Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LAMINATE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/056298
Kind Code:
A1
Abstract:
[Problem] The purpose of the present invention is to provide a laminate which, on a substrate, comprises a gel layer which, before curing, has excellent heat resistance, a low elastic coefficient, low stress, excellent stress buffering and flexibility, is soft and has excellent holdability of electronic components, etc., and which, after curing, changes to a hard cured layer which has better shape retention than before curing and excellent releasability; and to provide a manufacturing method of said laminate. A further purpose of the present invention is to provide an electronic component manufacturing method which is not prone to cause problems such as that of deposits of the silicone gel, or cured product thereof, on the substrate or electronic component, and which is not prone to cause problems such as defects in electronic components or defective products. [Solution] A laminate provided with a curing reactive silicone gel layer on at least one type of substrate, and a use thereof.

Inventors:
FUKUI HIROSHI (JP)
TOYAMA KYOKO (JP)
DOGEN RYOTA (JP)
USHIO YOSHITO (JP)
Application Number:
PCT/JP2017/033870
Publication Date:
March 29, 2018
Filing Date:
September 20, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DOW CORNING TORAY CO LTD (JP)
International Classes:
B32B27/00; C09J183/04; H01L21/301; H01L23/29; H01L23/31
Domestic Patent References:
WO2012140740A12012-10-18
WO2015079904A12015-06-04
WO2015155950A12015-10-15
Foreign References:
JP2002275450A2002-09-25
JP2014534296A2014-12-18
JP2008045091A2008-02-28
JPS60196956A1985-10-05
JPS59204259A1984-11-19
JPS6148945A1986-03-10
JPS62104145A1987-05-14
JP2003213132A2003-07-30
JP3865638B22007-01-10
JP2012017458A2012-01-26
JP5594232B22014-09-24
JP5794229B22015-10-14
JP2011153249A2011-08-11
JP2007191629A2007-08-02
JP4628270B22011-02-09
JP2016124967A2016-07-11
Other References:
See also references of EP 3517292A4
Download PDF: