JIG FOR HOLDING SUBSTRATES FOR PLATING TREATMENT USE, AND PLATING TREATMENT DEVICE

WIPO Patent Application WO/2020/250935

A1

[Problem] To provide: a jig for holding substrates for plating treatment use, which can hold a relatively large number of substrates while avoiding the contact between the substrates in a plating bath, has a simpler structure, and can prevent the formation of nodules from the substrates or the jig; and a plating treatment device. [Solution] A jig for holding substrates for plating treatment use according to the present invention is provided with: a main body rod part which has such an outer length that the main body rod part can be insert into an inner hole of a disc-shaped substrate along the axis direction; a movable piece which can come close to or move away from the main body rod part in an intersecting direction that intersects the axis direction; and a transfer mechanism which can move the movable piece relative to the main body rod part in the intersecting direction. In the jig, the movable piece can be positioned at a first position at which the movable piece is close to the main body rod part and can pass through the inner hole of the disc-shaped substrate together with the main body rod part and a second position which is located in the more external side than the first position as observed in the intersecting direction and at which the outer length in the jig for holding substrates for plating treatment use becomes larger than the diameter of the inner hole of the substrate.

OOI SATOSHI (JP)

PCT/JP2020/022861

December 17, 2020

June 10, 2020

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TOYO KOHAN CO LTD (JP)

C23C18/31; G11B5/738; G11B5/84

JPH11335857A	1999-12-07
JPH0790596A	1995-04-04
JP2005089773A	2005-04-07
JPH06306621A	1994-11-01
JP2002038275A	2002-02-06

OHTA PATENT AND TRADEMARK ATTORNEYS (JP)

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