Title:
JOINED BODY, AND METHOD AND APPARATUS FOR MANUFACTURING JOINED BODY
Document Type and Number:
WIPO Patent Application WO/2022/131066
Kind Code:
A1
Abstract:
This bonded body comprises: a first substrate; a second substrate; an inorganic film for bonding the first substrate and the second substrate; and a semiconductor layer formed on a surface opposite to a bonding surface of the second substrate. The first substrate is a glass having a SiO2 content of at most 70 mol%. The inorganic film includes a silicon oxide film formed on a bonding surface of the first substrate.
Inventors:
NAGAO YOHEI (JP)
SOMEYA TAKENORI (JP)
SOMEYA TAKENORI (JP)
Application Number:
PCT/JP2021/044853
Publication Date:
June 23, 2022
Filing Date:
December 07, 2021
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
B32B9/00; B32B3/30; B32B7/022; B32B9/04; B32B17/06; C03C27/10; C04B37/04; H01L33/58
Domestic Patent References:
| WO2020175396A1 | 2020-09-03 |
Foreign References:
| JP2010050444A | 2010-03-04 | |||
| JP2015012244A | 2015-01-19 | |||
| JP2005093970A | 2005-04-07 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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