Title:
INTERPOSER AND SUBSTRATE MODULE
Document Type and Number:
WIPO Patent Application WO/2022/004179
Kind Code:
A1
Abstract:
According to the present invention, a plurality of metal members are arranged at a distance from each other within a resin layer. The lengths of the plurality of metal members in the vertical direction are longer than the lengths of the plurality of metal members in a direction that is perpendicular to the vertical direction. At least some of the plurality of metal members electrically connect a first electrode and a second electrode to each other by being stuck in the first electrode without being chemically bonded to the first electrode, and being stuck in the second electrode without being chemically bonded to the second electrode.
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Inventors:
MARUYAMA YUICHI (JP)
Application Number:
PCT/JP2021/019129
Publication Date:
January 06, 2022
Filing Date:
May 20, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01B5/16; H01R11/01; H05K1/14
Foreign References:
| JP2001511602A | 2001-08-14 | |||
| JPS6293870A | 1987-04-30 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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