Title:
LAMINATE, METHOD FOR MANUFACTURING SUBSTRATE HAVING TO-BE-PLATED LAYER, AND METHOD FOR MANUFACTURING CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2020/196079
Kind Code:
A1
Abstract:
The present invention provides: a laminate having a to-be-plated precursor layer; a method for manufacturing a substrate having a to-be-plated layer; and a method for manufacturing a conductive film, wherein a patterned to-be-plated layer formed from the to-be-plated precursor layer can be thinned, and cracking and peeling during the thermal deformation of the patterned to-be-plated layer can be suppressed. This laminate comprises: a transparent substrate; a to-be-plated precursor layer disposed on one surface-side of the transparent substrate and containing a photopolymerization initiator; and an anti-halation layer releasably disposed on the other surface-side of the transparent substrate, wherein the to-be-plated precursor layer has a functional group capable of interacting with a plating catalyst or a precursor thereof, and a polymerizable group.
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| WO/2016/147959 | GAS BARRIER FILM |
| WO/2005/020655 | ELECTROMAGNETIC SHIELDING MULTILAYER BODY AND DISPLAY USING SAME |
| WO/2005/079202 | CONDUCTIVE COATING WITH OXIDATIVE STABILITY |
Inventors:
ICHIKI TAKAHIKO (JP)
Application Number:
PCT/JP2020/011628
Publication Date:
October 01, 2020
Filing Date:
March 17, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B9/00; B32B7/023; B32B27/26; C23C18/16; C23C18/20; C23C18/30; G06F3/041; G06F3/044; H01B5/14; H01B13/00
Foreign References:
| JP2016213435A | 2016-12-15 | |||
| JP2015161708A | 2015-09-07 | |||
| JP2010204214A | 2010-09-16 | |||
| JP2008224916A | 2008-09-25 | |||
| JPH0543147U | 1993-06-11 | |||
| JP2009509292A | 2009-03-05 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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