Title:
LAMINATE FILM AND PACKAGING BAG USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/027885
Kind Code:
A1
Abstract:
This laminate film (30) is configured from a substrate layer (20) and a heat seal layer (10) that comprises a resin composition containing: (A) 20-95 parts by weight of a propylene polymer that has a melting point (Tm) of 120-170 °C as measured by differential scanning calorimetry (DSC); and a total of 5-80 parts by weight of two or more copolymers selected from the group consisting of (B) a propylene-1-butene copolymer containing 51-95 mol% of a unit derived from propylene and 5-49 mol% of a unit derived from 1-butene (wherein the total of the unit derived from propylene and the unit derived from 1-butene is 100 mol%), (C) a copolymer of ethylene and an α-olefin having 3-20 carbon atoms, and (D) a copolymer of 1-butene and an α-olefin having 3 carbon atoms or 5-20 carbon atoms, said copolymer containing 50-99 mol% of a constituent unit derived from 1-butene and 1-50 mol% of a constituent unit derived from an α-olefin having 3 carbon atoms or 5-20 carbon atoms (wherein the total of the unit derived from 1-butene and the total of the unit derived from the α-olefin is 100 mol%). Each of the (B) component, the (C) component, and the (D) component does not correspond to the (A) component, and the total amount of the (A) component, the (B) component, the (C) component, and the (D) component is 100 parts by weight. The laminate film (30) is characterized in that the wetting tension of the surface of the heat seal layer (10) that is on the opposite surface from the substrate layer (20) is 32-45 mN/m.
Inventors:
OKU TATSUYA (JP)
ABE TOMOHIRO (JP)
IKEDA SATOSHI (JP)
NODA KIMINORI (JP)
EGAWA MAKOTO (JP)
ABE TOMOHIRO (JP)
IKEDA SATOSHI (JP)
NODA KIMINORI (JP)
EGAWA MAKOTO (JP)
Application Number:
PCT/JP2015/073509
Publication Date:
February 25, 2016
Filing Date:
August 21, 2015
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
B32B27/32; B29C48/21; B29C48/49; B29C55/12; B32B27/00; B65D30/02; B65D65/40; C08F210/02; B29K23/00; B29L9/00
Domestic Patent References:
| WO2013180710A1 | 2013-12-05 |
Foreign References:
| JP2005307112A | 2005-11-04 | |||
| JP2003182007A | 2003-07-03 | |||
| JP2011173658A | 2011-09-08 |
Other References:
See also references of EP 3196016A4
Attorney, Agent or Firm:
HAYAMI SHINJI (JP)
Shinji Hayami (JP)
Shinji Hayami (JP)
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