LAMINATE, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING DEVICE STRUCTURE USING SAME

WIPO Patent Application WO/2012/141248

A1

The present invention addresses the problem of providing a laminate of a polyimide film, which will serve as a base for laminating a variety of devices, and a substrate, the laminate being one with which there is no peeling, even during the high-temperature processes used to produce devices, but the polyimide film can be easily peeled from the substrate after a device has been produced on the polyimide film. The method for producing a laminate of the invention is a method for producing a laminate formed from at least a substrate (1) and a polyimide film (6), whereby using a film obtained by plasma treatment of at least the surface facing the substrate as the polyimide film (6), coupling agent treatment is performed on at least one of the surfaces facing the substrate 1 and the polyimide film (6) to form a coupling treatment layer (2), deactivation treatment is performed on a portion of the coupling treatment layer (2) to form a pre-determined pattern, and then pressing and heating are performed with the substrate (1) and polyimide film (6) overlapping.

OKUYAMA TETSUO (JP)
OUYA KAZUYUKI (JP)
TSUCHIYA TOSHIYUKI (JP)
WATANABE NAOKI (JP)
MAEDA SATOSHI (JP)

PCT/JP2012/060020

October 18, 2012

April 12, 2012

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TOYO BOSEKI (JP)
OKUYAMA TETSUO (JP)
OUYA KAZUYUKI (JP)
TSUCHIYA TOSHIYUKI (JP)
WATANABE NAOKI (JP)
MAEDA SATOSHI (JP)

B32B27/34; B29C65/02; B29K79/00

WO2010071145A1

2010-06-24

JP2010283262A	2010-12-16
JP2011011455A	2011-01-20

UEKI, Kyuichi et al. (JP)
Hisakazu Ueki (JP)

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