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Patent Searching and Data


Title:
JET TYPE SOLDERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2004/113008
Kind Code:
A1
Abstract:
A controller automatically starts an electromagnetic induction pump (14) in a predetermined timing after start of a heater (13), causing JOG jet flow of a solder (11) melted by the heater (13). Stirring by the electromagnetic induction pump (14) is started at the molten solder (11) to stimulate unmelted solder (11) to melt, so that melting of the solder can be completed in a relatively short time, thereby improving usability; making it possible to reduce the useless stand-by time lasting from the melting of the solder (11) to the start of the electromagnetic induction pump (14), to save trouble in observing the molten state of the solder (11) in a solder tank (12) or in starting the electromagnetic induction pump (14), and to reduce the time lasting until the solder (11) in the solder tank (12) becomes suitable for soldering.

Inventors:
OKANO TERUO (JP)
UCHIDA TOSHIYA (JP)
IIJIMA MASAKI (JP)
YOSHIDA SHUNICHI (JP)
Application Number:
PCT/JP2004/008713
Publication Date:
December 29, 2004
Filing Date:
June 21, 2004
Export Citation:
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Assignee:
TAMURA SEISAKUSHO KK (JP)
TAMURA FA SYSTEM KK (JP)
OKANO TERUO (JP)
UCHIDA TOSHIYA (JP)
IIJIMA MASAKI (JP)
YOSHIDA SHUNICHI (JP)
International Classes:
B23K1/08; B23K3/06; H05K3/34; (IPC1-7): B23K1/08
Domestic Patent References:
WO1997047422A11997-12-18
Foreign References:
JPS4997752A1974-09-17
Attorney, Agent or Firm:
Kabasawa, Joo (1-22 Shinjuku 3-chom, Shinjuku-ku Tokyo 22, JP)
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