Title:
LAMINATE AND APPLICATION THEREFOR
Document Type and Number:
WIPO Patent Application WO/2015/030031
Kind Code:
A1
Abstract:
Provided is a laminate that, when a member-to-be-treated is mechanically or chemically treated, can temporarily support the member-to-be-treated by means of high adhesive force and can easily release the temporary support of the member-to-be-treated without doing damage to the member-to-be-treated. Also provided are a composition for formation of a protective layer, an adhesive layer precursor or a composition for formation of an adhesive layer, and a kit for the laminate. A laminate that has, in order upon a support body (A), an adhesive layer precursor (B), a protective layer (C), and a device wafer (D). The adhesive layer precursor (B) contains a polymerizable monomer and/or a polymerizable oligomer (b-1), and the polymerization rate of the polymerizable monomer and/or the polymerizable oligomer is 10%-70%.
Inventors:
IWAI YU (JP)
KOYAMA ICHIRO (JP)
KOYAMA ICHIRO (JP)
Application Number:
PCT/JP2014/072369
Publication Date:
March 05, 2015
Filing Date:
August 27, 2014
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/304; B32B27/28; C09J4/00; C09J11/06; C09J11/08
Domestic Patent References:
| WO2013105582A1 | 2013-07-18 |
Foreign References:
| JP2012524399A | 2012-10-11 | |||
| JPH11315259A | 1999-11-16 | |||
| JP2007284577A | 2007-11-01 | |||
| JP2012156377A | 2012-08-16 | |||
| JP2011204793A | 2011-10-13 | |||
| JP2006508540A | 2006-03-09 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
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