JOINING MEMBER, SOLDER MATERIAL, SOLDER PASTE, FOAM SOLDER, FLUX COATING MATERIAL, AND SOLDER JOINT

Title:

JOINING MEMBER, SOLDER MATERIAL, SOLDER PASTE, FOAM SOLDER, FLUX COATING MATERIAL, AND SOLDER JOINT

Document Type and Number:

WIPO Patent Application WO/2016/104658

Kind Code:

A1

Abstract:

Provided are a high-sphericity joining member, a solder material, a solder paste, a foam solder, a flux coating material, and a solder joint. This Ni-plated Cu ball 10 is provided with a Cu ball 12, and an Ni plating layer 14 covering the Cu ball 12. The Ni plating layer 14 contains a gloss agent, and has a crystal grain average grain diameter of 1 μm or smaller. The Ni-plated Cu ball 10 has a spherical diameter of 1-230 μm, and a sphericity of 0.95 or greater. By including a gloss agent in the Ni plating layer 14, the surface of the Ni-plated Cu ball 10 can be smoothed, and a sphericity of 0.95 or greater can be achieved. In so doing, the Cu nucleus ball 10 can be prevented from shifting out of position when placed on an electrode, and degradation of self-alignment properties prevented.

Inventors:

KAWASAKI HIROYOSHI (JP)
KONDO SHIGEKI (JP)
IKEDA ATSUSHI (JP)
ROPPONGI TAKAHIRO (JP)
HAGIWARA TAKASHI (JP)
SOMA DAISUKE (JP)
TSURUTA KAICHI (JP)
SATO ISAMU (JP)
KAWAMATA YUJI (JP)

Application Number:

PCT/JP2015/086136

Publication Date:

June 30, 2016

Filing Date:

December 24, 2015

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SENJU METAL INDUSTRY CO (JP)

International Classes:

B22F1/102; B22F1/17; B23K1/00; B23K3/06; B23K35/22; B23K35/26; C22C9/00; C22C13/00; B22F1/18; B23K101/40

Domestic Patent References:

WO2014203348A1

2014-12-24

Foreign References:

JP5585750B1	2014-09-10
JP5585751B1	2014-09-10
JPH0617258A	1994-01-25
JP2013089913A	2013-05-13
JP2007125610A	2007-05-24

Other References: