Title:
INTERPOSER, MANUFACTURING METHOD THEREFOR, AND CIRCUIT BOARD ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2021/056427
Kind Code:
A1
Abstract:
An interposer for connecting two circuit boards, comprising: an inner layer (10), an outer layer (20) and a protective layer (50). The inner layer (10) comprises a first base layer (11) and a first circuit layer (131) formed on a surface of the first base layer (11). The outer layer (20) comprises a second base layer (21) and a second circuit layer (231) formed on a surface of the second base layer (21). The second base layer (21) overlays the first circuit layer (131). An end of at least one circuit of the first circuit layer (131) and the second circuit layer (231) extends to a side of the interposer (100), and an end of another circuit extends to the other side of the interposer (100). The first circuit layer (131) is electrically connected to the second circuit layer (231) by means of a conductive blind hole (41), forming a communication path from one side of the interposer (100) to the other side thereof so as to connect two circuit boards. The protective layer (50) overlays an outer side of the second circuit layer (231).
Inventors:
PENG MANZHI (CN)
LIU RUIWU (CN)
XIONG SI (CN)
GAO LINJIE (CN)
LIU RUIWU (CN)
XIONG SI (CN)
GAO LINJIE (CN)
Application Number:
PCT/CN2019/108587
Publication Date:
April 01, 2021
Filing Date:
September 27, 2019
Export Citation:
Assignee:
QING DING PREC ELECTRONICS HUAIAN CO LTD (CN)
AVARY HOLDING SHENZHEN CO LTD (CN)
AVARY HOLDING SHENZHEN CO LTD (CN)
International Classes:
H05K3/42; H05K1/11
Foreign References:
| CN102202463A | 2011-09-28 | |||
| US20150257261A1 | 2015-09-10 | |||
| JP2015115514A | 2015-06-22 | |||
| CN102573289A | 2012-07-11 |
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
Download PDF: