Title:
LAMINATE FOR FLEXIBLE CIRCUIT BOARD HAVING LOW DIELECTRIC CONSTANT AND LOW-LOSS CHARACTERISTIC
Document Type and Number:
WIPO Patent Application WO/2021/177704
Kind Code:
A1
Abstract:
The present invention relates to a laminate for a flexible circuit board. A laminate for a flexible circuit board, according to an embodiment of the present invention, comprises: a dielectric in which an inorganic filler having a dielectric constant (Dk) of 15 or less is mixed with a fluorine resin composed of a tetrafluoroethylene (TFE) monomer in an amount of 45 to 75 wt% on the basis of the total content of the dielectric, to have a dielectric constant of 3.0 or less and a signal loss factor (Df) of 0.002 or less; and a copper foil laminated on both sides of the dielectric.
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Inventors:
OH SEI CHOONG (KR)
KANG JEONG AN (KR)
SIM SUNG GI (KR)
LIM YONG MOOK (KR)
CHOI JI SOOK (KR)
KANG JEONG AN (KR)
SIM SUNG GI (KR)
LIM YONG MOOK (KR)
CHOI JI SOOK (KR)
Application Number:
PCT/KR2021/002573
Publication Date:
September 10, 2021
Filing Date:
March 02, 2021
Export Citation:
Assignee:
KOREA TACONIC CO LTD (KR)
International Classes:
H05K1/03; C08K7/18; C08L27/18; H01B3/44; H05K1/09
Domestic Patent References:
| WO2018043683A1 | 2018-03-08 |
Foreign References:
| KR20130118417A | 2013-10-30 | |||
| US20060041076A1 | 2006-02-23 | |||
| KR20150000654A | 2015-01-05 | |||
| KR102145067B1 | 2020-08-18 |
Attorney, Agent or Firm:
MOA INTELLECTUAL PROPERTY LAW FIRM (KR)
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