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Patent Searching and Data


Title:
JIG ASSEMBLY FOR ELECTRONIC DEVICE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2024/039070
Kind Code:
A1
Abstract:
A jig assembly for an electronic device assembly comprises: a first plate having a first space on which a housing of an electronic device is seated; a second plate which can be stacked on the top of the first plate and has a second space in communication with a battery placement space formed in the housing when stacked on the top of the first plate; a plurality of guide structures which are connected to the second plate along the perimeter of the second space and guides a position at which a battery is seated in the battery placement space; and a third plate which can be stacked on the top of the second plate and is configured to press the battery against the housing while the battery is seated in the battery placement space. The guide structure may each comprise: a film member formed of a material having its own elastic force; and a fixing block which fixes the film member to the second plate so that at least a portion of the film member is bent in a direction toward the battery placement space.

Inventors:
KIM DUKSOO (KR)
PARK HANKIL (KR)
LEE SEUNGNAM (KR)
KWEON SANGHOON (KR)
Application Number:
PCT/KR2023/009587
Publication Date:
February 22, 2024
Filing Date:
July 06, 2023
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H04M1/02; H05K5/00
Foreign References:
KR102344317B12021-12-27
KR101623905B12016-05-24
KR20210104323A2021-08-25
KR102064224B12020-01-09
KR20210011154A2021-02-01
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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