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Patent Searching and Data


Title:
LAMINATE BODY, EPOXY FILM AND WOUND BODY
Document Type and Number:
WIPO Patent Application WO/2023/063155
Kind Code:
A1
Abstract:
This laminate body is provided at least with an epoxy resin layer, which is obtained by curing an epoxy resin composition that contains an epoxy resin (A) and an isocyanate compound (B), and a separation film. The epoxy resin (A) contains substantially no tri- or more functional epoxy resin, and when measuring the epoxy resin layer with DSC measurement, the temperature is increased to 20-250°C at 10°C/min, is then is decreased to 0°C at 10°C/min and is again increased to 0-250°C at 10°C/min, and the difference (T2-T1) between the glass transition temperature (T2) when increasing the temperature the second time and the glass transition temperature (T1) when increasing the temperature (T1) the first time is within 3°C. An epoxy film can be achieved with good productivity and without problems occurring in post-processing.

Inventors:
MITSUTA YOSHITSUGU (JP)
TAMURA MAKOTO (JP)
SHIOTA RYUNOSUKE (JP)
MIWA YASUSHI (JP)
MOMOHIRA SATORU (JP)
DOI IORI (JP)
Application Number:
PCT/JP2022/037015
Publication Date:
April 20, 2023
Filing Date:
October 03, 2022
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
B32B27/38; B32B27/26; C08G59/22; C08G59/62; C08J5/18
Domestic Patent References:
WO2018207914A12018-11-15
Foreign References:
JPH11236537A1999-08-31
JPH06306140A1994-11-01
JPH10147765A1998-06-02
JP2015217359A2015-12-07
JP2021009924A2021-01-28
JPH10183076A1998-07-07
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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