Title:
JET SOLDER BATH
Document Type and Number:
WIPO Patent Application WO/2007/116853
Kind Code:
A1
Abstract:
[PROBLEMS] Conventional jet solder baths using screw pumps have a problem that molten
solder jetted from a jet nozzle pulsates up and down. The pulsation in the screw
pump is due to a reverse flow caused by a wide gap between the screw pump and the casing.One
possible solution for this problem is to narrow the gap; however, doing so causes
contact between the screw pump and the casing when the screw pump is eccentric.
[MEANS FOR SOLVING PROBLEMS] In the jet solder bath of the invention, the diameter
of an inflow hole at the lower part of a casing is set smaller than the diameter of
a screw pump to prevent a back flow even if the gap between the screw pump and the
casing is large. Also, a diverging guide wall is provided at an outflow opening
of the casing to stabilize the flow of solder.
Inventors:
ZEN MITSUO (JP)
ICHIKAWA HIROKAZU (JP)
OZAWA SATOSHI (JP)
ICHIKAWA HIROKAZU (JP)
OZAWA SATOSHI (JP)
Application Number:
PCT/JP2007/057375
Publication Date:
October 18, 2007
Filing Date:
April 02, 2007
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
ZEN MITSUO (JP)
ICHIKAWA HIROKAZU (JP)
OZAWA SATOSHI (JP)
ZEN MITSUO (JP)
ICHIKAWA HIROKAZU (JP)
OZAWA SATOSHI (JP)
International Classes:
B23K1/08; B23K3/06; H05K3/34; B23K101/42
Foreign References:
| JPH0619968U | 1994-03-15 | |||
| JPS6387293U | 1988-06-07 | |||
| JPH01114165U | 1989-08-01 | |||
| JPS4819425Y1 | 1973-06-02 | |||
| JPS4898520U | 1973-11-21 | |||
| JPS4855025U | 1973-07-14 | |||
| JPS50148327U | 1975-12-09 | |||
| JPS513632U | 1976-01-12 | |||
| JPS62259665A | 1987-11-12 | |||
| JP2005028446A | 2005-02-03 |
Other References:
See also references of EP 2022590A4
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