Title:
LAMINATE COMPRISING LOW DIELECTRIC CONSTANT ADHESIVE LAYER
Document Type and Number:
WIPO Patent Application WO/2016/185956
Kind Code:
A1
Abstract:
Provided is a laminate which has superior low dielectric constant characteristics, which exhibits excellent adhesion between metal substrates and not only conventional polyimide and polyester film substrates, but also low polarity resin substrates such as LCP, and which enables high solder heat resistance. This laminate (Z), in which a resin substrate and a metal substrate are layered via an adhesive layer comprising a carboxyl group-containing polyolefin resin (A), is characterized in that: 1.) the dielectric constant (εc) of the adhesive layer is at most 3.0 at a frequency of 1MHz; 2.) the dielectric loss tangent (tanδ) of the adhesive layer is at most 0.02 at a frequency of 1MHz; 3.) the peel strength of the resin substrate and the metal substrate is at least 0.5N/mm; and 4.) the moist solder heat resistance of the laminate (Z) is at least 240℃.
Inventors:
MIKAMI TADAHIKO (JP)
ITO TAKESHI (JP)
SONODA RYO (JP)
SAKATA HIDEYUKI (JP)
ITO TAKESHI (JP)
SONODA RYO (JP)
SAKATA HIDEYUKI (JP)
Application Number:
PCT/JP2016/063952
Publication Date:
November 24, 2016
Filing Date:
May 11, 2016
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C09J201/00; B32B15/08; B32B27/00; C09J123/26; C09J125/08; C09J163/00; C09J179/00
Foreign References:
| JP2002235061A | 2002-08-23 | |||
| JP2000104025A | 2000-04-11 | |||
| JP2000345132A | 2000-12-12 | |||
| JPH1060401A | 1998-03-03 |
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