In a preferred embodiment, there is the single approximately rectangular first resilient coupling 904a and the single approximately rectangular second resilient coupling 904b.

The sliding supports 940 are preferably coupled to the bottom surface 532 of the cavity 516 of the housing 502. In a preferred embodiment, the sliding supports 940 preferably have an approximately square cross sectional shape. The number of sliding supports 940 preferably depends on having sufficient sliding supports 940 to slidingly support the sensor 902. In a preferred embodiment, there is the first sliding support 940a, the second sliding support 940b, the third sliding support 940c, and the fourth sliding support 940d. The first sliding support 940a is preferably located adjacent to one side of the first resilient couplings 904a. The second sliding support 940b is preferably located adjacent to the first sliding support 940a. The third sliding support 940c is preferably located adjacent to one side of the first resilient couplings 904a and approximately perpendicular to the first sliding support 940a. The fourth sliding support 940d is preferably located adjacent to the third sliding support 940c.

The electrical connections 510 preferably electrically couple the sensor 902 to the housing 502. In a preferred embodiment, there is the first electrical connection 510a and the second electrical connection 510b. The first electrical connection 510a preferably electrically couples the third planar surface 518c of the housing 502 to the top parallel planar surface 912 of the sensor 902. The second electrical connection 510b preferably electrically couples the fourth planar surface 518d of the housing 502 to the middle parallel planar surface 914 of the sensor 902.

The lid assembly 702 is preferably coupled to the housing 502. The four arms 716 preferably couple the bottom surface of the lid 710 to the top parallel planar surface 912 of the sensor 902. The spring 708 preferably secures the sensor 902 to the resilient couplings 904. The bottom surface 710 of the lid 704 is preferably coupled to the housing 502 via the solder preform 578. The solder preform 578 is preferably coupled to the second planar surface 518b of the housing 502 using conventional soldering equipment and processes. The lid 704 is preferably coupled to the solder preform 578 using conventional vacuum sealing equipment and processes. The housing 502, the sensor 902, and the lid assembly 702 are preferably vacuum-sealed to remove excess gas from the cavity 516.

The controller assembly 508 is preferably coupled to the bottom exterior surface 522 of the housing 502. The adhesive 580 is preferably coupled to the contact pad 538. The controller 582 is preferably coupled to the adhesive 580.

The wire bonds 584 are preferably coupled to the controller 582 and the bond pads 540. The controller 582 and the wire bonds 584 are preferably encapsulated with the encapsulant 586.

In an alternate embodiment, the second passive region 930 is optional.

The second bond pads 926b are preferably located in the active region 942.

In an alternate embodiment, the housing 502 further includes circuit components. The circuit components may be integrated into the housing 502, for example, on any of the planar surfaces 518 or any of the first exterior surfaces 520a. In a preferred embodiment, the circuit components are integrated into the bottom exterior surface 522 in order to optimally reduce the size of the sensor

module 405. The circuit components may be, for example, filtering capacitors, resistors, or active components. In a preferred embodiment, the circuit components are filtering capacitors in order to optimally reduce system 100 size.

In an alternate embodiment, the lid assembly 702 is optional.

In an alternate embodiment, the controller assembly 508 is optional.

In an alternate embodiment, the sliding supports 940 are optional.

In an alternate embodiment, the getter 706 is optional.

In an alternate embodiment, the bond pads 926 are not the same shape.

In an alternate embodiment, the exterior bond pads 536 are optional.

In several alternate embodiments, the bond pads 926 may be one of the following: the bond pads 926c and 926d, the bond pad 926e, the bond pads 926f and 926g, the bond pad 926h, the bond pad 926i, the bond pads 926j and 926k, the bond pads 9261,926m and 926n, the bond pad 926o or the bond pads 926p and 926q as referenced to in Figs. 90 through 9W.

In an alternate embodiment, the resilient couplings 904 may be the resilient couplings 904c and 904d as referenced to in Fig. 9X.

In several alternate embodiments, the sliding supports 940 may be the sliding supports 940e, 940f, or 940g as referenced to in Figs. 9Y through 9AA.

Referring to Figs. 12A through 12N, an alternate embodiment of the sensor package 405 preferably includes the housing 602, the sensor 902, the lid assembly 702, and the controller assembly 508. The lid assembly 702 is preferably coupled to the top of the housing 602. The controller assembly 508 is preferably coupled to the top of the housing 602. The sensor 902 is preferably coupled within the housing 602.

The housing 602 is preferably coupled to the sensor 902, the lid assembly 702, the controller assembly 508, the electrical connections 510, the sliding supports 940 and the resilient couplings 904.

The sensor 902 is preferably resiliently attached to the housing 602 by the resilient couplings 904, slidingly supported by the sliding supports 940 and electrically coupled to the housing 602 by the electrical connections 510. In a preferred embodiment, there is the single approximately rectangular first bond pad 926a located in the first passive region 928 of the sensor 902 and the single

approximately rectangular second bond pad 926b located in the second passive region 930 of the sensor 902.

The resilient couplings 904 preferably resiliently attaches the bond pads 926 to the housing 602. The resilient couplings 904 may electrically couple the sensor 902 to the housing 602. The resilient couplings 904 are preferably coupled to the bottom surface 620 of the cavity 604 of the housing 602. In a preferred embodiment, there is the single approximately rectangular first resilient coupling 904a and the single approximately rectangular second resilient coupling 904b.

The sliding supports 940 are preferably coupled to the bottom surface 620 of the cavity 604 of the housing. In a preferred embodiment, the sliding supports 940 preferably have an approximately square cross sectional shape. The number of sliding supports 940 preferably depends on having sufficient sliding supports 940 to slidingly support the sensor 902. In a preferred embodiment, there is the first sliding support 940a, the second sliding support 940b, the third sliding support 940c, and the fourth sliding support 940d. The first sliding support 940a is preferably located adjacent to one side of the first resilient couplings 904a.

The second sliding support 940b is preferably located adjacent to the first sliding support 940a. The third sliding support 940c is preferably located adjacent to one side of the first resilient couplings 904a and approximately perpendicular to the first sliding support 940a. The fourth sliding support 940d is preferably located adjacent to the third sliding support 940c.

The electrical connections 510 preferably electrically couple the sensor 902 to the housing 602. In a preferred embodiment, there is the first electrical connection 510a and the second electrical connection 510b. The first electrical connection 510a preferably electrically couples the third planar surface 606c of the housing 602 to the top parallel planar surface 912 of the sensor 902. The second electrical connection 510b preferably electrically couples the fourth planar surface 606d of the housing 602 to the middle parallel planar surface 914 of the sensor 504.

The lid assembly 702 is preferably coupled to the housing 602. The four arms 716 preferably couple the bottom surface of the lid 710 to the top parallel

planar surface 912 of the sensor 902. The spring 708 preferably secures the sensor 902 to the resilient couplings 904. The bottom surface 710 of the lid 704 is preferably coupled to the housing 602 via the solder preform 578. The solder preform 578 is preferably coupled to the second planar surface 606b of the housing 602 using conventional soldering equipment and processes. The lid 704 is preferably coupled to the solder preform 578 using conventional vacuum sealing equipment and processes. The housing 602, the sensor 902, and the lid assembly 702 are vacuum-sealed to remove excess gas from the cavity 604.

The controller assembly 508 is preferably coupled to the top surface 712 of the lid 704. The adhesive 580 is preferably coupled to the top surface 712 of the lid 704. The controller 582 is preferably coupled to the adhesive 580. The wire bonds 584 are preferably coupled to the controller 582 and the planar bond pads 622. The controller 582 and the wire bonds 584 are preferably encapsulated with the encapsulant 586.

In an alternate embodiment, the second passive region 930 is optional.

The second bond pads 926b are preferably located in the active region 942.

In an alternate embodiment, the housing 602 further includes circuit components. The circuit components may be integrated into the housing 602, for example, on any of the planar surfaces 606 or any of the first exterior surfaces 608a. In a preferred embodiment, the circuit components are integrated into the first planar surface 606a in order to optimally reduce the size of the sensor module 405. The circuit components may be, for example, filtering capacitors, resistors, or active components. In a preferred embodiment, the circuit components are filtering capacitors in order to optimally reduce system 100 size.

In an alternate embodiment, the lid assembly 702 is optional.

In an alternate embodiment, the controller assembly 508 is optional.

In an alternate embodiment, the sliding supports 940 are optional.

In an alternate embodiment, the getter 706 is optional.

In an alternate embodiment, the bond pads 926 are not the same shape.

In an alternate embodiment, the exterior bond pads 624 are optional.

In several alternate embodiments, the bond pads 926 may be one of the following: the bond pads 926c and 926d, the bond pad 926e, the bond pads 926f

and 926g, the bond pad 926h, the bond pad 926i, the bond pads 926j and 926k, the bond pads 9261,926m and 926n, the bond pad 926o or the bond pads 926p and 926q as referenced to in Figs. 90 through 9W.

In an alternate embodiment, the resilient couplings 904 may be the resilient couplings 904c and 904d as referenced to in Fig. 9X.

In several alternate embodiments, the sliding supports 940 may be the sliding supports 940e, 940f, or 940g as referenced to in Figs. 9Y through 9AA.

Referring to Figs. 13A through 13L, an alternate embodiment of the sensor package 405 preferably includes a housing 1302, a sensor 1304, the lid assembly 506, and the controller assembly 508. The lid assembly 506 is preferably coupled to the top of the housing 1302. The controller assembly 508 is preferably coupled to the bottom of the housing 1302. The sensor 1304 is preferably coupled within the housing 1302.

The housing 1302 is preferably coupled to the sensor 1304, the lid assembly 506, the controller assembly 508, the electrical connections 510, one or more sliding supports 1372, and one or more resilient couplings 1306. The housing preferably includes a cavity 1308, one or more planar surfaces 1310, one or more exterior surfaces 1312, and a bottom exterior surface 1314. The cavity 1308 preferably includes a first wall 1316, a second wall 1318, a third wall 1320 and a fourth wall 1322. The first wall 1316 and the third wall 1320 are preferably approximately parallel to each other and the second wall 1318 and the fourth wall 1322 are preferably approximately parallel to each other. The second wall 1318 and the fourth 1322 wall are also preferably perpendicular to the first wall 1316 and the third wall 1320. The cavity 1308 preferably includes a bottom surface 1324. The bottom surface 1324 may be, for example, ceramic. In a preferred embodiment, the bottom surface 1324 is gold plated in order to optimally provide solderability.

In a preferred embodiment, the bottom surface 1324 further includes a recess 1326. The recess 1326 preferably includes a first wall 1328, a second wall 1330, a third wall 1332 and a fourth wall 1334. The first wall 1328 and the third wall 1332 are preferably approximately parallel to each other and the second wall 1330 and the fourth wall 1334 are preferably approximately parallel to each

other. The second wall 1330 and the fourth wall 1334 are also preferably perpendicular to the first wall 1328 and the third wall 1332. The recess 1326 preferably includes a bottom surface 1336.

The length Ll326 of the recess 1326 may range, for example, from about 110 to 130 mils. In a preferred embodiment, the length Ll326 of the recess 1326 ranges from about 115 to 125 mils in order to optimally minimize thermal stresses. The width Wl326 of the recess 1326 may range, for example, from about 110 to 130 mils. In a preferred embodiment, the width Wl326 of the recess 1326 ranges from about 115 to 125 mils in order to minimize thermal stresses. The height Hig26 of the recess 1326 may range, for example, from about 1 to 2 mils. In a preferred embodiment, the height Hl326 of the recess 1326 ranges from about 1.25 to 1.75 mils in order to optimally minimize thermal stresses.

In a preferred embodiment, the recess 1326 is located approximately in the center of the bottom surface 1326 of the cavity 1308 of the housing 1302. The first wall 1328 of the recess 1326 may be located a perpendicular distance ranging, for example, from about 80 to 100 mils from the first wall 1316 of the cavity 1308. In a preferred embodiment, the first wall 1328 of the recess 1326 is located a perpendicular distance ranging from about 85 to 95 mils from the first wall 1316 of the cavity 1308 in order to optimally minimize thermal stresses.

The second wall 1330 of the recess 1326 may be located a perpendicular distance ranging, for example, from about 80 to 100 mils from the second wall 1318 of the cavity 1308. In a preferred embodiment, the second wall 1330 of the recess 1326 is located a perpendicular distance ranging from about 85 to 95 mils from the second wall 1318 of the cavity 1308 in order to optimally minimize thermal stresses. The housing 1302 may, for example, be any number of conventional commercially available housings of the type ceramic, plastic or metal. In a preferred embodiment, the housing 1302 is ceramic in order to optimally provide vacuum sealing capability.

The bottom surface 1336 of the recess 1326 may, for example, be plated with a metal. In a preferred embodiment, the bottom surface 1336 of the recess 1326 is gold plated in order to optimally provide solderability.

The housing 1302 preferably includes a first planar surface 1310a, a second planar surface 1310b, a third planar surface 1310c, and a fourth planar surface 1310d. The first planar surface 1310a preferably includes one or more planar bond pads 1338. The planar bond pads 1338 are preferably approximately rectangularly shaped. The planar bond pads 1338 may, for example, be used for solder paste, solder balls or leads attachment. In a preferred embodiment, the planar bond pads 1338 are used to solder the sensor packages 405 to the substrate 410. The number of planar bond pads 1338 preferably depend on having sufficient planar bond pads 1338 to connect the controller assembly 508 to the housing 1302. The second planar surface 1310b may, for example, be plated with a metal. In a preferred embodiment, the second planar surface 1310b is plated with gold in order to optimally provide solderability. The third planar surface 1310c may, for example, be plated with a metal. In a preferred embodiment, the third planar surface 1310c is plated with gold in order to optimally provide wire bonding. The fourth planar surface 1310d may, for example, be plated with a metal. In a preferred embodiment, the fourth planar surface 1310d is plated with gold in order to optimally provide wire bonding.

The housing 1302 preferably includes a plurality of first exterior surfaces 1312a and a plurality of second exterior surfaces 1312b. In a preferred embodiment, there are four first exterior surfaces 1312a and four second exterior surfaces 1312b forming an approximate octagon. The second exterior surfaces 1312b preferably couple the first exterior surfaces 1312a to each other. The first exterior surfaces 1312a preferably include one or more exterior bond pads 1340.

The exterior bond pads 1340 are preferably approximately rectangularly shaped.

The exterior bond pads 1340 may, for example, be used for solder paste, solder balls or leads attachment. In a preferred embodiment, the exterior bond pads 1340 are used to solder the sensor packages 405 to the substrate 410. The number of exterior bond pads 1340 preferably depend on having sufficient exterior bond pads 1340 to connect the controller assembly 508 to the housing 1302. In an alternate embodiment, the exterior bond pads 1340 are on a single first exterior surface 1312a.

The bottom exterior surface 1314 of the housing 1302 preferably includes a contact pad 1342, one or more bond pads 1344, and one or more connecting pads 1346. The contact pad 1342 may, for example, be plated with a metal. In a preferred embodiment, the contact pad 1342 is gold-plated in order to optimally provide a reliable electrical contact. The planar bond pads 1338 on the first planar surface 1310a are preferably electrically coupled to the bond pads 1344 on the bottom exterior surface 1314 by electrical paths molded into the housing 1302. The resilient couplings 1306, the third planar surface 1310c and the fourth planar surface 1310d are preferably coupled to the bond pads 1344 on the bottom exterior surface 1314 by electrical paths molded into the housing 1302. The bond pads 1344 may, for example, be plated with metal. In a preferred embodiment, the bond pads 1344 are gold plated in order to optimally provide wire bonding.

The number of bond pads 1344 preferably depend on having sufficient bond pads 1344 to connect the controller assembly 508 to the housing 1302. The connecting pads 1346 preferably connect the contact pad 1342 to the bond pads 1344. The connecting pads 1346 may, for example, metal plated. In a preferred embodiment, the connecting pads 1346 are gold-plated in order to optimally provide a conductive pathway between the contact pad 1342 and the bond pads 1344. The exterior bond pads 1340 are preferably electrically coupled to the bond pads 1344 by electrical paths molded into the housing 1302. In a preferred embodiment, there is a first connecting pad 1346a and a second connecting pad 1346b.

The sensor 1304 is preferably resiliently attached to the housing 1302 by the resilient couplings 1306, slidingly supported by the sliding supports 1372 and electrically coupled to the housing 1302 by the electrical connections 510. The sensor 1304 is an entirely active region. The sensor 1304 preferably has an approximately rectangular cross-sectional shape. In a preferred embodiment, the sensor 1304 includes a first member 1348, a second member 1350, and a third member 1352. The first member 1348 is preferably on top of the second member 1350 and the second member 1350 is preferably on top of the third member 1352.

In a preferred embodiment, the first member 1348, the second member 1350, and the third member 1352 are a micro machined sensor substantially as disclosed in

copending U. S. Patent Application Serial No., Attorney Docket No.

14737.737, filed on, the contents of which are incorporated herein by reference.

The first member 1348 preferably includes one or more parallel planar surfaces. In a preferred embodiment, the first member 1348 includes a top parallel planar surface 1354. The second member 1350 preferably includes one or more parallel planar surfaces. In a preferred embodiment, the second member 1350 includes a middle parallel planar surface 1356. The third member 1352 preferably includes one or more parallel planar surfaces. In a preferred embodiment, the third member 1352 includes a bottom parallel planar surface 1358.

The bottom parallel planar surface 1358 of the sensor 1304 preferably includes a first side 1360, a second side 1362, a third side 1364, and a fourth side 1366. The first side 1360 and the third side 1364 are preferably approximately parallel to each other and the second side 1362 and the fourth side 1366 are preferably approximately parallel to each other and preferably approximately perpendicular to the first side 1360 and the third side 1364.

In a preferred embodiment, the bottom parallel planar surface 1358 of the sensor 1304 includes one or more bond pads 1368. In a preferred embodiment, the bond pads 1368 are located at the approximate center of the bottom parallel planar surface 1358 of the sensor 1304. The bond pads 1368 may be located a perpendicular distance ranging, for example, from about 80 to 100 mils from the first side 1360 of the bottom parallel planar surface 1358 of the sensor 1304 and may, for example, be located a perpendicular distance ranging, for example, from about 80 to 100 mils from the second side 1362 of the bottom parallel planar surface 1358 of the sensor 1304. In a preferred embodiment, the bond pads 1368 are located a perpendicular distance ranging from about 85 to 95 mils from the first side 1360 of the bottom parallel planar surface 1358 of the sensor 1304 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 85 to 95 mils from the second side 1362 of the bottom parallel planar surface 1358 of the sensor 1304 in order to optimally minimize thermal stresses.

The bond pads 1368 may, for example, be used for solder, conductive epoxy, non-conductive epoxy, or glass frit bonding. In a preferred embodiment, the bond pads 1368 are used for solder bonding in order to optimally provide good manufacturability. In a preferred embodiment, the bond pads 1368 contact area is maximized in order to optimize the shock tolerance of the sensor 1304. In a preferred embodiment, the bond pads 1368 have minimal discontinuities in order to optimize the distribution of thermal stresses in the sensor 1304. In several alternate embodiments, there are a plurality of bond pads 1368 in order to optimize the relief of thermal stresses in the sensor 1304. The bond pads 1368 preferably have an approximately circular cross-sectional shape. The total diameter Dol,, of the bond pads 1368 may range, for example, from about 50 to 100 mils. In a preferred embodiment, the total diameter Diggg of the bond pads 1368 range from about 70 to 80 mils in order to optimally minimize thermal stresses. The height H131, of the bond pads 1368 may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height Ho368 of the bond pads 1368 range from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses. In a preferred embodiment, there is a single approximately circular bond pad 1368a.

The resilient couplings 1306 preferably resiliently attach the bond pads 1368 to the housing 1302. The resilient couplings 1306 may electrically couple the sensor 1304 to the housing 1302. The resilient couplings 1306 are preferably coupled to the bottom surface 1336 of the recess 1326 of the cavity 1308 of the housing 1302. In a preferred embodiment, the resilient couplings 1306 are solder preforms. In a preferred embodiment, the resilient couplings 1306 have minimal discontinuities in order to optimize the distribution of thermal stresses in the sensor 1304. In a preferred embodiment, there is a plurality of resilient couplings 1306 in order to optimize the relief of thermal stresses in the sensor 1304. In a more preferred embodiment, the resilient couplings 1306 have an approximate cross-sectional circular shape. The resilient couplings 1306 may, for example, be any number of conventional commercially available solder preforms of the type eutectic or non-eutectic. In a preferred embodiment, the resilient

coupling 1306 is eutectic in order to optimally provide good yield strength with a reasonable melt temperature.

The cross-sectional area Altos ouf the resilient couplings 1306 may range, for example, from about 9025 to 13225 square mils. In a preferred embodiment, the cross-sectional area Al306 of the resilient couplings 1306 ranges from about 10000 to 12100 square mils in order to optimally minimize thermal stresses. The height Higog of the resilient couplings 1306 may range, for example, from about 2 to 4 mils. In a preferred embodiment, the height Hls06 of the resilient couplings 1306 range from about 2.5 to 3 mils in order to optimally minimize thermal stresses.

The resilient couplings 1306 may be located a perpendicular distance ranging, for example, from about 2 to 7 mils from the first wall 1328 of the recess 1326 of the cavity 1308 of the housing 1302 and may be located a perpendicular distance ranging, for example, from about 2 to 7 mils from the second wall 1330 of the recess 1326 of the cavity 1308 of the housing 1302. In a preferred embodiment, the resilient couplings 1306 are located a perpendicular distance ranging from about 3 to 5 mils from the first wall 1328 of the recess 1326 of the cavity 1308 of the housing 1302 in order to optimally minimize thermal stresses and located a distance ranging from about 3 to 5 mils from the second wall 1330 of the recess 1326 of the cavity 1308 of the housing 1302 in order to optimally minimize thermal stresses.

In a preferred embodiment, the resilient couplings 1306 further include one or more bumpers 1370 for slidingly supporting the sensor 1304. In a preferred embodiment, the bumpers 1370 have an approximately annular cross- sectional shape. In a preferred embodiment, the bumpers 1370 surround the bond pads 1368. In a preferred embodiment, the bumpers 1370 are proximate to the bond pad 1368. The width Wl370 of the bumpers 1370 may range, for example, from about 2 to 6 mils. In a preferred embodiment, the width Wl370 of the bumpers 1370 range from about 3 to 5 mils in order to optimally minimize thermal stresses. In a preferred embodiment, the resilient couplings 1306 are coupled to the bond pads 1368 using conventional solder equipment and processes. In a preferred embodiment, the resilient couplings 1306 are coupled

to the bottom surface 1336 of the recess 1326 of the cavity 1308 of the housing 1302 using conventional solder equipment and processes. In a more preferred embodiment, there is a single approximately circular resilient coupling 1306a.

The sliding supports 1372 preferably slidingly support the sensor 1304.

The sliding supports 1372 are preferably coupled to the bottom surface 1324 of the cavity 1308 of the housing 1302. The sliding supports 1372 may, for example, be tungsten or ceramic. In a preferred embodiment, the sliding supports 1372 are tungsten in order to optimally provide a standard packaging process. The cross sectional area Al372 of the sliding supports 1372 may range, for example, from about 400 to 1600 square mils, individually. In a preferred embodiment, the cross sectional area Al372 of the sliding supports 1372 ranges from about 625 to 1225 square mils, individually, in order to optimally minimize thermal stresses. The height H1372of the sliding supports 1372 may range, for example, from about 0.5 to 3 mils. In a preferred embodiment, the height Ho. 72 of the sliding supports 1372 ranges from about 1 to 1.5 mils in order to optimally minimize thermal stresses.

The number of sliding supports 1372 preferably depends on having sufficient sliding supports 1372 to slidingly support the sensor 1302. In a preferred embodiment, the sliding supports 1372 preferably have an approximately square cross sectional shape. In a preferred embodiment, there is a first sliding support 1372a, a second sliding support 1372b, a third sliding support 1372c, and a fourth sliding support 1372d. The first sliding support 1372a is preferably located adjacent to one side of the resilient couplings 1306.

The second sliding support 1372b is preferably located adjacent to the first sliding support 1372a. The third sliding support 1372c is preferably located adjacent to another side of the resilient couplings 1306. The fourth sliding support 1372d is preferably located adjacent to the third sliding support 1372c.

The first sliding support 1372a may be located a perpendicular distance ranging, for example, from about 45 to 75 mils from the first wall 1316 of the cavity 1308 of the housing 1302 and may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the second wall 1318 of the cavity 1308 of the housing 1302. In a preferred embodiment, the first sliding

support 1372a is located a perpendicular distance ranging from about 52 to 62 mils from the first wall 1316 of the cavity 1308 of the housing 1302 in order to optimally minimize thermal stresses and located a perpendicular distance from about 90 to 105 mils from the second wall 1318 of the cavity 1308 of the housing 1302 in order to optimally minimize thermal stresses.

The second sliding support 1372b may be located a perpendicular distance ranging, for example, from about 45 to 75 mils from the first wall 1316 of the cavity 1308 of the housing 1302 and may be located a perpendicular distance ranging, for example, from about 15 to 30 mils from the second wall 1318 of the cavity 1308 of the housing 1302. In a preferred embodiment, the second sliding support 1372b is located a perpendicular distance ranging from about 52 to 62 mils from the first wall 1316 of the cavity 1308 of the housing 1302 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 20 to 25 mils from the second wall 1318 of the cavity 1308 of the housing 1302 in order to optimally minimize thermal stresses.

The third sliding support 1372c may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the first wall 1316 of the cavity 1308 of the housing 1302 and may be located a perpendicular distance ranging, for example, from about 15 to 30 mils from the second wall 1318 of the cavity 1308 of the housing 1302. In a preferred embodiment, the third sliding support 1372c is located a perpendicular distance ranging from about 90 to 105 mils from the first wall 1316 of the cavity 1308 of the housing 1302 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 20 to 25 mils from the second wall 1318 of the cavity 1308 of the housing 1302 in order to optimally minimize thermal stresses.

The fourth sliding support 1372d may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the first wall 1316 of the cavity 1308 of the housing 1302 and may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the second wall 1318 of the cavity 1308 of the housing 1302. In a preferred embodiment, the fourth sliding support 1372b is located a perpendicular distance ranging from about 90 to 105 mils from the first wall 1316 of the cavity 1308 of the housing 1302 in order to

optimally minimize thermal stresses and located a perpendicular distance ranging from about 90 to 105 mils from the second wall 1318 of the cavity 1308 of the housing 1302 in order to optimally minimize thermal stresses. In a preferred embodiment, the sliding supports 1372 are coupled to the bottom surface 1324 of the cavity 1308 of the housing 1302 using conventional means of integrating the sliding supports 1372 into the housing 1302.

The electrical connections 510 preferably electrically couple the sensor 1304 to the housing 1302. In a preferred embodiment, there is the first electrical connection 510a and the second electrical connection 510b. The first electrical connection 510a preferably electrically couples the third planar surface 1310c of the housing 1302 to the top parallel planar surface 1354 of the sensor 1304. The second electrical connection 510b preferably electrically couples the fourth planar surface 1310d of the housing 1302 to the middle parallel planar surface 1356 of the sensor 1304. In a preferred embodiment, the electrical connections 510 are coupled to the housing 1302 using conventional solder equipment and processes. In a preferred embodiment, the electrical connections 510 are coupled to the sensor 1304 using conventional solder equipment and processes.

The lid assembly 506 is preferably coupled to the housing 1302. In a preferred embodiment, the length L572 of the lid 572 is at least 0.010 inches less than the length of the second planar surface 1310b in order to optimally provide good alignment tolerance. In a preferred embodiment, the width W572 of the lid 572 is at least 0.010 inches less than the width of the second planar surface 1310b in order to optimally provide good alignment tolerance. The bottom surface 576 of the lid 572 is preferably coupled to the housing 1302 via the solder preform 578. In a preferred embodiment, the outer length L578 of the solder preform 578 is at least 0.010 inches less than the outer length of the second planar surface 1310b in order to optimally provide good alignment tolerance. In a preferred embodiment, the exterior width W578 of the solder preform 578 is at least 0.010 inches less than the outer width of the second planar surface 1310b in order to optimally provide good alignment tolerance. The solder preform 578 is preferably coupled to the second planar surface 1310b of the housing 1302 using conventional solder equipment and processes. The lid 572 is preferably coupled

to the solder preform 578 using conventional vacuum sealing equipment and processes. The housing 1302, the sensor 1304, and the lid 506 are preferably vacuum-sealed to remove excess gas from the cavity 1308.

The controller assembly 508 is preferably coupled to the bottom exterior surface 1314 of the housing 1302. The adhesive 580 is preferably coupled to the contact pad 1342. The controller 582 is preferably coupled to the adhesive 580.

The wire bonds 584 are preferably coupled to the controller 582 and the bond pads 1344. The wire bonds 584 are preferably coupled to the bond pads 1344 using conventional wire bonding equipment and processes. The wire bonds 584 are preferably coupled to the controller 582 using conventional wire bonding equipment and processes. The controller 582 and the wire bonds 584 are preferably encapsulated with the encapsulant 586.

In an alternate embodiment, the recess 1326 is optional. The resilient couplings 1306 may be located a perpendicular distance ranging, for example, from about 80 to 100 mils from the first wall 1316 of the cavity 1308 of the housing 1302 and may be located a perpendicular distance ranging, for example, from about 80 to 100 mils from the second wall 1318 of the cavity 1308 of the housing 1302. In a preferred embodiment, the resilient couplings 1306 are located a perpendicular distance ranging from about 85 to 95 mils from the first wall 1316 of the cavity 1308 of the housing 1302 in order to optimally minimize thermal stresses and located a distance ranging from about 85 to 95 mils from the second wall 1318 of the cavity 1308 of the housing 1302 in order to optimally minimize thermal stresses.

In an alternate embodiment, the housing 1302 further includes circuit components. The circuit components may be integrated into the housing 1302, for example, on any of the planar surfaces 1310 or any of the first exterior surfaces 1312a. In a preferred embodiment, the circuit components are integrated into the bottom exterior surface 1314 in order to optimally reduce the size of the sensor module 405. The circuit components may be, for example, filtering capacitors, resistors, or active components. In a preferred embodiment, the circuit components are filtering capacitors in order to optimally reduce system 100 size.

In an alternate embodiment, the lid assembly 506 is optional.

In an alternate embodiment, the controller assembly 508 is optional.

In an alternate embodiment, the sliding supports 1372 are optional.

In an alternate embodiment, the getter 574 is optional.

In an alternate embodiment, the exterior bond pads 1340 are optional.

Referring to Fig. 13M, in an alternate embodiment, there is a bond pad 1368b. The bond pad 1368b may have an approximately oct-pie-wedge cross- sectional shape. The overall diameter Dl368b of the bond pad 1368b may range, for example, from about 50 to 100 mils. In a preferred embodiment, the overall diameter Dl868b of the bond pad 1368b ranges from about 70 to 80 mils in order to optimally minimize thermal stresses. The height Ho368 of the bond pad 1368b may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height Higgg of the bond pad 1368b ranges from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 13N, in an alternate embodiment, there is bond pad 1368c. The bond pad 1368c may have an approximately hollow oct-pie-wedge cross-sectional shape. The overall diameter Dl368e of the bond pad 1368c may range, for example, from about 50 to 100 mils. In a preferred embodiment, the overall diameter Digggg of the bond pad 1368c ranges from about 70 to 80 mils in order to optimally minimize thermal stresses. The height Hl368 of the bond pad 1368c may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height Hl368 of the bond pad 1368c ranges from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 130, in an alternate embodiment, there is a bond pad 1368d. The bond pad 1368d has an approximately nine-circular cross-sectional shape. The overall diameter Digggj of the bond pad 1368d may range, for example, from about 50 to 100 mils. In a preferred embodiment, the overall diameter Dlssea of the bond pad 1368d ranges from about 70 to 80 mils in order to optimally minimize thermal stresses. The height Ho368 of the bond pad 1368d may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height Higgg of the bond pad 1368d ranges from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 13P, in an alternate embodiment, there is a bond pad 1368e. The bond pad 1368e has an approximately starburst cross-sectional shape. The overall diameter Dl368e of the bond pad 1368e may range, for example, from about 50 to 100 mils. In a preferred embodiment, the overall diameter Dl368e of the bond pad 1368e ranges from about 70 to 80 mils in order to optimally minimize thermal stresses. The height Higgg of the bond pad 1368e may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height Higgg of the bond pad 1368e ranges from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 13Q, in an alternate embodiment, there is a bond pad 1368f. The bond pad 1368f has an approximately sunburst cross-sectional shape.

The overall diameter Dl368f of the bond pad 1368f may range, for example, from about 50 to 100 mils. In a preferred embodiment, the overall diameter Dl368f of the bond pad 1368f ranges from about 70 to 80 mils in order to optimally minimize thermal stresses. The height Hl368 of the bond pad 1368f may range, for example, from about 0.1 to 1 micron. In a preferred embodiment, the height Hl368 of the bond pad 1368f ranges from about 0.24 to 0.72 microns in order to optimally minimize thermal stresses.

Referring to Fig. 13V, in an alternate embodiment, there is a resilient coupling 1306b and a resilient coupling 1306c that are substantially equal and are vertically proximate to each other. The total cross-sectional area Aigog of the resilient couplings 1306b and 1306c may range, for example, from about 9025 to 13225 square mils. In a preferred embodiment, the total cross-sectional area Au306 of the resilient couplings 1306b and 1306c ranges from about 10000 to 12100 square mils in order to optimally minimize thermal stresses. The height Hl306 of the resilient couplings 1306b and 1306c may range, for example, from about 2 to 4 mils. In a preferred embodiment, the height Higog of the resilient couplings 1306b and 1306c ranges from about 2.5 to 3 mils in order to optimally minimize thermal stresses.

Referring to Figs. 13W through 13Y, in several alternate embodiments, the sliding supports 1372 include one or more sliding supports 1372e, 1372f, or 1372g. In an alternate embodiment, the sliding supports 1372e may have an

approximately rectangular cross-sectional shape. The sliding supports 1372e may have an approximate cross-sectional area ranging from 400 to 1600 square mils, individually. In a preferred embodiment, the sliding supports 1372e have an approximate cross-sectional area ranging from 625 to 1225 square mils, individually, in order to optimally minimize thermal stresses. The height H1372 of the sliding supports 1372e may range, for example, from about 0.5 to 3 mils. In a preferred embodiment, the height H1372of the sliding supports 1372e ranges from about 1 to 1.5 mils in order to optimally minimize thermal stresses.

In an alternate embodiment, the sliding supports 1372f may have an approximately triangular cross-sectional shape. The sliding supports 1372f may have an approximate cross-sectional area ranging from 400 to 1600 square mils, individually. In a preferred embodiment, the sliding supports 1372f have an approximate cross-sectional area ranging from 625 to 1225 square mils, individually, in order to optimally minimize thermal stresses. The height H1372 of the sliding supports 1372f may range, for example, from about 0.5 to 3 mils. In a preferred embodiment, the height Hl372 of the sliding supports 1372f ranges from about 1 to 1.5 mils in order to optimally minimize thermal stresses.

In an alternate embodiment, the sliding supports 1372g may have an approximately circular cross-sectional shape. The sliding supports 1372g may have an approximate cross-sectional area ranging from 400 to 1600 square mils, individually. In a preferred embodiment, the sliding supports 1372g have an approximate cross-sectional area ranging from 625 to 1225 square mils, individually, in order to optimally minimize thermal stresses. The height H, 372 of the sliding supports 1372g may range, for example, from about 0.5 to 3 mils. In a preferred embodiment, the height Hl372 of the sliding supports 1372g ranges from about 1 to 1.5 mils in order to optimally minimize thermal stresses.

In an alternate embodiment, the recess 1328 is optional. The resilient couplings 1306 may be located a perpendicular distance ranging, for example, from about 80 to 100 mils from the first wall 1316 of the cavity 1308 of the housing 1302 and may be located a perpendicular distance ranging, for example, from about 80 to 100 mils from the second wall 1318 of the cavity 1308 of the housing 1302. In a preferred embodiment, the resilient couplings 1306 are

located a perpendicular distance ranging from about 85 to 95 mils from the first wall 1316 of the cavity 1308 of the housing 1302 in order to optimally minimize thermal stresses and located a distance ranging from about 85 to 95 mils from the second wall 1318 of the cavity 1308 of the housing 1302 in order to optimally minimize thermal stresses.

Referring to Figs. 14A through 14L, an alternate embodiment of the sensor package 405 preferably includes a housing 1402, the sensor 1304, the lid assembly 506, and the controller assembly 508. The lid assembly 506 is preferably coupled to the top of the housing 1402. The controller assembly 508 is preferably coupled to the bottom of the housing 1402. The sensor 1304 is preferably coupled within the housing 1402.

The housing 1402 is preferably coupled to the sensor 1304, the lid assembly 506, the controller assembly 508, the electrical connections 510, the sliding supports 1372, and the resilient couplings 1306. The housing 1302 preferably includes a cavity 1404, one or more planar surfaces 1406, one or more exterior surfaces 1408, and a bottom exterior surface 1410. The cavity 1404 preferably includes a first wall 1412, a second wall 1414, a third wall 1416 and a fourth wall 1418. The first wall 1412 and the third wall 1416 are preferably approximately parallel to each other and the second wall 1414 and the fourth wall 1418 are preferably approximately parallel to each other. The second wall 1414 and the fourth 1418 wall are also preferably perpendicular to the first wall 1412 and the third wall 1416. The cavity 1404 preferably includes a bottom surface 1420. The bottom surface 1420 of the cavity 1404 may, for example, be metal plated. In a preferred embodiment, the bottom surface 1420 of the cavity 1404 is gold plated in order to optimally provide solderability.

In a preferred embodiment, the bottom surface 1420 further includes a recess 1422. The recess 1422 preferably includes a first wall 1424, a second wall 1426, a third wall 1428 and a fourth wall 1430. The first wall 1424 and the third wall 1428 are preferably approximately parallel to each other and the second wall 1426 and the fourth wall 1430 are preferably approximately parallel to each other. The second wall 1426 and the fourth wall 1430 are also preferably perpendicular to the first wall 1424 and the third wall 1428.

The recess 1422 preferably includes a bottom surface 1432. The length Ll499 of the recess 1422 may range, for example, from about 110 to 130 mils. In a preferred embodiment, the length L, 4, of the recess 1422 ranges from about 115 to 125 mils in order to optimally minimize thermal stresses. The width W1422 of the recess 1422 may range, for example, from about 110 to 130 mils. In a preferred embodiment the width Wu422 of the recess 1422 ranges from about 115 to 125 mils in order to optimally minimize thermal stresses. The height H1422 of the recess 1422 may range, for example, from aboutl to 2 mils. In a preferred embodiment, the height Ho422 of the recess 1422 ranges from about 1.25 to 1.75 mils in order to optimally minimize thermal stresses. In a preferred embodiment, the recess 1422 is located approximately in the center of the bottom surface 1432 of the housing 1402. The first wall 1424 of the recess 1422 may be located a perpendicular distance ranging, for example, from about 80 to 100 mils from the first wall 1412 of the cavity 1404. In a preferred embodiment, the first wall 1424 of the recess 1422 is located a perpendicular distance ranging from about 85 to 95 mils from the first wall 1412 of the cavity 1404 in order to optimally minimize thermal stresses. The second wall 1426 of the recess 1422 may be located a perpendicular distance ranging, for example, from about 80 to 100 mils from the second wall 1414 of the cavity 1404. In a preferred embodiment, the second wall 1426 of the recess 1422 is located a perpendicular distance ranging from about 85 to 95 mils from the second wall 1414 of the cavity 1404 in order to optimally minimize thermal stresses. The housing 1402 may, for example, be any number of conventional commercially available housings of the type ceramic, metal or plastic. In a preferred embodiment, the housing 1402 is ceramic in order to optimally provide good vacuum sealing. The bottom surface 1432 of the recess 1422 may, for example, be metal plated. In a preferred embodiment, the bottom surface 1432 of the recess 1422 is gold plated in order to optimally provide solderability.

The housing 1402 preferably includes a first planar surface 1406a, a second planar surface 1406b, a third planar surface 1406c, and a fourth planar surface 1406d. The first planar surface 1406a preferably includes one or more planar bond pads 1434. The planar bond pads 1434 are preferably approximately

rectangularly shaped. The planar bond pads 1434 are preferably used to wire- bond the controller 508 to the housing 1402. The number of planar bond pads 1434 preferably depend on having sufficient planar bond pads 1434 to connect the controller assembly 508 to the housing 1402. The second planar surface 1406b may, for example, be plated with a metal. In a preferred embodiment, the second planar surface 1406b is plated with gold in order to optimally provide solderability. The third planar surface 1406c may, for example, be plated with a metal. In a preferred embodiment, the third planar surface 1406c is plated with gold in order to optimally provide wire bonding. The fourth planar surface 1406d may, for example, be plated with metal. In a preferred embodiment, the fourth planar surface 1406d is plated with gold in order to optimally provide wire bonding. The resilient couplings 1306, the third planar surface 1406c and the fourth planar surface 1406d are preferably coupled to the one of the planar bond pads 1434 on the first planar surface 1406a by electrical paths molded into the housing 1402.

The housing 1402 preferably includes a plurality of first exterior surfaces 1408a and a plurality of second exterior surfaces 1408b. In a preferred embodiment, there are four first exterior surfaces 1408a and four second exterior surfaces 1408b forming an approximate octagon. The second exterior surfaces 1408b preferably couple the first exterior surfaces 1408a to each other. The first exterior surfaces 1408a include one or more exterior bond pads 1436 The exterior bond pads 1436 are preferably approximately rectangularly shaped. The exterior bond pads 1436 may, for example, be used for solder paste, solder balls, or leads attachment. In a preferred embodiment, the exterior bond pads 1436 are used to solder the sensor package 405 to the substrate 410. The number of exterior bond pads 1436 preferably depend on having sufficient exterior bond pads 1436 to connect the controller assembly 508 to the housing 1402. In an alternate embodiment, the exterior bond pads 1436 are on a single first exterior surface 1408a.

The bottom exterior surface 1410 of the housing 1402 preferably includes one or more bond pads 1438. The bond pads 1438 are preferably approximately circular in shape. The bond pads 1438 may be, for example, used for solder

paste, solder balls, or leads attachments. In a preferred embodiment, the bond pads 1438 are gold plated in order to optimally provide solderability. The number of bond pads 1438 preferably depend on having sufficient bond pads 1438 to connect the sensor module 405 to the substrate 410. The bond pads 1438 are preferably electrically coupled to the planar bond pads 1434 by electrical paths molded into the housing 1402. The exterior bond pads 1436 are preferably coupled to the planar bond pads 1434 by electrical paths molded into the housing.

The sensor 1304 is preferably resiliently attached to the housing 1402 by the resilient couplings 1306, slidingly supported by the sliding supports 1372, and electrically coupled to the housing 1402 by the electrical connections 510. In a preferred embodiment, there is the single approximately circular bond pad 1368a located in the approximate center of the sensor 1304.

The resilient couplings 1306 preferably resiliently attaches the bond pads 1368 to the housing 1402. The resilient couplings 1306 may electrically couple the sensor 1304 to the housing 1402. The resilient couplings 1306 are preferably coupled to the bottom surface 1432 of the recess 1422 of the cavity 1404 of the housing 1402. The resilient couplings 1306 may be located a perpendicular distance ranging, for example, from about 2 to 7 mils from the first wall 1424 of the recess 1422 of the cavity 1404 of the housing 1402 and may be located a perpendicular distance ranging, for example, from about 2 to 7 mils from the second wall 1426 of the recess 1422 of the cavity 1404 of the housing 1402. In a preferred embodiment, the resilient couplings 1306 are located a perpendicular distance ranging from about 3 to 5 mils from the first wall 1424 of the recess 1422 of the cavity 1404 of the housing 1402 in order to optimally minimize thermal stresses and located a distance ranging from about 3 to 5 mils from the second wall 1426 of the recess 1422 of the cavity 1404 of the housing 1402 in order to optimally minimize thermal stresses. In a preferred embodiment, the resilient couplings 1306 are coupled to the bottom surface 1432 of the recess 1422 of the cavity 1404 of the housing 1402 using conventional solder equipment and processes. In a preferred embodiment, there is the single approximately circular resilient coupling 1306a located in the recess 1422 of the housing 1402.

The number of sliding supports 1372 preferably depends on having sufficient sliding supports 1372 to slidingly support the sensor 1302. In a preferred embodiment, the sliding supports 1372 preferably have an approximately square cross sectional shape. The sliding supports 1372 are preferably coupled to the bottom surface 1420 of the housing 1402. In a preferred embodiment, there is the first sliding support 1372a, the second sliding support 1372b, the third sliding support 1372c, and the fourth sliding support 1372d. The first sliding support 1372a is preferably located adjacent to one side of the resilient couplings 1306. The second sliding support 1372b is preferably located adjacent to the first sliding support 1372a. The third sliding support 1372c is preferably located adjacent to another side of the resilient couplings 1306. The fourth sliding support 1372d is preferably located adjacent to the third sliding support 1372c.

The first sliding support 1372a may be located a perpendicular distance ranging, for example, from about 45 to 75 mils from the first wall 1412 of the cavity 1404 of the housing 1402 and may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the second wall 1414 of the cavity 1404 of the housing 1402. In a preferred embodiment, the first sliding support 1372a is located a perpendicular distance ranging from about 52 to 62 mils from the first wall 1412 of the cavity 1404 of the housing 1402 in order to optimally minimize thermal stresses and located a perpendicular distance from about 90 to 105 mils from the second wall 1414 of the cavity 1404 of the housing 1402 in order to optimally minimize thermal stresses.

The second sliding support 1372b may be located a perpendicular distance ranging, for example, from about 45 to 75 mils from the first wall 1412 of the cavity 1404 of the housing 1402 and may be located a perpendicular distance ranging, for example, from about 15 to 30 mils from the second wall 1414 of the cavity 1404 of the housing 1402. In a preferred embodiment, the second sliding support 1372b is located a perpendicular distance ranging from about 52 to 62 mils from the first wall 1412 of the cavity 1404 of the housing 1402 in order to optimally minimize thermal stresses and located a perpendicular distance

ranging from about 20 to 25 mils from the second wall 1414 of the cavity 1404 of the housing 1402 in order to optimally minimize thermal stresses.

The third sliding support 1372c may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the first wall 1412 of the cavity 1404 of the housing 1402 and may be located a perpendicular distance ranging, for example, from about 15 to 30 mils from the second wall 1414 of the cavity 1404 of the housing 1402. In a preferred embodiment, the third sliding support 1372c is located a perpendicular distance ranging from about 90 to 105 mils from the first wall 1412 of the cavity 1404 of the housing 1402 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 20 to 25 mils from the second wall 1414 of the cavity 1404 of the housing 1402 in order to optimally minimize thermal stresses.

The fourth sliding support 1372d may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the first wall 1412 of the cavity 1404 of the housing 1402 and may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the second wall 1414 of the cavity 1404 of the housing 1402. In a preferred embodiment, the fourth sliding support 1372d is located a perpendicular distance ranging from about 90 to 105 mils from the first wall 1412 of the cavity 1404 of the housing 1402 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 90 to 105 mils from the second wall 1414 of the cavity 1404 of the housing 1402 in order to optimally minimize thermal stresses. In a preferred embodiment, the sliding supports 1372 are coupled to the bottom surface 1420 of the cavity 1404 of the housing 1402 using conventional means of integrating the sliding supports 1372 into the housing 1402.

The electrical connections 510 preferably electrically couple the sensor 1404 to the housing 1402. In a preferred embodiment, there is the first electrical connection 510a and the second electrical connection 510b. The first electrical connection 510a preferably electrically couples the third planar surface 1406c of the housing 1402 to the top parallel planar surface 1354 of the sensor 1404. The second electrical connection 510b preferably electrically couples the fourth planar surface 1406d of the housing 1402 to the middle parallel planar surface

1356 of the sensor 1304. In a preferred embodiment, the electrical connections 510 are coupled to the housing 1402 using conventional wire bonding equipment and processes. In a preferred embodiment, the electrical connections 510 are coupled to the sensor 1304 using conventional wire bonding equipment and processes.

The lid assembly 506 is preferably coupled to the housing 1402. In a preferred embodiment, the length L672 of the lid 572 is at least 0.010 inches less than the length of the second planar surface 1406b in order to optimally provide good alignment tolerance. In a preferred embodiment, the width W672 of the lid 572 is at least 0.010 inches less than the width of the second planar surface 1406b in order to optimally provide good alignment tolerance. The bottom surface 576 of the lid 572 is preferably coupled to the housing 1402 via the solder preform 578. In a preferred embodiment, the outer length L578 of the solder preform 578 is at least 0.010 inches less than the outer length of the second planar surface 1406b in order to optimally provide good alignment tolerance. In a preferred embodiment, the exterior width Wr, 78 of the solder preform 578 is at least 0.010 inches less than the outer width of the second planar surface 1406b in order to optimally provide good alignment tolerance. The solder preform 578 is preferably coupled to the second planar surface 1406b of the housing 1402 using conventional solder equipment and processes. The solder preform 578 is preferably a rectangular ring that conforms to the shape of the second planar surface 1406b. The lid 572 is preferably coupled to the solder preform 578 using conventional vacuum sealing equipment and processes. The housing 1402, the sensor 1304, and the lid 506 are preferably vacuum-sealed to remove excess gas from the cavity 1404.

The controller assembly 508 is preferably coupled to the housing 1402.

The lid 572 further includes a top surface 628. The adhesive 580 is preferably coupled to the top surface 628 of the lid 572. The wire bonds 584 are preferably coupled to the controller 582 and the planar bond pads 1434. The wire bonds 584 are coupled to the planar bond pads 1434 using conventional wire bonding equipment and processes. The controller assembly 508 and the wire bonds 584 are preferably encapsulated with the encapsulant 586.

In an alternate embodiment, the recess 1422 is optional. The resilient couplings 1306 may be located a perpendicular distance ranging, for example, from about 80 to 100 mils from the first wall 1412 of the cavity 1404 of the housing 1402 and may be located a perpendicular distance ranging, for example, from about 80 to 100 mils from the second wall 1414 of the cavity 1404 of the housing 1402. In a preferred embodiment, the resilient couplings 1306 are located a perpendicular distance ranging from about 85 to 95 mils from the first wall 1412 of the cavity 1404 of the housing 1402 in order to optimally minimize thermal stresses and located a distance ranging from about 85 to 95 mils from the second wall 1414 of the cavity 1404 of the housing 1402 in order to optimally minimize thermal stresses.

In an alternate embodiment, the housing 1402 further includes circuit components. The circuit components may be integrated into the housing 1402, for example, on any of the planar surfaces 1406 or any of the first exterior surfaces 1408. In a preferred embodiment, the circuit components are integrated into the first planar surface 1406a in order to optimally reduce the size of the sensor module 405. The circuit components may be, for example, filtering capacitors, resistors, or active components. In a preferred embodiment, the circuit components are filtering capacitors in order to optimally reduce system 100 size.

In an alternate embodiment, the lid assembly 506 is optional.

In an alternate embodiment, the controller assembly 508 is optional.

In an alternate embodiment, the sliding supports 1372 are optional.

In an alternate embodiment, the getter 574 is optional.

In an alternate embodiment, the exterior bond pads 1436 are optional.

In several alternate embodiments, the bond pads 1368 may be one of the following: the bond pads 1368b, the bond pad 1368c, the bond pad 1368d, the bond pad 1368e, and the bond pad 1368f as referenced to in Figs. 13M through 13Q.

In an alternate embodiment, the resilient couplings 1306 may be the resilient couplings 1306b and 1306c as referenced to in Fig. 13V.

In several alternate embodiments, the sliding supports 1372 may be the sliding supports 1372e, 1372f, or 1372g as referenced to in Figs. 13W through 13Y.

Referring to Figs. 15A through 15L, an alternate embodiment of the sensor package 405 preferably includes the housing 1302, the sensor 1304, the lid assembly 702, and the controller assembly 508. The lid assembly 702 is preferably coupled to the top of the housing 1302. The controller assembly 508 is preferably coupled to the bottom of the housing 1302. The sensor 1304 is preferably coupled within the housing 1302.

The housing 1302 is preferably coupled to the sensor 1304, the lid assembly 702, the controller assembly 508, the electrical connections 510, the sliding supports 1372, and the resilient couplings 1306.

The sensor 1304 is preferably resiliently attached to the housing 1302 by the resilient couplings 1306, slidingly supported by the sliding supports 1372, and electrically coupled to the housing 1302 by the electrical connections 510. In a preferred embodiment, there is the single approximately circular bond pad 1368a located in the approximate center of the sensor 1304.

The resilient couplings 1306 preferably resiliently attach the bond pads 1344 to the housing 1302. The resilient couplings 1306 may electrically couple the sensor 1304 to the housing 1302. The resilient couplings 1306 are preferably coupled to the bottom surface 1336 of the recess 1326 of the cavity 1308 of the housing 1302. In a preferred embodiment, there is the single approximately circular resilient coupling 1306a located in the recess 1326 of the housing 1302.

The number of sliding supports 1372 preferably depends on having sufficient sliding supports 1372 to slidingly support the sensor 1302. In a preferred embodiment, the sliding supports 1372 preferably have an approximately square cross sectional shape. The sliding supports 1372 are preferably coupled to the bottom surface 1324 of the housing 1302. In a preferred embodiment, there is the first sliding support 1372a, the second sliding support 1372b, the third sliding support 1372c, and the fourth sliding support 1372d. The first sliding support 1372a is preferably located adjacent to one side of the resilient couplings 1306. The second sliding support 1372b is preferably

located adjacent to the first sliding support 1372a. The third sliding support 1372c is preferably located adjacent to another side of the resilient couplings 1306. The fourth sliding support 1372d is preferably located adjacent to the third sliding support 1372c.

The electrical connections 510 preferably electrically couple the sensor 1304 to the housing 1302. In a preferred embodiment, there is the first electrical connection 510a and the second electrical connection 510b. The first electrical connection 510a preferably electrically couples the third planar surface 1310c of the housing 1302 to the top parallel planar surface 1354 of the sensor 1302. The second electrical connection 510b preferably electrically couples the fourth planar surface 1310d of the housing 1302 to the middle parallel planar surface 1356 of the sensor 1302.

The lid assembly 702 is preferably coupled to the housing 1302. The lid assembly 702 preferably includes the lid 704, the getter 706 and the spring 708.

The four arms 716 of the spring 708 preferably couple the bottom surface 710 of the lid 704 to the top planar surface 1354 of the sensor 1304. The spring 708 preferably secures the sensor 1304 to the resilient couplings 1306. The getter 706 is coupled to the bottom surface 710 of the lid 704 using conventional welding equipment and processes. In a preferred embodiment, the length L572 of the lid 572 may be at least 0.010 inches less than the length of the second planar surface 1310b in order to optimally provide good alignment tolerance. In a preferred embodiment, the width W672 of the lid 572 may be at least 0.010 inches less than the width of the second planar surface 1310b in order to optimally provide good alignment tolerance. The bottom surface 710 of the lid 704 is preferably coupled to the housing 1302 via the solder preform 578. In a preferred embodiment, the outer length L578 of the solder preform 578 may be at least 0.010 inches less than the outer length of the second planar surface 1310b in order to optimally provide good alignment tolerance. The lid 704 is coupled to the solder preform 578 using conventional vacuum sealing equipment and processes. The housing 1302, the sensor 1304, and the lid assembly 702 are preferably vacuum-sealed to remove excess gas from the cavity 1308.

The controller assembly 508 is preferably coupled to the bottom exterior surface 1314 of the housing 1302. The adhesive 580 is preferably coupled to the contact pad 1342. The controller 582 is preferably coupled to the adhesive 580.

The wire bonds 584 are preferably coupled to the controller 582 and the bond pads 1344. The wire bonds 584 are preferably coupled to the bond pads 1344 using conventional wire bonding equipment and processes. The wire bonds 584 are preferably coupled to the controller 582 using conventional wire bonding equipment and processes. The controller 582 and the wire bonds 584 are preferably encapsulated with the encapsulant 586.

In an alternate embodiment, the recess 1328 is optional. The resilient couplings 1306 may be located a perpendicular distance ranging, for example, from about 80 to 100 mils from the first wall 1316 of the cavity 1308 of the housing 1302 and may be located a perpendicular distance ranging, for example, from about 80 to 100 mils from the second wall 1318 of the cavity 1308 of the housing 1302. In a preferred embodiment, the resilient couplings 1306 are located a perpendicular distance ranging from about 85 to 95 mils from the first wall 1316 of the cavity 1308 of the housing 1302 in order to optimally minimize thermal stresses and located a distance ranging from about 85 to 95 mils from the second wall 1318 of the cavity 1308 of the housing 1302 in order to optimally minimize thermal stresses.

In an alternate embodiment, the housing 1302 further includes circuit components. The circuit components may be integrated into the housing 1302, for example, on any of the planar surfaces 1310 or any of the first exterior surfaces 1312a. In a preferred embodiment, the circuit components are integrated into the bottom exterior surface 1314 in order to optimally reduce the size of the sensor module 405. The circuit components may be, for example, filtering capacitors, resistors, or active components. In a preferred embodiment, the circuit components are filtering capacitors in order to optimally reduce system 100 size.

In an alternate embodiment, the lid assembly 702 is optional.

In an alternate embodiment, the controller assembly 508 is optional.

In an alternate embodiment, the sliding supports 1372 are optional.

In an alternate embodiment, the getter 706 is optional.

In an alternate embodiment, the exterior bond pads 1340 are optional.

In several alternate embodiments, the bond pads 1368 may be one of the following: the bond pads 1368b, the bond pad 1368c, the bond pad 1368d, the bond pad 1368e, and the bond pad 1368f as referenced to in Figs. 13M through 13Q.

In an alternate embodiment, the resilient couplings 1306 may be the resilient couplings 1306b and 1306c as referenced to in Fig. 13V.

In several alternate embodiments, the sliding supports 1372 may be the sliding supports 1372e, 1372f, or 1372g as referenced to in Figs. 13W through 13Y.

Referring to Figs. 16A through 16L, an alternate embodiment of the sensor package 405 preferably includes the housing 1402, the sensor 1304, the lid assembly 702, and the controller assembly 508. The lid assembly 702 is preferably coupled to the top of the housing 1402. The controller assembly 508 is preferably coupled to the top of the housing 1402. The sensor 1304 is preferably coupled within the housing 602.

The housing 1402 is preferably coupled to the sensor 1304, the lid assembly 702, the controller assembly 508, the electrical connections 510, the sliding supports 1372, and the resilient couplings 1306.

The sensor 1304 is preferably resiliently attached to the housing 1402 by the resilient couplings 1306, slidingly supported by the sliding supports 1372, and electrically coupled to the housing 1402 by the electrical connections 510. In a preferred embodiment, there is the single approximately circular bond pad 1368a located in the approximate of the sensor 1304.

The resilient couplings 1306 preferably resiliently attach the bond pads 1344 to the housing 1402. The resilient couplings 1306 may electrically couple the sensor 1304 to the housing 1402. The resilient couplings 1306 are preferably coupled to the bottom surface 1432 of the recess 1422 of the cavity 1404 of the housing 1402. In a preferred embodiment, there is the single approximately circular resilient coupling 1306a located in the recess 1422 of the housing 1402.

The number of sliding supports 1372 preferably depends on having sufficient sliding supports 1372 to slidingly support the sensor 1302. In a preferred embodiment, the sliding supports 1372 preferably have an approximately square cross sectional shape. The sliding supports 1372 are preferably coupled to the bottom surface 1420 of the housing 1402. In a preferred embodiment, there is the first sliding support 1372a, the second sliding support 1372b, the third sliding support 1372c, and the fourth sliding support 1372d.

The first sliding support 1372a is preferably located adjacent to one side of the resilient couplings 1306. The second sliding support 1372b is preferably located adjacent to the first sliding support 1372a. The third sliding support 1372c is preferably located adjacent to another side of the resilient couplings 1306. The fourth sliding support 1372d is preferably located adjacent to the third sliding support 1372c.

The electrical connections 510 preferably electrically couple the sensor 1304 to the housing 1402. In a preferred embodiment, there is the first electrical connection 510a and the second electrical connection 510b. The first electrical connection 510a preferably electrically couples the third planar surface 1406c of the housing 1402 to the top parallel planar surface 1354 of the sensor 1304. The second electrical connection 510b preferably electrically couples the fourth planar surface 1406d of the housing 1402 to the middle parallel planar surface 1356 of the sensor 1304.

The lid assembly 702 is preferably coupled to the housing 1402. The lid assembly 702 preferably includes the lid 704, the getter 706 and the spring 708.

In a preferred embodiment, the length L704 of the lid 704 may be at least 0.010 inches less than the length of the second planar surface 1406b in order to optimally provide good alignment tolerance. In a preferred embodiment, the width W704 of the lid 704 may be at least 0.010 inches less than the width of the second planar surface 1406b in order to optimally provide good alignment tolerance. The four arms 716 preferably couple the bottom surface 710 of the lid 704 to the top planar surface 1354 of the sensor 1304. The spring 708 preferably secures the sensor 1304 to the resilient couplings 1306. The getter 706 is coupled to the bottom surface 710 of the lid 704 using conventional welding equipment

and processes. The bottom surface 710 of the lid 704 is preferably coupled to the housing 1402 via the solder preform 578. In a preferred embodiment, the outer length L678 of the solder preform 578 may be at least 0.010 inches less than the outer length of the second planar surface 1406b in order to optimally provide good alignment tolerance. The lid 704 is preferably coupled to the solder preform 578 using conventional vacuum sealing equipment and processes. The housing 1402, the sensor 1304, and the lid assembly 702 are preferably vacuum-sealed to remove excess gas from the cavity 1404.

The controller assembly 508 is preferably coupled to the top surface 712 of the lid 704. The adhesive 580 is preferably coupled to the top surface 712 of the lid 704. The controller 582 is preferably coupled to the adhesive 580. The wire bonds 584 are preferably coupled to the controller 582 and the planar bond pads 1434. The wire bonds 584 are preferably coupled to the planar bond pads 1434 using conventional wire bonding equipment and processes. The wire bonds 584 are preferably coupled to the controller 582 using conventional wire bonding equipment and processes. The controller 582 and the wire bonds 584 are preferably encapsulated with the encapsulant 586.

In an alternate embodiment, the recess 1422 is optional. The resilient couplings 1306 may be located a perpendicular distance ranging, for example, from about 80 to 100 mils from the first wall 1412 of the cavity 1404 of the housing 1402 and may be located a perpendicular distance ranging, for example, from about 80 to 100 mils from the second wall 1414 of the cavity 1404 of the housing 1402. In a preferred embodiment, the resilient couplings 1306 are located a perpendicular distance ranging from about 85 to 95 mils from the first wall 1412 of the cavity 1404 of the housing 1402 in order to optimally minimize thermal stresses and located a distance ranging from about 85 to 95 mils from the second wall 1414 of the cavity 1404 of the housing 1402 in order to optimally minimize thermal stresses.

In an alternate embodiment, the housing 1402 further includes circuit components. The circuit components may be integrated into the housing 1402, for example, on any of the planar surfaces 1406 or any of the first exterior surfaces 1408. In a preferred embodiment, the circuit components are integrated

into the first planar surface 1406a in order to optimally reduce the size of the sensor module 405. The circuit components may be, for example, filtering capacitors, resistors, or active components. In a preferred embodiment, the circuit components are filtering capacitors in order to optimally reduce system 100 size.

In an alternate embodiment, the lid assembly 702 is optional.

In an alternate embodiment, the controller assembly 508 is optional.

In an alternate embodiment, the sliding supports 1372 are optional.

In an alternate embodiment, the getter 706 is optional.

In an alternate embodiment, the exterior bond pads 1436 are optional.

In several alternate embodiments, the bond pads 1368 may be one of the following: the bond pads 1368b, the bond pad 1368c, the bond pad 1368d, the bond pad 1368e, and the bond pad 1368f as referenced to in Figs. 13M through 13Q.

In an alternate embodiment, the resilient couplings 1306 may be the resilient couplings 1306b and 1306c as referenced to in Fig. 13V.

In several alternate embodiments, the sliding supports 1372 may be the sliding supports 1372e, 1372f, or 1372g as referenced to in Figs. 13W through 13Y.

Referring to Figs. 17A through 17J, an alternate embodiment of the sensor package 405 preferably includes a housing 1702, a sensor 1704, the lid assembly 702, and the controller assembly 508. The lid assembly 702 is preferably coupled to the top of the housing 1702. The controller assembly 508 is preferably coupled to the bottom of the housing 1702. The sensor 1704 is preferably coupled within the housing 1702.

In a preferred embodiment, the packaging of the housing 1702, the sensor 1704, and the lid assembly 702 are the sensor package arrangement substantially as disclosed in copending U. S. Patent Application Serial No. 08/935,093, Attorney Docket No. IOS011, filed on September 25,1997, the contents of which are incorporated herein by reference.

The housing 1702 is preferably coupled to the sensor 1704, the lid assembly 702, the controller assembly 508, and a spring assembly 1706. The

housing 1702 preferably includes a cavity 1708, one or more planar surfaces 1710, one or more exterior surfaces 1712, and a bottom exterior surface 1714.

The cavity 1708 preferably includes a first wall 1716, a second wall 1718, a third wall 1720 and a fourth wall 1722. The first wall 1716 and the third wall 1720 are preferably approximately parallel to each other and the second wall 1718 and the fourth wall 1722 are preferably approximately parallel to each other. The second wall 1718 and the fourth wall 1722 are also preferably perpendicular to the first wall 1716 and the third wall 1720. The cavity 1708 preferably includes a bottom surface 1724. The bottom surface 1724 may, for example, be plated with metal.

In a preferred embodiment, the bottom surface 1724 is gold plated in order to optimally provide a reliable electrical contact. The housing 1702 may, for example, be any number of conventional commercially available housings of the type ceramic, plastic or metal. In a preferred embodiment, the housing 1702 is ceramic in order to optimally provide vacuum sealing capability.

The housing 1702 preferably includes a first planar surface 1710a, a second planar surface 1710b, and a third planar surface 1710c. The first planar surface 1710a preferably includes one or more planar bond pads 1726. The planar bond pads 1726 are preferably approximately rectangularly shaped. The planar bond pads 1726 may, for example, be metal plated. In a preferred embodiment, the planar bond pads 1726 are gold plated in order to optimally provide solderability. The number of planar bond pads 1726 preferably depend on having sufficient planar bond pads 1726 to connect the sensor package 405 to the substrate 410. The second planar surface 1710b may, for example, be metal plated. In a preferred embodiment, the second planar surface 1710b is plated with gold in order to optimally provide solderability. The third planar surface 1710c may, for example, be metal plated. In a preferred embodiment, the third planar surface 1710c is plated with gold in order to optimally provide a reliable electrical connection.

The housing 1702 preferably includes a plurality of first exterior surfaces 1712a and a plurality of second exterior surfaces 1712b. In a preferred embodiment, there are four first exterior surfaces 1712a and four second exterior surfaces 1712b forming an approximate octagon. The second exterior surfaces

1712b preferably couple the first exterior surfaces 1712a to each other. The first exterior surfaces 1712a preferably include one or more exterior bond pads 1728.

The exterior bond pads 1728 are preferably approximately rectangularly shaped.

The exterior bond pads 1728 may, for example, be used for solder paste, solder balls or leads attachments. In a preferred embodiment, the exterior bond pads 1728 are used to solder the sensor package 405 to the substrate 410. The number of exterior bond pads 1728 preferably depend on having sufficient exterior bond pads 1728 to connect the sensor package 405 to the substrate 410.

The bottom exterior surface 1714 preferably includes a contact pad 1730, one or more bond pads 1732, and one or more connecting pads 1734. The contact pad 1730 may, for example, be metal plated. In a preferred embodiment, the contact pad 1730 is gold-plated in order to optimally provide a reliable electrical connection. The planar bond pads 1726 from the first planar surface 1710a are preferably electrically coupled to the bond pads 1732 on the bottom exterior surface 1714 by electrical paths molded into the housing 1702. The second planar surface 1710b, the third planar surface 1710c, and the bottom surface 1724 are preferably coupled to one or more bond pads 1732, on the bottom exterior surface 1714, by electrical paths molded into the housing 1702. The bond pads 1732 may, for example, be metal plated. In a preferred embodiment, the bond pads 1732 are gold plated in order to optimally provide wire bonding.

The number of bond pads 1732 preferably depend on having sufficient bond pads 1732 to connect the controller assembly 508 to the housing 1702. The connecting pads 1734 may, for example, be metal plated. In a preferred embodiment, the wiring pads 1734 are gold-plated in order to optimally provide a conductive pathway between the bond pads 1732 and the contact pad 1730. In a preferred embodiment, there is a first connecting pad 1734a and a second connecting pad 1734b. The exterior bond pads 1728 are preferably electrically coupled to the bond pads 1732 by electrical paths molded into the housing 1702.

The sensor 1704 is preferably coupled to the bottom surface 1724 of the housing 1702. The sensor 1704 preferably has an approximately rectangular cross-sectional shape. In a preferred embodiment, the sensor 1704 includes a first member 1736, a second member 1738, and a third member 1740. The first

member 1736 is preferably on top of the second member 1738 and the second member 1738 is preferably on top of the third member 1740. In a preferred embodiment, the first member 1736, the second member 1738, and the third member 1740 are a micro machined sensor substantially as disclosed in copending U. S. Patent Application Serial No., Attorney Docket No.

14737.737, filed on, the contents of which are incorporated herein by reference.

The first member 1736 preferably includes one or more parallel planar surfaces. In a preferred embodiment, the first member includes a top parallel planar surface 1742. The second member 1738 preferably includes one or more parallel planar surfaces. In a preferred embodiment, the second member 1738 includes a first middle parallel planar surface 1744 and a second middle parallel planar surface 1746.

The sensor 1704 is preferably coupled to the housing via the spring assembly 1706 and a shorting clip 1748. The spring assembly 1706 is preferably fabricated from one piece of spring material which is bent into a middle spring member 1750, a side spring member 1752 and a side support member 1754. The middle spring member 1750 is preferably approximately perpendicular to both the side spring member 1752 and the side support member 1754. The middle spring member 1750 preferably has a flat top surface 1756 that curls down to a loop 1758. The side spring member 1752 preferably has a flat top surface 1760 that curls down to a loop 1762. The side support member 1754 has a flat top surface 1764 that bends down at a right angle.

The spring assembly 1706 is preferably inserted into the cavity 1708. The middle spring member 1750 flat top surface 1756, the side spring member 1752 flat top surface 1760, and the side support member 1754 flat top surface 1764 are preferably coupled to the third planar surface 1710c of the housing 1702. In a preferred embodiment, the spring assembly 1706 is welded to the third planar surface 1710c of the housing 1702 in order to optimally provide mechanical and electrical connection to the sensor 1704. The middle spring member 1750 loop 1758 and the side spring member 1752 loop 1762 preferably secure the sensor 1704 within the cavity 1708 of the housing 1702.

The shorting clip 1748 preferably extends around the first middle planar surface 1744 of the sensor 1704 and the second middle planar surface 1746 of the sensor 1704. The shorting clip 1748 preferably contacts the spring assembly 1706 securing the sensor 1704 within the cavity 1708 of the housing 1702 providing a conductive pathway between the center member 1738 of the sensor 1704, to the third planar surface 1710c of the housing 1702. The shorting clip 1748 may, for example, be fabricated from about 0.003 inch stainless steel or beryllium copper strip. In a preferred embodiment, the shorting clip 1748 is stainless steel in order to optimally provide good mechanical strength and stable properties.

The lid assembly 702 is preferably coupled to the housing 1702. In a preferred embodiment, the length L704 of the lid 704 may be at least 0.010 inches less than the length of the second planar surface 1406b in order to optimally provide good alignment tolerance. In a preferred embodiment, the width W704 of the lid 704 may be at least 0.010 inches less than the width of the second planar surface 1710b in order to optimally provide good alignment tolerance. The spring 708 is preferably welded to the bottom surface 710 of the lid 704 and the four arms 716 preferably couple the bottom surface 710 of the lid 704 to the top parallel planar surface 1742 of the sensor 1704. The spring 708 preferably secures the sensor 1704 to the bottom surface 1724 of the cavity 1708. The bottom member 1740 preferably electrically couples the sensor 1704 to the housing 1702 via the bottom surface 1724. The getter 706 is preferably coupled to the bottom surface 710 of the lid 704 using conventional welding equipment and processes. The bottom surface 710 of the lid 704 is preferably coupled to the housing 1702 via the solder preform 578. In a preferred embodiment, the outer length Lgyg of the solder preform 578 may be at least 0.010 inches less than the outer length of the second planar surface 1710b in order to optimally provide good alignment tolerance. The lid 704 is preferably coupled to the solder preform 578 using conventional vacuum sealing equipment and processes. The housing 1702, the sensor 1704, and the lid assembly 702 are preferably vacuum-sealed to remove excess gas from the cavity 1708. The lid 704 preferably electrically couples the housing 1702 to the sensor 1704 via the spring 708.

The controller assembly 508 is preferably coupled to the bottom exterior surface 1714 of the housing 1702. The adhesive 580 is preferably coupled to the contact pad 1730 on the bottom exterior surface of the housing 1702. The wire bonds 584 are preferably coupled to the controller 582 and the bond pads 1732.

The wire bonds 584 are preferably coupled to the bond pads 1732 using conventional wire bonding equipment and processes. The wire bonds 584 are coupled to the controller 582 using conventional wire bonding equipment and processes.

In an alternate embodiment, the housing 1702 further includes circuit components. The circuit components may be integrated into the housing 1702, for example, on any of the planar surfaces 1710 or any of the first exterior surfaces 1712. In a preferred embodiment, the circuit components are integrated into the bottom exterior surface 1714 in order to optimally reduce the size of the sensor module 405. The circuit components may be, for example, filtering capacitors, resistors, or active components. In a preferred embodiment, the circuit components are filtering capacitors in order to optimally reduce system 100 size.

In an alternate embodiment, the lid assembly 702 is optional.

In an alternate embodiment, the controller assembly 508 is optional.

In an alternate embodiment, the getter 706 is optional.

In an alternate embodiment, the exterior bond pads 1728 are optional.

In an alternate embodiment, the housing 1702 further includes the sliding supports 1372. The number of sliding supports 1372 preferably depends on having sufficient sliding supports 1372 to slidingly support the sensor 1704. In a preferred embodiment, the sliding supports 1372 preferably have an approximately square cross sectional shape. The sliding supports 1372 are preferably coupled to the bottom surface 1724 of the housing 1702. In a preferred embodiment, there is the first sliding support 1372a, the second sliding support 1372b, the third sliding support 1372c, and the fourth sliding support 1372d.

The first sliding support 1372a may be located a perpendicular distance ranging, for example, from about 45 to 75 mils from the first wall 1716 of the

cavity 1708 of the housing 1702 and may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the second wall 1718 of the cavity 1708 of the housing 1702. In a preferred embodiment, the first sliding support 1372a is located a perpendicular distance ranging from about 52 to 62 mils from the first wall 1716 of the cavity 1708 of the housing 1702 in order to optimally minimize thermal stresses and located a perpendicular distance from about 90 to 105 mils from the second wall 1718 of the cavity 1708 of the housing 1702 in order to optimally minimize thermal stresses.

The second sliding support 1372b may be located a perpendicular distance ranging, for example, from about 45 to 75 mils from the first wall 1716 of the cavity 1708 of the housing 1702 and may be located a perpendicular distance ranging, for example, from about 15 to 30 mils from the second wall 1718 of the cavity 1708 of the housing 1702. In a preferred embodiment, the second sliding support 1372b is located a perpendicular distance ranging from about 52 to 62 mils from the first wall 1716 of the cavity 1708 of the housing 1702 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 20 to 25 mils from the second wall 1718 of the cavity 1708 of the housing 1702 in order to optimally minimize thermal stresses.

The third sliding support 1372c may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the first wall 1716 of the cavity 1708 of the housing 1702 and may be located a perpendicular distance ranging, for example, from about 15 to 30 mils from the second wall 1718 of the cavity 1708 of the housing 1702. In a preferred embodiment, the third sliding support 1372c is located a perpendicular distance ranging from about 90 to 105 mils from the first wall 1716 of the cavity 1708 of the housing 1702 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 20 to 25 mils from the second wall 1718 of the cavity 1708 of the housing 1702 in order to optimally minimize thermal stresses.

The fourth sliding support 1372d may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the first wall 1716 of the cavity 1708 of the housing 1702 and may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the second wall 1718 of the

cavity 1708 of the housing 1702. In a preferred embodiment, the fourth sliding support 1372b is located a perpendicular distance ranging from about 90 to 105 mils from the first wall 1716 of the cavity 1708 of the housing 1702 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 90 to 105 mils from the second wall 1718 of the cavity 1708 of the housing 1702 in order to optimally minimize thermal stresses. In a preferred embodiment, the sliding supports 1372 are coupled to the bottom surface 1724 of the cavity 1708 of the housing 1702 using conventional means of integrating the sliding supports 1372 into the housing 1702.

In several alternate embodiments, the sliding supports 1372 may be the sliding supports 1372e, 1372f, or 1372g as referenced to in Figs. 13W through 13Y.

Referring to Figs. 18A through 18J, an alternate embodiment of the sensor package 405 preferably includes a housing 1802, the sensor 1704, the lid assembly 702, and the controller assembly 508. The lid assembly 702 is preferably coupled to the top of the housing 1802. The controller assembly 508 is preferably coupled to the top of the housing 1802. The sensor 1704 is preferably coupled within the housing 1802.

In a preferred embodiment, the packaging of the housing 1802, the sensor 1704, and the lid assembly 702 are the sensor package arrangement substantially as disclosed in copending U. S. Patent Application Serial No. 08/935,093, Attorney Docket No. IOS011, filed on September 25,1997, the contents of which are incorporated herein by reference.

The housing 1802 is preferably coupled to the sensor 1704, the lid assembly 702, the controller assembly 508, and the spring assembly 1706. The housing preferably includes a cavity 1804, one or more planar surfaces 1806, one or more exterior surfaces 1808, and a bottom exterior surface 1810. The cavity 1804 preferably includes a first wall 1812, a second wall 1814, a third wall 1816 and a fourth wall 1818. The first wall 1812 and the third wall 1816 are preferably approximately parallel to each other and the second wall 1814 and the fourth wall 1818 are preferably approximately parallel to each other. The second wall 1814 and the fourth 1818 wall are also preferably perpendicular to the first

wall 1812 and the third wall 1816. The cavity 1804 preferably includes a bottom surface 1820. The bottom surface 1820 may, for example, be metal plated. In a preferred embodiment, the bottom surface 1820 is gold plated in order to optimally provide a reliable electrical contact. The housing 1802 may, for example, be any number of conventional commercially available housings of the type ceramic, plastic or metal. In a preferred embodiment, the housing 1802 is ceramic in order to optimally provide vacuum sealing capability.

The housing 1802 preferably includes a first planar surface 1806a, a second planar surface 1806b, and a third planar surface 1806c. The first planar surface 1806a preferably includes one or more planar bond pads 1822. The planar bond pads 1822 are preferably approximately rectangularly shaped. The planar bond pads 1822 may, for example, be metal plated. In a preferred embodiment, the planar bond pads 1822 are gold in order to optimally provide good wire bonding. The planar bond pads 1822 are preferably used for wire- bonding the controller 508 to the housing 1802. The third planar surface 1806c may, for example, be metal plated. In a preferred embodiment, the third planar surface 1806c is plated with gold in order to optimally provide wire bonding. The second planar surface 1806b, the third planar surface 1806c, and the bottom surface 1820 are preferably coupled to the one of the planar bond pads 1822 on the first planar surface 1806a by electrical paths molded into the housing 1802.

The housing 1802 preferably includes a plurality of first exterior surfaces 1808a and a plurality of second exterior surfaces 1808b. In a preferred embodiment, there are four first exterior surfaces 1808a and four second exterior surfaces 1808b forming an approximate octagon. The second exterior surfaces 1808b preferably couple the first exterior surfaces 1808a to each other. The first exterior surfaces 1808a include one or more exterior bond pads 1824. The exterior bond pads 1824 are preferably approximately rectangularly shaped. The exterior bond pads 1824 may, for example, be used for solder paste, solder balls or leads attachment. In a preferred embodiment, the exterior bond pads 1824 are used to solder the sensor packages 405 to the substrate 410. The number of exterior bond pads 1824 preferably depend on having sufficient exterior bond pads 1824 to connect the sensor package 405 to the substrate 410. The exterior

bond pads 1824 are preferably electrically coupled to the planar bond pads 1822 via electrical paths molded into the housing 1802.

The bottom exterior surface 1810 preferably includes one or more bond pads 1826. The bond pads 1826 are preferably approximately circular in shape.

The bond pads 1826 may be, for example, used for solder paste, solder balls, or leads attachments. In a preferred embodiment, the bond pads 1826 are gold plated in order to optimally provide solderability. The number of bond pads 1826 preferably depend on having sufficient bond pads 1826 to connect the sensor module 405 to the substrate 410. The exterior bond pads 1824 are preferably electrically connected to the bond pads 1826 via electrical paths molded into the housing 1802.

The sensor 1704 is preferably coupled to the bottom surface 1820 of the housing 1802. The sensor 1704 is preferably coupled to the housing 1802 via the spring assembly 1706 and the shorting clip 1748. The spring assembly 1706 is preferably inserted into the cavity 1804. The middle spring member 1750 flat top surface 1756, the side spring member 1752 flat top surface 1760, and the side support member 1754 flat top surface 1764 are preferably coupled to the third planar surface 1806c of the housing 1802. In a preferred embodiment, the spring assembly 1706 is welded to the third planar surface 1806c of the housing 1802 in order to optimally provide mechanical and electrical connections to the sensor 1704. The middle spring member 1750 loop 1758 and the side spring member 1752 loop 1762 preferably secure the sensor 1704 within the cavity 1804 of the housing 1802.

The shorting clip 1748 preferably extends around the first middle planar surface 1744 of the sensor 1704 and the second middle planar surface 1746 of the sensor 1704. The shorting clip 1748 preferably contacts the spring assembly 1706 securing the sensor 1704 within the cavity 1804 of the housing 1802 providing a conductive pathway between the center member 1738 of the sensor 1704, to the third planar surface 1806c of the housing 1802. The shorting clip 1748 may, for example, be fabricated from about 0.003 inch stainless steel or beryllium copper strip. In a preferred embodiment, the shorting clip 1748 is

stainless steel in order to optimally provide good mechanical strength and stable properties.

The lid assembly 702 is preferably coupled to the housing 1802. In a preferred embodiment, the width W704 of the lid 704 may be at least 0.010 inches less than the width of the second planar surface 1806b in order to optimally provide good alignment tolerance. The four arms 716 preferably couple the bottom surface 710 of the lid 704 to the top planar surface 1742 of the sensor 1704. The bottom surface 710 of the lid 704 is preferably coupled to the housing 1802 via the solder preform 578. In a preferred embodiment, the outer length L578 of the solder preform 578 may be at least 0.010 inches less than the outer length of the second planar surface 1806b in order to optimally provide good alignment tolerance. The spring 708 is preferably welded to the bottom surface 710 of the lid 704 and the four arms 716 preferably couple the bottom surface 710 of the lid 704 to the top parallel planar surface 1742 of the sensor 1704. The spring 708 preferably secures the sensor 1704 to the bottom surface 1820 of the cavity 1804. The bottom member 1740 preferably electrically couples the sensor 1704 to the housing 1802 via the planar bond pads 18223. The lid 704 is coupled to the solder preform 578 using conventional vacuum sealing equipment and processes. The housing 1802, the sensor 1704, and the lid assembly 702 are preferably vacuum-sealed to remove excess gas from the cavity 1804.

The controller assembly 508 is preferably coupled to the top surface 712 of the lid 704. The adhesive 580 is preferably coupled to the top surface 712 of the lid 704. The wire bonds 584 are preferably coupled to the controller 582 and the planar bond pads 1822. The controller assembly 508 preferably includes a first wire bond 584a and a second wire bond 584b. The first wire bond 584a preferably couples the first planar bond pad 1822a to the controller 582. The second wire bond 584b preferably couples the second planar bond pad 1822b to the controller 582. The wire bonds 584 are coupled to the planar bond pads 1822 using conventional wire bonding equipment and processes. The wire bonds 584 are coupled to the controller 582 using conventional wire bonding equipment and processes.

In an alternate embodiment, the housing 1802 further includes circuit components. The circuit components may be integrated into the housing 1802, for example, on any of the planar surfaces 1806 or any of the first exterior surfaces 1808. In a preferred embodiment, the circuit components are integrated into the first planar surface 1806a in order to optimally reduce the size of the sensor module 405. The circuit components may be, for example, filtering capacitors, resistors, or active components. In a preferred embodiment, the circuit components are filtering capacitors in order to optimally reduce system 100 size.

In an alternate embodiment, the lid assembly 702 is optional.

In an alternate embodiment, the controller assembly 508 is optional.

In an alternate embodiment, the getter 706 is optional.

In an alternate embodiment, the exterior bond pads 1824 are optional.

In an alternate embodiment, the housing 1802 further includes the sliding supports 1372. The number of sliding supports 1372 preferably depends on having sufficient sliding supports 1372 to slidingly support the sensor 1704. In a preferred embodiment, the sliding supports 1372 preferably have an approximately square cross sectional shape. The sliding supports 1372 are preferably coupled to the bottom surface 1820 of the housing 1802. In a preferred embodiment, there is the first sliding support 1372a, the second sliding support 1372b, the third sliding support 1372c, and the fourth sliding support 1372d.

The first sliding support 1372a may be located a perpendicular distance ranging, for example, from about45 to 75 mils from the first wall 1812 of the cavity 1804 of the housing 1802 and may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the second wall 1814 of the cavity 1804 of the housing 1802. In a preferred embodiment, the first sliding support 1372a is located a perpendicular distance ranging from about 52 to 62 mils from the first wall 1812 of the cavity 1804 of the housing 1802 in order to optimally minimize thermal stresses and located a perpendicular distance from about 90 to 105 mils from the second wall 1814 of the cavity 1804 of the housing 1802 in order to optimally minimize thermal stresses.

The second sliding support 1372b may be located a perpendicular distance ranging, for example, from about 45 to 75 mils from the first wall 1812 of the cavity 1804 of the housing 1802 and may be located a perpendicular distance ranging, for example, from about 15 to 30 mils from the second wall 1814 of the cavity 1804 of the housing 1802. In a preferred embodiment, the second sliding support 1372b is located a perpendicular distance ranging from about 52 to 62 mils from the first wall 1812 of the cavity 1804 of the housing 1802 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 20 to 25 mils from the second wall 1814 of the cavity 1804 of the housing 1802 in order to optimally minimize thermal stresses.

The third sliding support 1372c may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the first wall 1812 of the cavity 1804 of the housing 1802 and may be located a perpendicular distance ranging, for example, from about 15 to 30 mils from the second wall 1814 of the cavity 1804 of the housing 1802. In a preferred embodiment, the third sliding support 1372c is located a perpendicular distance ranging from about 90 to 105 mils from the first wall 1812 of the cavity 1804 of the housing 1802 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 20 to 25 mils from the second wall 1814 of the cavity 1804 of the housing 1802 in order to optimally minimize thermal stresses.

The fourth sliding support 1372d may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the first wall 1812 of the cavity 1804 of the housing 1802 and may be located a perpendicular distance ranging, for example, from about 85 to 115 mils from the second wall 1814 of the cavity 1804 of the housing 1802. In a preferred embodiment, the fourth sliding support 1372b is located a perpendicular distance ranging from about 90 to 105 mils from the first wall 1812 of the cavity 1804 of the housing 1802 in order to optimally minimize thermal stresses and located a perpendicular distance ranging from about 90 to 105 mils from the second wall 1814 of the cavity 1804 of the housing 1802 in order to optimally minimize thermal stresses. In a preferred embodiment, the sliding supports 1372 are coupled to the bottom

surface 1820 of the cavity 1804 of the housing 1802 using conventional means of integrating the sliding supports 1372 into the housing 1802.

In several alternate embodiments, the sliding supports 1372 may be the sliding supports 1372e, 1372f, or 1372g as referenced to in Figs. 13W through 13Y.

Referring to Fig. 19, an alternate embodiment of the sensor module 305 preferably includes the sensor packages 405, a substrate 410, and a monolithic package 1902. The sensor packages 405 are preferably coupled to the monolithic package 1902. In a preferred embodiment, the sensor module 305 includes a first sensor package 405a, a second sensor package 405b, and a third sensor package 405c. The first sensor package 405a preferably includes an axis of sensitivity 415. The axis of sensitivity 415 is preferably approximately parallel to the x-axis.

The first sensor package 405a is preferably coupled to the monolithic package 1902 to maintain the axis of sensitivity 415 parallel to the x-axis. The second sensor package 405b preferably includes an axis of sensitivity 420. The axis of sensitivity 420 is preferably approximately parallel to the y-axis. The second sensor package 405b is preferably coupled to the monolithic package 1902 to maintain the axis of sensitivity 420 parallel to the y-axis. The third sensor package 405c preferably includes an axis of sensitivity 425. The axis of sensitivity 425 is preferably approximately parallel to the z-axis. The third sensor package 405c is preferably coupled to the monolithic package 1902 to maintain the axis of sensitivity 425 parallel to the z-axis.

The sensor packages 405 may, for example, be coupled to the monolithic package 1902 using one of the following methods: integrated as part of the monolithic package 1902, rigidly attached to the monolithic package 1902, or removably attached to the monolithic package 1902. In a preferred embodiment, the sensor packages 405 are coupled to the monolithic package 1902 by removably attaching the sensor packages 405 into the monolithic package 1902 in order to optimally provide cost-effectiveness and good manufacturability. In several alternate embodiments, the removable attachment methods include socketing, screw attaching or other mechanical attachment methods.

The monolithic package 1902 may, for example, be plastic, ceramic, or metal. In a preferred embodiment, the monolithic package 1902 is plastic in order to optimally provide ease of manufacturing and cost effectiveness. The monolithic package 1902 may be, for example, a hollow frame, a box, a three- dimensional circuit board, a cylinder, or a cube. The monolithic package 1902 is preferably coupled to the substrate 410. The monolithic package 1902 may, for example, be coupled to the substrate 410 using one of the following methods: solder-paste surface mount, solder-ball, leads, connectors, epoxies, mechanical connections or wire bonding. The monolithic package 1902 is preferably coupled to the substrate 410 by leads in order to optimally provide cost effectiveness and good manufacturability.

In several alternate embodiments, rigidly attaching the sensor packages 405 to the monolithic package 1902 includes using solder, epoxies, or glass frit bonding.

In several alternate embodiments, the monolithic package 1902 includes recesses adapted to receive the sensor packages 405.

In several alternate embodiments, the sensor packages 405 may be the sensors 504,902,1304, or 1704 as described above with reference to Figs. 5B, 9B, 13B and 17B. The sensors 504,902,1304, or 1704 may be coupled to the monolithic package 1902 by the methods substantially as disclosed in copending U. S. Patent Application Serial No., Attorney Docket No. 14737.743, filed on, the contents of which are incorporated herein by reference. In an alternate embodiment, the sensors 504,902,1304, or 1704 are further vacuum-sealed into the monolithic package 1902.

Referring to Fig. 20, an alternate embodiment of the sensor module 305 includes one or more sensor packages 405. The sensor packages 405 are preferably coupled to each other. In a preferred embodiment, the sensor module 305 includes the first sensor package 405a, the second sensor package 405b, and the third sensor package 405c. The first sensor package 405a preferably includes an axis of sensitivity 415. The axis of sensitivity 415 is preferably approximately parallel to the x-axis. The first sensor package 405a is preferably coupled to the second sensor package 405b to maintain the axis of sensitivity 415 parallel to the

x-axis. The second sensor package 405b preferably includes an axis of sensitivity 420. The axis of sensitivity 420 is preferably approximately parallel to the y-axis.

The second sensor package 405b is preferably coupled to the first sensor package 405a and the third sensor package 405c to maintain the axis of sensitivity 420 parallel to the y-axis. The third sensor package 405c preferably includes an axis of sensitivity 425. The axis of sensitivity 425 is preferably approximately parallel to the z-axis. The third sensor package 405c is preferably coupled to the second sensor package 405b to maintain the axis of sensitivity 425 parallel to the z-axis.

The sensor packages 405 may, for example, be coupled to each other using one of the following methods: solder, epoxy, or mechanical attachment. In a preferred embodiment, the sensor packages 405 are coupled to each other by solder in order to optimally provide good manufacturability.

Referring to Figs. 21A through 21C, in an alternate embodiment, the sensor package 405 preferably includes one or more substrats 2102 and one or more sensors 2118. The substrats 2102 are preferably coupled to the sensors 2118.

The substrats 2102 may be, for example, ceramic, PC-board or silicon. In a preferred embodiment, there is a single substrate 2102. The substrate 2102 preferably includes a top planar surface 2128 and a bottom planar surface 2130.

The top planar surface 2128 preferably includes one or more traces 2104. The bottom planar surface preferably includes one or more traces 2104. The traces 2104 may be, for example, aluminum, copper or gold. In a preferred embodiment, the traces 2104 are gold in order to optimally provide conductivity and solder interconnection. The number of traces 2104 preferably depends on having sufficient traces 2104 to couple the sensor 2118 to the package 2102.

The substrate 2102 preferably further includes one or more slots 2106.

The slots 2106 preferably include a first wall 2108, a second wall 2110, a third wall 2112, and a fourth wall 2114. The first wall 2108 and the third wall 2112 are preferably approximately parallel to each other and the second wall 2110 and the fourth wall 2114 are preferably approximately parallel to each other. The second wall 2110 and the fourth 2114 wall are also preferably perpendicular to the first wall 2108 and the third wall 2112. The slots 2106 are preferably

adapted to receive the sensors 2118. The length of the slot L2l06 may range, for example, from about 5000 to 15000 microns. In a preferred embodiment, the length of the slot L2l06 ranges from about 5000 to 7000 microns in order to optimally provide vertical alignment. The width of the slot W2l06 may range, for example, from about 500 to 2000 microns. In a preferred embodiment, the width of the slot W2l06 ranges from about 1000 to 1200 microns in order to optimally provide vertical alignment.

The sensors 2118 are preferably coupled to the substrate 2102. The sensors 2118 preferably have an approximately rectangular cross-sectional shape.

In a preferred embodiment, the sensors 2118 includes a first member 2120, a second member 2122, and a third member 2124. The first member 2120 is preferably on top of the second member 2122 and the second member 2122 is preferably on top of the third member 2124. In a preferred embodiment, the first member 2120, the second member 2122, and the third member 2124 are a micro machined sensor substantially as disclosed in copending U. S. Patent Application Serial No., Attorney Docket No. 14737.737, filed on the contents of which are incorporated herein by reference.

The sensors 2118 preferably further include an axis of sensitivity 2132.

The sensors 2118 are preferably coupled to substrate 2102 to maintain the axis of sensitivity 2132 parallel to the substrate 2102. The second member 2122 preferably has an extended tab 2116. The extended tab 2116 is preferably adapted to insert into the slots 2106 of the substrate 2102. The sensors 2122 are preferably resiliently coupled to the substrate 2102 by one or more connections 2126. The connections 2126 may be, for example, micro-welding, solder pastes or conductive adhesive. In a preferred embodiment, the connections 2126 are solder paste in order to optimally provide tensile strength. The solder pastes 2126 may be, for example, of the type eutectic or non-eutectic. In a preferred embodiment, the solder pastes 2126 are eutectic in order to optimally provide temperature hierarchy and tensile strength. The solder pastes 2126 preferably couple one or more traces 2104 to the sensor 2122. In a preferred embodiment, there is a first trace 2104a, a second trace 2104b, a third trace 2104c and a fourth trace 2104d. The first trace 2104a is preferably located on the top planar surface

2128 and is preferably coupled to the first member 2120. The second trace 2104b is preferably located on the top planar surface 2128 and is preferably coupled to the third member 2124. The third trace 2104c may be, for example, a redundant connection to the second member 2122 or not used. The fourth trace 2104d is preferably located on the bottom planar surface 2130 and is preferably coupled to second member 2122.

Referring to Fig. 21D, in an alternate embodiment, the sensor package 405 as referenced to in Figs. 21A through 21C, includes a first substrate 2102a and a second substrate 2102b. The second substrate preferably includes a top planar surface 2154 and a bottom planar surface 2156. The third trace 2104c and the fourth trace 2104d may be coupled to the second substrate 2102b, for example, by solder paste, conductive epoxy, or wafer bonding techniques. The fourth trace 2104d may be located on the top planar surface 2154 of the second substrate 2102b or on the bottom planar surface 2130 of the first substrate 2102a. The fourth trace 2104d preferably couples the second member 2122 to a bond pad 2150. The bond pad 2150 may be coupled to a bond wire 2152. The sensor package 405 may be surface or flush mounted. The sensor 2118 preferably has one or more leads coming from the first member 2120 and the third member 2124. The substrate 2102b preferably acts like a mechanical spacer.

Referring to Figs. 22A through 22D, in several alternate embodiments, the housings 502,602,1302, and 1402, as described above with reference to Figs. 5B, 6B, 13B and 14B, include one or more pedestals 2202a or 2202b for supporting one or more resilient couplings. The pedestals 2202a and 2202b may be fabricated from, for example, tungsten or ceramic. In a preferred embodiment, the pedestals 2202a and 2202b are fabricated from ceramic. The height H2202 of the pedestals 2202a and 2202b may range, for example, from about 0 to 10 mils.

In a preferred embodiment, the height H2202 of the pedestals 2202a and 2202b is approximately 5 mils. The pedestal 2202a is preferably a rectangular shaped support pipe. The pedestal 2202a preferably has straight edges. In an alternate embodiment, the pedestal 2202b is a cylindrical section. The pedestal 2202b preferably has tapered sides. In an alternate embodiment, the pedestal 2202b has straight sides. In a preferred embodiment, the pedestals 2202a and 2202b

have a shape that optimally minimizes the thermal stresses between the pedestals 2202a and 2202b and the resilient couplings it supports.

Referring to Figs. 23A and 23B, in an alternate embodiment, the sensor module 305 includes the substrate 2102 and one or more sensors 2118. In a preferred embodiment, there is a first sensor 2118a, a second sensor 2118b, and a third sensor 2118c. The first sensor 2118a and the second sensor 2118b are preferably inserted into one or more slots 2106 and resiliently coupled to the substrate 2102 by one or more solder pastes 2126 as previously described above with reference to Figs. 21A through 21D. The third sensor 2118c is resiliently coupled to the substrate 2102 using any of the resilient couplings 512,904 or 1306 as previously described above with reference to Figs. 5C, 9C or 13C. The third sensor 2118c is also slidingly supported by the sliding supports 514,940, or 1372 as previously described above with reference to Figs. 5C, 9C or 13C. In an alternate embodiment, the sliding supports 514,940, or 1372 are optional.

Referring to Fig. 24, in several alternate embodiments of the sensor package 405, the housings 502,602,1302,1402,1702 and 1802, as described above with reference to Figs. 5B, 6B, 13B, 14B, 17B, and 18B, further include a cavity 2402 preferably adapted to receive the controller 582. The housings 502 and 1302 further include one or more external planar surfaces 2404. In a preferred embodiment, there is a first external planar surface 2404a, a second external planar surface 2404b, and a third external planar surface 2404c. The second external planar surface 2404b preferably includes the bond pads 540,622, 1344, and 1434 as described above with reference to Figs. 5E, 6C, 13E, and 14C.

The cavity 2402 preferably includes a first wall 2406a, a second wall 2406b, a third wall 2406c, and a fourth wall 2406d. The first wall 2406a and the third wall 2406c are preferably approximately parallel to each other and the second wall 2406b and the fourth wall 2406d are preferably approximately parallel to each other. The second wall 2406b and the fourth wall 2406d are also preferably perpendicular to the first wall 2406a and the third wall 2406c. The controller 582 may be coupled to the third external planar surface 2404c, for example, by solder or epoxy. The wire bonds 584 preferably couple the controller 582 to the second external planar surface 2404b. A lid 2408 preferably encloses the

controller 582, the wire bonds 584, and the cavity 2402. The lid 2408 is preferably coupled to the first external planar surface 2404a. The lid 2408 preferably includes solder preforms 2410. The solder preforms 2410 are preferably coupled to the first external planar surface 2404a using conventional soldering equipment and processes.

Referring to Figs. 25A and 25B, in several alternate embodiments, the controller assembly 508 includes the adhesive 580, the controller 582, the wire bonds 584, and a hermetic cap 2502. The hermetic cap 2502 may be, for example, of the type ceramic or metal. In a preferred embodiment, the hermetic cap 2502 is metal in order to optimally provide good hermetic sealing. The hermetic cap 2502 is coupled to the housings 502,602,1302,1402,1702 and 1802 as described above with reference to Figs. 5B, 6B, 13B, 14B, 17B and 18B.

The hermetic cap 2502 may be, for example, press-fit, epoxied, soldered or seam- sealed to the housings 502,602,1302,1402,1702 and 1802. In a preferred embodiment, the hermetic cap 2502 is soldered to the housings 502,602,1302, 1402,1702 and 1802 in order to optimally provide good hermetic sealing.

Referring to Figs. 26A and 26B, in an alternate embodiment, the sensor package 405 includes the controller 582 preferably coupled to the housings 502, 602,1302,1402,1702 and 1802, as described above with reference to Figs. 5B, 6B, 13B, 14B, 17B and 18B, by one or more connections 2602. The connections 2602 may be, for example, leads, solder, conductive epoxy, or ball-grid arrays.

The controller 582 is preferably an integrated chip industry-standard package.

The integrated chip industry-standard package may be, for example, ceramic or plastic.

Referring to Figs. 27A and 27B, in an alternate embodiment, the sensor package 405 includes a substrate 2702. The controller 582 is coupled to the substrate 2702. The substrate 2702 is coupled to the controller 582 by one or more electrical attachments 2704. The substrate 2702 may be, for example, ceramic or organic. The substrate 2702 is also coupled to the housings 502,602, 1302,1402,1702, and 1802, as described above with reference to Figs. 5B, 6B, 13B, 14B, 17B and 18B, by one or more electrical attachments 2704. The electrical attachments 2704 may be, for example, leads, solder, conductive epoxy,

or ball grid arrays. The controller 582 may be, for example, an application specific integrated circuit die or an integrated chip industry standard package with connections. The integrated chip industry standard package may be, for example, ceramic or plastic. The solder attachments 2704 may be, for example, leads, solder, conductive epoxy, or ball-grid arrays. The substrate 2702 further includes conventional means of lead out, for example, leads, connectors or solder joints.

In an alternate embodiment, the substrate 2702 further includes circuit components. The circuit components may be, for example, filtering capacitors, resistors, or active components. In a preferred embodiment, the circuit components are filtering capacitors in order to optimally provide reduced system 100 size.

In several alternate embodiments, the housings 502 and 602, as described above with reference to Figs. 5B and 6B, include one or more recesses 1326, for receiving one or more resilient couplings substantially as described above with reference to Fig. 13B.

In several alternate embodiments, the cavities 516,604,1308,1404,1708, and 1804, as described above with reference to Figs. 5B, 6B, 7B, 8B, 9B, 10B, 11B, 12B, 13B, 14B, 15B, 16B, 17B, and 18B, may be further filled with other materials. The materials may be, for example, gels or molded plastics.

In several alternate embodiments, splitting the resilient attachment of the sensor 504,902, and 1304, as described above with reference to Figs. 5B, 9B, and 13B, to the housing 502,602,1302, and 1402, as described above with reference to Figs. 5B, 6B, 13B, and 14B, reduces the stress from the attachment.

In several alternate embodiments, the resilient couplings 512,904, and 1306, as described above with reference to Figs. 5B, 9B and 13B, are split into one or more pieces by splitting solder preform, conductive epoxy, non-conductive epoxy, or glass frit.

In several alternate embodiments, the bond pads 564,926, and 1368 as described above with reference to Figs. 5B, 9B and 13B, are split into one or more pieces by splitting the bond pads 564,926, and 1368 by any conventional splitting method.

In several alternate embodiments, the resilient couplings 512,904, and 1306 as described above with reference to Figs. 5B, 9B and 13B, further electrically couple the respective sensors 504,902, and 1304 to the housings 502, 602,1302, and 1402, as described above with reference to Figs. 5B, 9B and 13B, and 14B.

In several alternate embodiments, the housings 502,602,1302, and 1402, as described above with reference to Figs. 5A, 6A, 13A, and 14A, are any conventional substrate.

In several alternate embodiments, the sensor packages 405 size is reduced by vertically stacking the components of the sensor packages 405.

In several alternate embodiments, the sensor packages 405 performance is improved by reducing the communication path length between the controller assembly 508 and the sensors 504,902, and 1304, as substantially described above with reference to Figs. 5A through 27B. The performance improvement may be, for example, reduced parasitic capacitance, resistance, or inductance.

Although illustrative embodiments of the invention have been shown and described, a wide range of modification, changes and substitution is contemplated in the foregoing disclosure. In some instances, some features of the present invention may be employed without a corresponding use of the other features. Accordingly, it is appropriate that the appended claims be construed broadly and in a manner consistent with the scope of the invention.