Title:
LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/142750
Kind Code:
A1
Abstract:
Provided is a laminate which is provided with a support base material having a hydroxy group on the surface thereof, a silicone resin layer having a hydroxy group, and a substrate in this order, wherein the substrate is a polyimide resin substrate or a laminated substrate having at least one layer of a polyimide resin substrate and at least one layer of a gas barrier film, and the peeling strength between the silicone resin layer and the substrate is greater than the peeling strength between the support base material and the silicone resin layer. This laminate can suppress the silicone resin layer from adhering to the substrate when the substrate is peeled off from the silicone resin layer and the support base material.
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Inventors:
YAMADA KAZUO (JP)
TERUI HIROTOSHI (JP)
YAMAUCHI MASARU (JP)
TERUI HIROTOSHI (JP)
YAMAUCHI MASARU (JP)
Application Number:
PCT/JP2019/000797
Publication Date:
July 25, 2019
Filing Date:
January 11, 2019
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
B32B27/34; B32B9/00
Foreign References:
| JP2008248236A | 2008-10-16 | |||
| JP2009510216A | 2009-03-12 | |||
| JP2017139322A | 2017-08-10 | |||
| JP2016094587A | 2016-05-26 | |||
| JP2012031316A | 2012-02-16 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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