JET SOLDER BATH

WIPO Patent Application WO/2010/087341

A1

The height of molten solder which is jetted from the tip of a nozzle is made uniform. A bath body (2) contains molten solder (20), a pump pressure-feeds the molten solder (20) contained in the bath body (2), a first duct (4) guides the molten solder (20) pressure-fed by the pump in the inflow direction (P1), a direction changing section (9) changes the inflow direction (P1) of the molten solder (20) which is guided by the first duct (4) to the inflow direction (P2), and a second duct (5) guides the molten solder (20) which is changed to the inflow direction (P2) by the direction changing section (9) to a nozzle body (6) in the inflow direction (P3).  Since the direction changing section (9) prevents generation of turbulence of the molten solder (20) when the inflow direction (P1) of the molten solder (20) is changed to the inflow direction (P2) by the direction changing section (9), the current velocity and flow rate of the molten solder (20) which is guided from the second duct (5) to the nozzle body (6) are stabilized.  As a result, the height of the molten solder (20) which is jetted from a nozzle mouth (3) can be made uniform.

ICHIKAWA HIROKAZU (JP)
HOSOKAWA KOUICHIRO (JP)
SUZUKI TAKASHI (JP)

PCT/JP2010/050981

August 05, 2010

January 26, 2010

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SENJU METAL INDUSTRY CO (JP)
ICHIKAWA HIROKAZU (JP)
HOSOKAWA KOUICHIRO (JP)
SUZUKI TAKASHI (JP)

H05K3/34; B23K1/08; B23K3/06

JPS561264A	1981-01-08
JP2000277903A	2000-10-06
JPS61126960A	1986-06-14
JP2003205363A	2003-07-22
JP2008030072A	2008-02-14
JP2003347720A	2003-12-05

YAMAGUCHI Kunio et al. (JP)
Kunio Yamaguchi (JP)

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