Title:
LAMINATE, CURED PRODUCT, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/262405
Kind Code:
A1
Abstract:
Provided are a laminate, etc., having excellent laser beam perforating workability and reflow resistance, and having an ultrathin copper foil and a resin layer of which a cured product has low dielectric loss tangent. The laminate is characterized by having at least a carrier foil, an ultrathin copper foil having a thickness of 0.1-6 μm, and a resin layer in this order, wherein the resin layer includes (A) an epoxy resin, (B) a compound having an active ester group, and (C) an inorganic filler.
Inventors:
YAMOTO KAZUHISA (JP)
AOYAMA YOSHITOMO (JP)
MIYABE HIDEKAZU (JP)
AOYAMA YOSHITOMO (JP)
MIYABE HIDEKAZU (JP)
Application Number:
PCT/JP2020/024665
Publication Date:
December 30, 2020
Filing Date:
June 23, 2020
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
B32B15/08; B32B15/092; H05K1/03
Domestic Patent References:
| WO2016098488A1 | 2016-06-23 |
Foreign References:
| JP2018145409A | 2018-09-20 | |||
| JP2018002886A | 2018-01-11 | |||
| JP2013075948A | 2013-04-25 | |||
| JP2014189751A | 2014-10-06 |
Attorney, Agent or Firm:
HONDA Ichiro (JP)
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