Title:
JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR JOINING ELECTRONIC PART
Document Type and Number:
WIPO Patent Application WO/2015/056589
Kind Code:
A1
Abstract:
[Problem] To provide a joining silver sheet attaining high joining strength at a low pressure of 3 MPa or less. [Solution] A joining silver sheet in which silver particles measuring 1-250 nm in diameter are sintered together into an integrated whole, wherein the joining silver sheet is provided with a property by which sintering progresses further when the joining silver sheet is heated to and held at a temperature of T3A to TB (°C) satisfying the relation 270≤TA
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Inventors:
KURITA SATORU (JP)
ENDOH KEIICHI (JP)
MIYOSHI HIROMASA (JP)
ENDOH KEIICHI (JP)
MIYOSHI HIROMASA (JP)
Application Number:
PCT/JP2014/076660
Publication Date:
April 23, 2015
Filing Date:
October 06, 2014
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
H01B5/02; B22F1/054; B22F1/107; B22F3/10; B22F5/10; B22F9/00; H01B5/14; H01B13/00; H01L21/52
Domestic Patent References:
| WO2012169076A1 | 2012-12-13 |
Foreign References:
| JPS63186434A | 1988-08-02 | |||
| JP2008212976A | 2008-09-18 | |||
| JP2007083288A | 2007-04-05 | |||
| JP2005205696A | 2005-08-04 |
Other References:
See also references of EP 3059740A4
Attorney, Agent or Firm:
KOMATSU TAKASHI (JP)
Komatsu Quantity (JP)
Komatsu Quantity (JP)
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