Title:
JET SOLDER BATH AND JET SOLDERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/131080
Kind Code:
A1
Abstract:
The present invention curbs unsoldered areas by the ample wetting of a molten solder within a through hole of a substrate, even where an electronic component requiring a high heat capacity is being soldered onto the substrate. A jet solder bath 20 for soldering by jetting molten solder S and bringing same into contact with a substrate 5, the jet solder bath being provided with: a primary jet nozzle 30 serving as a first jet nozzle for using a first jet pump to jet the molten solder; and a secondary jet nozzle 40 serving as a second jet nozzle that is arranged on a downstream side of the primary jet nozzle 30 with respect to a direction of conveyance of the substrate 5 and uses a second jet pump to jet molten solder. The primary jet nozzle 30 is provided with a first nozzle body section 30A, and a first solder flow formation plate 32 that is provided to an upper end of the first nozzle body section 30A and comprises a plurality of jet holes 32b. The secondary jet nozzle 40 is provided with a second nozzle body section 40A, and a second solder flow formation plate 42 that is provided to an upper end of the second nozzle body section 40A and comprises a plurality of jet holes 42b.
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Inventors:
SUGIHARA TAKASHI (JP)
NAGATA KANAME (JP)
NAGATA KANAME (JP)
Application Number:
PCT/JP2018/045237
Publication Date:
July 04, 2019
Filing Date:
December 10, 2018
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
H05K3/34; B23K1/08; B23K3/00; B23K31/02
Foreign References:
| JP2005177845A | 2005-07-07 | |||
| JPH0489176A | 1992-03-23 | |||
| JPH0513661U | 1993-02-23 | |||
| JPH07202409A | 1995-08-04 | |||
| JP4410490B2 | 2010-02-03 | |||
| JP4729453B2 | 2011-07-20 | |||
| JPH07202409A | 1995-08-04 |
Other References:
See also references of EP 3735113A4
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
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