Title:
LAMINATE, KIT, WATER SOLUBLE RESIN COMPOSITION, INTERMEDIATE LAYER-FORMING COMPOSITION, AND PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/163858
Kind Code:
A1
Abstract:
The present invention pertains to a laminate including a water soluble resin layer, an intermediate layer, and a photosensitive layer, in said order. The photosensitive layer comprises a photosensitive resin composition. The photosensitive resin composition includes a solvent. The dissolution rate of the intermediate layer relative to the solvent included in the photosensitive resin composition is no more than 1%. The intermediate layer comprises an intermediate layer-forming composition and the intermediate layer-forming composition includes a solvent. The dissolution rate of the water soluble resin layer relative to the solvent included in the intermediate layer is no more than 1%. The present invention also pertains to a kit related to said laminate, a water soluble resin composition, an intermediate layer-forming composition, and a photosensitive resin composition.
Inventors:
MASUDA SEIYA (JP)
Application Number:
PCT/JP2019/006426
Publication Date:
August 29, 2019
Filing Date:
February 21, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/11; B32B25/08; B32B27/24; G03F7/023; G03F7/038; G03F7/039
Foreign References:
| JP2010237560A | 2010-10-21 | |||
| JP2017120435A | 2017-07-06 | |||
| JP2014098889A | 2014-05-29 | |||
| JP2016532884A | 2016-10-20 | |||
| US20140057204A1 | 2014-02-27 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
Download PDF: