Title:
COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/106226
Kind Code:
A1
Abstract:
This copper/ceramic joined body (10) comprises a copper member (12, 13) made of copper or a copper alloy, and a ceramic member (11). The copper member (12, 13) and the ceramic member (11) are joined together and an active metal compound layer (21) comprising an active metal compound is formed on the ceramic member (11) side at the joining interface between the ceramic member (11) and the copper member (12, 13). Microcracks (25) that advance toward the inner side of the ceramic member (11) from the joining interface are present in the ceramic member (11), and the active metal compound is filled into at least some of the microcracks (25).
Inventors:
SAKURAI AKIRA (JP)
TERASAKI NOBUYUKI (JP)
TERASAKI NOBUYUKI (JP)
Application Number:
PCT/JP2022/044561
Publication Date:
June 15, 2023
Filing Date:
December 02, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H05K3/38; C04B37/02; H01L23/12; H01L23/13; H01L23/15; H01L23/36; H05K1/03
Domestic Patent References:
| WO2014080536A1 | 2014-05-30 |
Foreign References:
| JP2018008869A | 2018-01-18 | |||
| JP2015180600A | 2015-10-15 | |||
| JP2018137396A | 2018-08-30 | |||
| JP2014101248A | 2014-06-05 | |||
| JP2001313453A | 2001-11-09 | |||
| JP2021200811A | ||||
| JP2022190220A | 2022-12-26 | |||
| JP3211856B2 | 2001-09-25 | |||
| JP5757359B2 | 2015-07-29 | |||
| JP2018008869A | 2018-01-18 | |||
| JP2009280494A | 2009-12-03 | |||
| JP5038565B2 | 2012-10-03 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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