JET SOLDER HEIGHT CONFIRMATION JIG AND METHOD FOR HANDLING SAME

WIPO Patent Application WO/2018/123261

A1

Provided is a jet solder height confirmation jig with which the height of a jet wave of molten solder can be precisely adjusted. Also provided is a method for handling this jig. A jet solder height confirmation jig 100 is equipped with: a height confirmation unit 10 for confirming the height of a jet wave of molten solder 7; and insulating holding unit 20 that holds the height confirmation unit 10; a reporting unit 30 connected to the height confirmation unit; and a conductive bridging member 40 that has a length sufficient for bridging a gap between metal members 51 and 52 electrically connected to a container in which the molten solder 7 is stored, and that supports the height confirmation unit 10 so as to be capable of moving between the metal members 51 and 52. The height confirmation unit 10 is equipped with a conductive sliding member capable of sliding in a direction orthogonal to the lengthwise direction of the bridging member, and multiple conductive pins 12 provided below the sliding member. The multiple pins 12 are arranged such that the tip of each of the multiple pins 12 has a different height in the jet direction of the jet wave of the molten solder 7.

SUZUKI RYOICHI (JP)
KAWASHIMA YASUJI (JP)
KOMINE SHIGEO (JP)
SUGIHARA TAKASHI (JP)
HANZAWA HENRI (JP)

PCT/JP2017/039596

July 05, 2018

November 01, 2017

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SENJU METAL INDUSTRY CO (JP)

B23K1/08; B23K1/00; B23K3/06; H05K3/34; B23K101/42

JPH026163U	1990-01-16
JPH0461006U	1992-05-26
JPS6244223U	1987-03-17
JP2008053655A	2008-03-06
JPH095012A	1997-01-10

YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)

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