Title:
JOINT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/261821
Kind Code:
A1
Abstract:
Provided is a joint structure having excellent thermal shock resistance and a high joint strength. A joint structure according to an embodiment of the present invention is provided with: a first member that is made of a metal material and has a plurality of holes formed in the surface thereof and having opening diameters of 30-100 μm; a third member that is made of a thermoplastic resin or a metal material which is the same as or different from that of the first member and that has a plurality of independent holes formed in the surface thereof and having opening diameters of 3-100 μm; and a second member that is made of a curable resin and joins the surface in which the holes of the first member are formed and the surface in which the holes of the third member are formed.
Inventors:
SATO DAISUKE (JP)
Application Number:
PCT/JP2020/019853
Publication Date:
December 30, 2020
Filing Date:
May 20, 2020
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
F16B5/08; B23K26/382; B29C65/48; B32B7/12; B32B15/08; B32B15/092; F16B11/00
Domestic Patent References:
| WO2011071061A1 | 2011-06-16 | |||
| WO2015008771A1 | 2015-01-22 | |||
| WO2016133079A1 | 2016-08-25 |
Foreign References:
| JP2008087409A | 2008-04-17 | |||
| JP2010113938A | 2010-05-20 | |||
| JP2004153018A | 2004-05-27 | |||
| JP2015213961A | 2015-12-03 |
Other References:
See also references of EP 3992473A4
Attorney, Agent or Firm:
MURAKAMI, Takashi (JP)
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