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Patent Searching and Data


Title:
JOINING AND SEPARATION METHOD FOR ADHERENDS
Document Type and Number:
WIPO Patent Application WO/2020/067222
Kind Code:
A1
Abstract:
The present invention pertains to a bonding and separation method for adherends, including: a first bonding step in which an adhesive sheet including at least an adhesive layer containing an electrolyte is bonded to a first adherend; a first voltage application step in which, in a state in which the adhesive layer containing the electrolyte is joined to the first adherend, voltage is applied to the adhesive layer containing the electrolyte such that a potential difference is generated in the thickness direction of the adhesive layer containing the electrolyte; a first separation step in which the adhesive sheet and the first adherend are separated; and a second bonding step in which the adhesive sheet separated from the first adherend in the first separation step is bonded to a second adherend.

Inventors:
AWANE RYO (JP)
HIRAO AKIRA (JP)
AKAMATSU KAORI (JP)
MIZOBATA KAORI (JP)
Application Number:
PCT/JP2019/037720
Publication Date:
April 02, 2020
Filing Date:
September 25, 2019
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J5/00; C09J7/38; C09J11/06; C09J201/00; H01L21/304
Domestic Patent References:
WO2018159784A12018-09-07
WO2007018239A12007-02-15
Foreign References:
JP2017095590A2017-06-01
JP2017075289A2017-04-20
JP2010037355A2010-02-18
JP2014189671A2014-10-06
JP2010037354A2010-02-18
JP6097112B22017-03-15
JP4139851B22008-08-27
JP2018184635A2018-11-22
Other References:
"Polymer Handbook", 1989, JOHN WILEY & SONS, INC
See also references of EP 3858929A4
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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