Title:
INTERPOSER
Document Type and Number:
WIPO Patent Application WO/2023/008111
Kind Code:
A1
Abstract:
An interposer (401) comprises a first surface (1a) as a mounting surface, and a second surface (1b) which is a surface opposite the first surface (1a) for mounting an object. The interposer (401) is provided with: a first component (31) that has an electrode directly exposed on the first surface (1a), or that is contained and connected to the first surface (1a) via a conductor; a second component (32) that is disposed in contact with, and overlapping, the first component (31) on the second surface (1b) side of the first component (31), and that has an electrode directly exposed on the second surface (1b) or is contained and connected to the second surface (1b) via a conductor; and a sealing resin layer (6) sealing the first component (31) and the second component (32).
Inventors:
OTSUBO YOSHIHITO (JP)
SASAKI YUTAKA (JP)
SASAKI YUTAKA (JP)
Application Number:
PCT/JP2022/026704
Publication Date:
February 02, 2023
Filing Date:
July 05, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/065; H01L25/07; H01L25/18
Foreign References:
| JP2018514088A | 2018-05-31 | |||
| US20130037950A1 | 2013-02-14 | |||
| JP2017063153A | 2017-03-30 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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